Method of forming patterns for semiconductor device
    10.
    发明授权
    Method of forming patterns for semiconductor device 有权
    形成半导体器件图案的方法

    公开(公告)号:US08551888B2

    公开(公告)日:2013-10-08

    申请号:US13238945

    申请日:2011-09-21

    IPC分类号: H01L21/302 H01L21/461

    摘要: A method of forming patterns for a semiconductor device. The method includes: forming a first hard mask layer on a layer which is to be etched; forming a second hard mask layer on the first hard mask layer, wherein the second hard mask layer includes a first portion and a second portion formed underneath the first portion, wherein the first portion and second portion are composed of the same material; etching the first portion to form first patterns; forming spacers covering sidewalls of the first patterns; etching the second portion using the spacers as etch masks to form second patterns; etching the first hard mask layer and the spacers using the second patterns disposed underneath the spacers as etch masks to form third patterns; and etching the layer to be etched, using the third patterns.

    摘要翻译: 一种形成半导体器件的图案的方法。 该方法包括:在要蚀刻的层上形成第一硬掩模层; 在所述第一硬掩模层上形成第二硬掩模层,其中所述第二硬掩模层包括形成在所述第一部分下面的第一部分和第二部分,其中所述第一部分和第二部分由相同的材料构成; 蚀刻第一部分以形成第一图案; 形成覆盖所述第一图案的侧壁的间隔物; 使用间隔物蚀刻第二部分作为蚀刻掩模以形成第二图案; 使用设置在间隔物下方的第二图案作为蚀刻掩模来蚀刻第一硬掩模层和间隔物以形成第三图案; 并使用第三图案蚀刻待蚀刻的层。