公开(公告)号：US20060283009A1

公开(公告)日：2006-12-21

申请号：US11452902

申请日：2006-06-15

Applicant: Dong-Woo Shin ,  Byong-Kun Bae ,  Nam-Yong Oh ,  Dong-Chun Lee ,  Seong-Chan Han ,  Sun-Kyu Hwang

Inventor： Dong-Woo Shin ,  Byong-Kun Bae ,  Nam-Yong Oh ,  Dong-Chun Lee ,  Seong-Chan Han ,  Sun-Kyu Hwang

IPC: B23P19/00

CPC classification number: H05K13/0417 ,  H05K13/0409 ,  H05K13/041 ,  Y10T29/49131 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191 ,  Y10T29/53261

Abstract: An electronic component mounting apparatus that includes a demagnetizer used to demagnetize a head nozzle, and a method for demagnetizing an electronic component apparatus. The method may include setting conditions, mounting electronic components, and demagnetizing a head nozzle of the electronic component mounting apparatus based on the conditions.

Abstract translation: 一种电子部件安装装置，包括用于使头部喷嘴退磁的去磁器，以及使电子部件装置退磁的方法。 该方法可以基于条件来设置条件，安装电子部件，以及使电子部件安装装置的头部喷嘴退磁。

公开(公告)号：US20110216516A1

公开(公告)日：2011-09-08

申请号：US13006692

申请日：2011-01-14

Applicant: Jung-hoon Kim ,  Seong-chan Han ,  Dong-chun Lee ,  Jae-hoon Choi ,  Sun-kyu Hwang

Inventor： Jung-hoon Kim ,  Seong-chan Han ,  Dong-chun Lee ,  Jae-hoon Choi ,  Sun-kyu Hwang

IPC: H05K7/00

CPC classification number: H05K7/00

Abstract: A semiconductor module, a socket for the same, and a semiconductor module/socket assembly are disclosed. The semiconductor module includes a printed circuit board including a plurality of semiconductor devices, a plurality of insulating layers and a plurality of metal layers, the plurality of insulating layers and the plurality of metal layers are alternately stacked. Exposed portions of the metal layers are exposed to the outside of the semiconductor module at a first and a second ends of the printed circuit board. The first end and the second end are at opposite ends of the printed circuit board.

Abstract translation: 公开了半导体模块，用于其的插座和半导体模块/插座组件。 半导体模块包括具有多个半导体器件，多个绝缘层和多个金属层的印刷电路板，多个绝缘层和多个金属层交替堆叠。 金属层的露出部分在印刷电路板的第一和第二端处暴露于半导体模块的外部。 第一端和第二端位于印刷电路板的相对端。

公开(公告)号：US20080023812A1

公开(公告)日：2008-01-31

申请号：US11878084

申请日：2007-07-20

Applicant: Hyo-jae Bang ,  Dong-chun Lee ,  Seong-chan Han ,  Kyung-du Kim ,  Sun-kyu Hwang

Inventor： Hyo-jae Bang ,  Dong-chun Lee ,  Seong-chan Han ,  Kyung-du Kim ,  Sun-kyu Hwang

IPC: H01L23/488

CPC classification number: H01L23/13 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/45 ,  H01L24/48 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H05K1/0231 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: Example embodiments relate to a semiconductor package. The semiconductor package may include a mounting substrate, a semiconductor chip mounted to the mounting substrate, at least one passive component passing therethrough and mounted to the mounting substrate, and a cover covering the mounting substrate, the semiconductor chip and the at least one passive component.

Abstract translation: 示例实施例涉及半导体封装。 半导体封装可以包括安装基板，安装到安装基板的半导体芯片，穿过其中并安装到安装基板的至少一个无源部件，以及覆盖安装基板，半导体芯片和至少一个无源部件 。

公开(公告)号：US20130074359A1

公开(公告)日：2013-03-28

申请号：US13586250

申请日：2012-11-02

Applicant: Young-Ju JEONG ,  Bok-Kyu LEE ,  Sun-Kyu HWANG ,  Jeong-Yong BAE ,  Soo-Bin YONG

Inventor： Young-Ju JEONG ,  Bok-Kyu LEE ,  Sun-Kyu HWANG ,  Jeong-Yong BAE ,  Soo-Bin YONG

IPC: F26B3/00

CPC classification number: F26B21/14 ,  F26B3/00 ,  H01L21/02057 ,  H01L21/67034 ,  H01L21/67051

Abstract: A method for drying substrates using isopropyl alcohol (IPA) includes: a pre-stage in which heated fluid is injected to a bottom surface of a substrate to raise a temperature of the substrate simultaneously to injection of an organic solvent to a top surface of the substrate and injection of a dry gas to the top surface thereof to improve a vaporization power of the organic solvent; and a final stage in which the injection of the heated fluid is stopped and the organic solvent and the dry gas are injected to the top surface of the substrate.

Abstract translation: 使用异丙醇（IPA）干燥基材的方法包括：将加热的流体注入基材的底表面的前期，同时提高基材的温度，以将有机溶剂注入到 将干燥气体的基材和其上表面注入，以提高有机溶剂的蒸发能力; 并且终止加热流体的注入并将有机溶剂和干燥气体注入到基板的顶表面的最后阶段。