摘要:
There is disclosed a paste composition comprising a mixture of: an organic binder having an acidic functional group; at least one polyvalent metal or a polyvalent metallic compound; and an anion-adsorptive substance having the property of adsorbing an anion of said organic binder. The paste composition is capable of inhibiting gelation in a mixture of an organic binder having an acidic functional group with a polyvalent metal or a polyvalent metallic compound and is excellent in storage stability.
摘要:
Disclosed herein is resistive paste containing conductive powder, which is composed of iron oxide, ruthenium oxide, lead oxide and zinc oxide, glass frit, and organic varnish. The conductive powder contains 10 to 25 atomic percent of iron oxide in terms of Fe atoms, 25 to 34 atomic percent of ruthenium oxide in terms of Ru atoms, 25 to 34 atomic percent of lead oxide in terms of Pb atoms, and 10 to 25 atomic percent of zinc oxide in terms of Zn atoms. According to this resistive paste, it is possible to obtain a resistor with small sliding noise at a low cost.
摘要:
A resistive paste consists essentially of a solid component dispersed in an organic vehicle, the solid component consisting essentially of 5 to 70 parts by weight of a resistor material, and 30 to 95 parts by weight of nonreducing vitreous material. The resistor material has a composition expressed by the general formula:Nb.sub.x La.sub.1-x B.sub.6-4xwherein x is a mol fraction of Nb and takes a value within the following range: 0.1.ltoreq.x.ltoreq.0.9.
摘要:
A piezoelectric actuator includes external conductors formed on an outer surface of a piezoelectric component. The external conductors each include a thick-film conductor and a conductive reinforcer. The thick-film conductor is provided with a first thick-film conductor formed on the outer surface of the piezoelectric component, second thick-film conductors which are formed on part of an outer surface of the first thick-film conductor and which are in surface-contact with the outer surface of the first thick-film conductor. The conductive reinforcer is attached to outer surfaces of the second thick-film conductors.
摘要:
An external electrode structure for a monolithic ceramic capacitor provided with a function as a resistance element is capable of preventing a reduction of the external electrode due to baking in a reducing atmosphere, so that Ni or a Ni alloy can be used in an internal electrode and a good electrical connection between the internal electrode and the external electrode is achieved. The external electrodes disposed on an outer surface of a capacitor main body include an electrically conductive layer and a metal plating layer disposed thereon, and the electrically conductive layer includes a compound oxide, e.g., an In—Sn compound oxide, which reacts with Ni or the Ni alloy, and a glass component.
摘要:
A piezoelectric actuator includes external conductors formed on an outer surface of a piezoelectric component. The external conductors each include a thick-film conductor and a conductive reinforcer. The thick-film conductor is provided with a first thick-film conductor formed on the outer surface of the piezoelectric component, second thick-film conductors which are formed on part of an outer surface of the first thick-film conductor and which are in surface-contact with the outer surface of the first thick-film conductor. The conductive reinforcer is attached to outer surfaces of the second thick-film conductors.
摘要:
A photosensitive insulating paste contains a borosilicate glass powder and a crystalline SiO2 powder, wherein the powders are dispersed in a photosensitive organic vehicle and the paste contains the crystalline SiO2 component in an amount of about 3-40 wt. % after sintering. A thick-film multi-layer circuit substrate (e.g., chip inductor) comprising an insulating substrate on which insulating layers are formed, wherein the insulating layers are formed through exposure, development and sintering, after the application of the photosensitive insulating paste.
摘要:
Provided is a crystalline glass composition for use in a circuit board that can be sintered at a temperature of 1100° C. and is endowed with favorable characteristics such as a relative dielectric constant of as low as ½ and a thermal expansion coefficient of as high as 12 ppm/° C. as an electrical insulating insulator for use in a circuit board. The crystalline glass composition contains SiO2, MgO and CaO, the composition ratio of SiO2, MgO and CaO in % by weight falling within an area surrounded by the lines connecting the points A (25, 45, 30), B (25, 0, 75), C (44, 0, 56), D (44, 22, 34), E (40, 19, 41) and F (29, 40, 31) in a ternary phase diagram wherein at least one melwinite, monticellite or calcium silicate crystalline phase is deposited by heat-treating the composition. A ceramic powder having a thermal expansion coefficient of about 6.0 ppm/C or more is sometimes added in the powder comprising the glass composition.
摘要:
Resistance paste for baked-film resistors consists essentially of conducting powder, glass frit and organic varnish. The conducting powder consists essentially of iron oxide, ruthenium oxide and lead oxide, the molar ratio of the three components of the conducting powder being 1:0.6-3:0.2-1 when expressed in terms of Fe.sub.3 O.sub.4, RuO.sub.2 and Pb.sub.3 O.sub.4, respectively.
摘要:
A solder paste comprising a solder alloy powder and a flux. The volumetric expansion at the time of melting of the solder alloy is at most 0.5%. The flux contains a bisphenol A epoxy resin and a curing agent selected from a carboxylic anhydride and a dicarboxylic acid. The solder paste can be used in applications suitable for high-temperature solders. The solder alloy has an alloy composition comprising, in mass percent, 70-98% of Bi, a total of 0-0.5% of at least one substance selected from Ag, Cu, Sb, In, Zn, Ni, Cr, Fe, Mo, P, Ge, and Ga, and a remainder of Sn.