公开(公告)号：US09548309B2

公开(公告)日：2017-01-17

申请号：US15047181

申请日：2016-02-18

Applicant: Sang-Jine Park ,  Kee-Sang Kwon ,  Do-Hyoung Kim ,  Bo-Un Yoon ,  Keun-Hee Bai ,  Kwang-Yong Yang ,  Kyoung-Hwan Yeo ,  Yong-Ho Jeon

Inventor： Sang-Jine Park ,  Kee-Sang Kwon ,  Do-Hyoung Kim ,  Bo-Un Yoon ,  Keun-Hee Bai ,  Kwang-Yong Yang ,  Kyoung-Hwan Yeo ,  Yong-Ho Jeon

IPC: H01L27/11 ,  H01L29/06 ,  H01L29/08 ,  H01L27/088 ,  H01L21/8234 ,  H01L27/092 ,  H01L29/16 ,  H01L29/161 ,  H01L29/165 ,  H01L29/78

CPC classification number: H01L27/1104 ,  H01L21/76224 ,  H01L21/823431 ,  H01L21/823437 ,  H01L21/823481 ,  H01L27/0886 ,  H01L27/0924 ,  H01L27/1116 ,  H01L29/06 ,  H01L29/0653 ,  H01L29/0847 ,  H01L29/1608 ,  H01L29/161 ,  H01L29/165 ,  H01L29/7848

Abstract: Semiconductor devices including a dummy gate structure on a fin are provided. A semiconductor device includes a fin protruding from a substrate. The semiconductor device includes a source/drain region in the fin, and a recess region of the fin that is between first and second portions of the source/drain region. Moreover, the semiconductor device includes a dummy gate structure overlapping the recess region, and a spacer that is on the fin and adjacent a sidewall of the dummy gate structure.

Abstract translation: 提供了包括翅片上的虚拟栅极结构的半导体器件。 半导体器件包括从衬底突出的翅片。 半导体器件包括翅片中的源极/漏极区域以及位于源极/漏极区域的第一和第二部分之间的鳍片的凹陷区域。 此外，半导体器件包括与凹陷区域重叠的虚拟栅极结构，以及位于鳍上且与伪栅极结构的侧壁相邻的间隔物。

公开(公告)号：US20160240630A1

公开(公告)日：2016-08-18

申请号：US14988867

申请日：2016-01-06

Applicant: GeumJung Seong ,  JinWook Lee ,  Dohyoung Kim ,  Sungwoo Myung ,  Jisoo Oh ,  Yong-Ho Jeon

Inventor： GeumJung Seong ,  JinWook Lee ,  Dohyoung Kim ,  Sungwoo Myung ,  Jisoo Oh ,  Yong-Ho Jeon

IPC: H01L29/66 ,  H01L29/49 ,  H01L21/311 ,  H01L29/40 ,  H01L21/306 ,  H01L21/308

CPC classification number: H01L29/66545 ,  H01L21/31058 ,  H01L21/31138 ,  H01L21/32139 ,  H01L21/82345 ,  H01L21/823842 ,  H01L29/401 ,  H01L29/4966

Abstract: The inventive concept relates to a semiconductor device and a method for fabricating the same. The semiconductor device comprises active patterns protruding from a substrate, an interlayer dielectric layer disposed on the substrate and including grooves exposing the active patterns, and gate electrodes in the grooves. The grooves include a first groove having a first width and a second groove having a second width greater than the first width. The gate electrodes include a first gate electrode in the first groove, and a second gate electrode in the second groove. Each of the first and second gate electrodes includes a first work function conductive pattern on a bottom surface and sidewalls of corresponding one of the first and second grooves, and a second work function conductive pattern on the first work function conductive pattern.

Abstract translation: 本发明构思涉及一种半导体器件及其制造方法。 半导体器件包括从衬底突出的有源图案，设置在衬底上的层间介电层，并且包括暴露有源图案的沟槽和沟槽中的栅电极。 凹槽包括具有第一宽度的第一凹槽和具有大于第一宽度的第二宽度的第二凹槽。 栅电极包括第一沟槽中的第一栅极电极和第二沟槽中的第二栅电极。 第一和第二栅电极中的每一个包括底表面上的第一功函导电图案和第一沟槽和第二沟槽中相应一个的侧壁，以及第一功函导电图案上的第二功函导电图案。

公开(公告)号：US20160163718A1

公开(公告)日：2016-06-09

申请号：US15047181

申请日：2016-02-18

Applicant: Sang-Jine Park ,  Kee-Sang Kwon ,  Do-Hyoung Kim ,  Bo-Un Yoon ,  Keun-Hee Bai ,  Kwang-Yong Yang ,  Kyoung-Hwan Yeo ,  Yong-Ho Jeon

Inventor： Sang-Jine Park ,  Kee-Sang Kwon ,  Do-Hyoung Kim ,  Bo-Un Yoon ,  Keun-Hee Bai ,  Kwang-Yong Yang ,  Kyoung-Hwan Yeo ,  Yong-Ho Jeon

IPC: H01L27/11 ,  H01L29/08 ,  H01L29/06 ,  H01L29/161 ,  H01L29/165 ,  H01L29/78 ,  H01L27/092 ,  H01L29/16

CPC classification number: H01L27/1104 ,  H01L21/76224 ,  H01L21/823431 ,  H01L21/823437 ,  H01L21/823481 ,  H01L27/0886 ,  H01L27/0924 ,  H01L27/1116 ,  H01L29/06 ,  H01L29/0653 ,  H01L29/0847 ,  H01L29/1608 ,  H01L29/161 ,  H01L29/165 ,  H01L29/7848

Abstract: Semiconductor devices including a dummy gate structure on a fin are provided. A semiconductor device includes a fin protruding from a substrate. The semiconductor device includes a source/drain region in the fin, and a recess region of the fin that is between first and second portions of the source/drain region. Moreover, the semiconductor device includes a dummy gate structure overlapping the recess region, and a spacer that is on the fin and adjacent a sidewall of the dummy gate structure.

公开(公告)号：US08916936B2

公开(公告)日：2014-12-23

申请号：US13751570

申请日：2013-01-28

Applicant: Jung-Chan Lee ,  Seung-Jae Lee ,  Sang-Bom Kang ,  Dae-Young Kwak ,  Myeong-Cheol Kim ,  Yong-Ho Jeon

Inventor： Jung-Chan Lee ,  Seung-Jae Lee ,  Sang-Bom Kang ,  Dae-Young Kwak ,  Myeong-Cheol Kim ,  Yong-Ho Jeon

IPC: H01L29/76

CPC classification number: H01L27/088 ,  H01L21/764 ,  H01L27/0886 ,  H01L27/1116 ,  H01L27/1211

Abstract: A semiconductor device including: a first gate pattern disposed in a peripheral region of a substrate; a second gate pattern disposed in a cell region of the substrate; a first insulator formed on sidewalls of the first gate pattern; and a second insulator formed on sidewalls of the second gate pattern, wherein a dielectric constant of the first insulator is different from a dielectric constant of the second insulator, and wherein a height of the second insulator is greater than a height of the second gate pattern.

Abstract translation: 一种半导体器件，包括：设置在衬底的周边区域中的第一栅极图案; 设置在所述基板的单元区域中的第二栅极图案; 形成在第一栅极图案的侧壁上的第一绝缘体; 以及形成在所述第二栅极图案的侧壁上的第二绝缘体，其中所述第一绝缘体的介电常数不同于所述第二绝缘体的介电常数，并且其中所述第二绝缘体的高度大于所述第二栅极图案的高度 。