Abstract:
A method of fabricating an electronic apparatus having an active region and a peripheral region surrounding the active region is described. A first main device and a second main device are provided. An optical clear liquid adhesive (OCLA) is applied between the first main device and the second main device and within the active region. A photo-mask having a transparent region and an opaque region is provided above the second main device, and the transparent region corresponds to the peripheral region. An OCLA diffusion process is performed such that the OCLA diffuses from the active region to the peripheral region. During the OCLA diffusion process, a first irradiating process with the photo-mask is performed, such that the OCLA diffusing to the peripheral region is partially cured. After removing the photo-mask, a second irradiating process is performed, such that the OCLA is completely cured.
Abstract:
Cancer-targeting peptides having a PX1LX2 motif, in which X1 is His or an amino acid residue with a hydrophobic side chain and X2 is Pro, Phe, or Trp. Also disclosed herein are conjugates containing the cancer-targeting peptides and uses thereof in cancer treatment and diagnosis.
Abstract:
A reticle POD, comprising a top cover, a bottom cover, and a plurality of supporting components deployed in the four corners of the bottom cover, the supporting component comprising: a base body perpendicularly assembled, on two sides of which being disposed with mounting blocks; a pair of elastic elements respectively placed on the base body; a pair of leading elements connecting respectively to the horizontal extension of the elastic elements and then extending lengthwise to form a tip, a first bevel and a second bevel being formed on the side of the tip located on the inner side of the base body; a supporting base plate, the first and the second ends of which being connected to the second bevel of the leading element and a supporting pillar being disposed on the third end of the supporting base plate.
Abstract:
This invention is about a gas filling apparatus for filling a gas into a storage apparatus for storing a semiconductor element or a reticle. The gas filling apparatus comprises a base and a port. The storage apparatus is loaded on the base. The port comprises a receiving part, which is connected with an air entrance of the storage apparatus. The contact portions of both the top of the receiving part and the air entrance of the storage apparatus are cambered surfaces and these two portions contacts in a ring fashion. The port also comprises a hole for the gas to pass through, and a joint port to connect with the air source.
Abstract:
This present invention provides a gas filling apparatus for filling a gas into a storage apparatus for storing a semiconductor element or a reticle. The gas filling apparatus is connected with an air feed source, and includes a base, a first inlet port and a set of air feed source route. The storage apparatus is loaded on the base, and the first inlet port which is disposed on the base corresponds with the second inlet port of the storage apparatus. The set of air feed source route includes an entrance part, a supply part and a branch part. The entrance part is connected with the air feed source, and the supply part is connected with the first inlet port. The branch part is a closed loop, which transmits the gas from the entrance part into the supply part.
Abstract:
An I/O shield used in an electronic apparatus is provided. The electronic apparatus comprises a casing having an opening. The I/O shield comprises a body and at least a flexible lateral plate. The body has an edge with many protrusions arranged thereon. The flexible lateral plate has a first lateral edge and a second lateral edge parallel to the first lateral edge. The first lateral edge is disposed on the edge. The flexible lateral plate tilts towards the protrusions, and a surface of the flexible lateral plate faces the protrusions. When a rim of the opening is situated between the protrusions and the flexible lateral plate, the flexible lateral plate forms a bend structure between the first lateral edge and the second lateral edge, so that part of the surface near the second lateral edge presses the rim and clamps the rim of the opening together with the protrusions.
Abstract:
An electronic device includes a first body, a second body, an electrical connection element, and a hinge structure. The electrical connection element is configured to electrically connect the first body with the second body. The hinge structure is configured to pivot the first body with the second body. The hinge structure includes two mounting bases, two first linking assemblies, and a second linking assembly. Each of the mounting bases is connected to the first body and the second body. The two first linking assemblies are respectively pivoted to the two mounting bases. The second linking assembly is disposed between the two mounting bases, and two opposite terminals of the second linking assembly are movably connected to the two mounting bases respectively. The second linking assembly has a receding space configured to accommodate a portion of the electrical connection element.
Abstract:
A method of switching pairing between Bluetooth devices is disclosed. In one embodiment, the method is adapted to a Bluetooth server and two Bluetooth clients. The method enables the first Bluetooth client to interchange its pairing information with the Bluetooth server and the second Bluetooth client. Therefore, the Bluetooth server could use the interchanged pairing information to quickly connect with the second Bluetooth client.
Abstract:
A circuit arrangement between an input/output (I/O) integrated circuit (IC) and an I/O coupler IC includes a first universal asynchronous receiver-transmitter (UART) and a second UART provided within the I/O IC, each of the UART having a plurality of output serial terminals and input serial terminals, a first pulse position modulation (PPM) circuit connected to the parallel output terminals of the first UART and the second UART and having an output pin, a first pulse position demodulation (PPDM) circuit connected to the parallel input terminals of the first UART and the second UART and having two input pins, a second PPDM circuit provided within the I/O coupler IC and connected to the output pin of the first PPM circuit with two sets of output terminals, a second PPM circuit provided within the I/O coupler IC and connected to the input pins of the first PPDM circuit with two sets of input terminals, two voltage converters each respectively connected with a set of input terminals of the second PPM circuit and a set of output terminals of the second PPDM circuit and having a set of input parallel pins and a set of output parallel pins, a control circuit/clock generator provided within the I/O IC and having two output pins, and a control circuit provided within the I/O coupler IC and having two input pins connected to the output pins of the control circuit/clock generator.
Abstract:
The invention provides a chip carrier, a chip testing module and a chip handling module. The chip carrier for carrying a plurality of chips comprises a main body with an upper surface and a lower surface. The main body has a plurality of air guide holes, and two ends of each air guide hole are respectively exposed on the upper surface and the lower surface. A part of the air guide holes are defined as a first group, and the air guide holes of the first group are connected. The main body is made of conductive material.