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141 条记录 (耗时 0.028 秒)

    System and method for pulverizing and extracting moisture
    12.
    发明授权
    System and method for pulverizing and extracting moisture 失效
    用于粉碎和提取水分的系统和方法

    公开(公告)号：US07374113B2

    公开(公告)日：2008-05-20

    申请号：US11298142

    申请日：2005-12-09

    申请人： William Graham ,  Levi New ,  Wayne Arthur Case

    发明人： William Graham ,  Levi New ,  Wayne Arthur Case

    IPC分类号： B02C19/06

    CPC分类号： B02C19/18 ,  B02C19/06 ,  B02C23/04 ,  B02C23/08 ,  F04D29/281 ,  F04D29/30 ,  F05D2240/304 ,  F26B17/103

    摘要： A venturi receives incoming material through an inlet tube and subjects the material to pulverization. The material, as it undergoes pulverization, is further subject to moisture extraction and drying. An airflow generator, coupled to the venturi, generates a high speed airflow to pull the material through the venturi and into an inlet aperture in the airflow generator. The airflow generator directs the received pulverized material to an outlet where the material may be subsequently separated from the air.

    摘要翻译： 文氏管通过入口管接收进入的材料并使材料粉碎。 该材料经过粉碎后，进一步进行水分提取和干燥。 耦合到文氏管的气流发生器产生高速气流，以将材料拉过文丘里管并进入气流发生器中的入口孔。 气流发生器将接收的粉碎物引导到出口，在该出口处材料随后可与空气分离。

    Pulveriser and method of pulverising
    16.
    发明授权
    Pulveriser and method of pulverising 失效
    粉碎机和粉碎方法

    公开(公告)号：US06722594B2

    公开(公告)日：2004-04-20

    申请号：US09792061

    申请日：2001-02-26

    申请人： William Graham

    发明人： William Graham

    IPC分类号： B02C1906

    CPC分类号： B02C23/08 ,  B02C19/06 ,  F04D29/281 ,  F26B17/103

    摘要： A pulverizer is disclosed which comprises a fan which sucks air through a pipe. A hopper receives material which is to be pulverized, the hopper having an open lower end which communicates with the pipe. Between the hopper and the fan there is a venturi. Air flows through the venturi at a speed of Mach 1 or above. Pieces of frangible material dropped into the hopper are sucked to the venturi where they are blown apart and reduced to powder.

    摘要翻译： 公开了一种粉碎机，其包括通过管吸入空气的风扇。 料斗接收待粉碎的材料，料斗具有与管连通的开口下端。 在料斗和风扇之间有一个文氏管。 空气以马赫数1以上的速度流过文丘里管。 落入料斗中的易碎材料被吸入文丘里管，在那里它们被分开并且被还原成粉末。

    Longer lifetime warm-up wafers for polishing systems
    18.
    发明授权
    Longer lifetime warm-up wafers for polishing systems 失效
    抛光系统寿命更长的预热晶圆

    公开(公告)号：US06287173B1

    公开(公告)日：2001-09-11

    申请号：US09481236

    申请日：2000-01-11

    申请人： Annette Margaret Crevasse ,  William Graham Easter ,  Alvaro Maury ,  John Albert Maze ,  Frank Miceli

    发明人： Annette Margaret Crevasse ,  William Graham Easter ,  Alvaro Maury ,  John Albert Maze ,  Frank Miceli

    IPC分类号： B24B53007

    CPC分类号： B24B37/042

    摘要： A method for preparing a chemical mechanical polishing apparatus for polishing product substrates includes polishing designated “warm-up” substrates until polishing pad characteristics have achieved steady state conditions. The reusable warm-up substrates may be formed of a mechanically resistant material or a material having substantially the same removal characteristic as the product film to be polished. The reusable warm-up substrates may also be formed of a mechanically resistant film formed over a semiconductor substrate. The polishing pad characteristic of pad compression may be determined using a previously established correlation or it may be measured.

    摘要翻译： 制备用于抛光产品基板的化学机械抛光装置的方法包括抛光指定的“预热”基板，直到抛光垫特性已经达到稳定状态。 可重复使用的预热基板可以由机械抵抗材料或具有与待抛光的产品膜具有基本相同的去除特性的材料形成。 可重复使用的预热基板也可以由在半导体衬底上形成的机械抵抗膜形成。 可以使用先前建立的相关性来确定衬垫压缩的抛光垫特性，或者可以测量。

    Method of manufacturing an integrated circuit using chemical mechanical polishing
    20.
    发明授权
    Method of manufacturing an integrated circuit using chemical mechanical polishing 失效
    使用化学机械抛光制造集成电路的方法

    公开(公告)号：US5967885A

    公开(公告)日：1999-10-19

    申请号：US982109

    申请日：1997-12-01

    申请人： Annette Margaret Crevasse ,  William Graham Easter ,  John Albert Maze, III ,  John Thomas Sowell

    发明人： Annette Margaret Crevasse ,  William Graham Easter ,  John Albert Maze, III ,  John Thomas Sowell

    IPC分类号： B24B37/04 ,  B24B5/00 ,  B24B29/00

    CPC分类号： B24B37/32 ,  B24B37/042

    摘要： A method of manufacturing integrated circuits using a carrier fixture. The carrier fixture does not include transport channels or openings for directing a slurry to a substrate being polished and, as a result, damage to the substrate is reduced because the edges adjacent to the substrate are eliminated. The present invention further provides a carrier fixture having an inner support coupled to a ring member that contacts a substrate during the CMP process. The present invention also provides a carrier fixture having inner and outer supports coupled to a ring member.

    摘要翻译： 使用载体夹具制造集成电路的方法。 载体夹具不包括用于将浆料引导到待抛光的基底的输送通道或开口，结果，由于与基底相邻的边缘被消除，因此对基底的损伤减小。 本发明还提供了一种载体固定装置，其具有联接到在CMP过程期间接触基板的环构件的内支撑。 本发明还提供了一种具有联接到环形构件的内部和外部支撑件的承载固定件。