SYSTEMS AND METHODS FOR MANAGING DIABETES

    公开(公告)号:US20210213196A1

    公开(公告)日:2021-07-15

    申请号:US17166372

    申请日:2021-02-03

    Abstract: Provided are a method, apparatus, and computer program for providing a notification according to a period of use of a drug infusion device. A time point at which the drug infusion device switches from an inactive mode to an active mode may be determined as a use start time point. Also, an impending expiration notification indicating that expiration of a period of use of the drug infusion device is imminent may be provided at a first time point after a certain period from the use start time point, based on a usable period and a user set time of the drug infusion device. In addition, an expiration notification indicating that the period of use of the drug infusion device has expired may be provided at a second time point after the usable period from the use start time point.

    Methods of manufacturing semiconductor devices
    4.
    发明授权
    Methods of manufacturing semiconductor devices 有权
    制造半导体器件的方法

    公开(公告)号:US08822341B2

    公开(公告)日:2014-09-02

    申请号:US13164090

    申请日:2011-06-20

    CPC classification number: H01L21/30655 H01L21/76898

    Abstract: A first gas for plasma etch and a second gas for plasma deposition are introduced onto a semiconductor substrate, the semiconductor substrate including a mask pattern. A flow rate of the first and second gases is periodically changed within a range of flow rates during a process cycle, such that a plasma etch process and a plasma deposition process are performed together to form an opening in the semiconductor substrate.

    Abstract translation: 用于等离子体蚀刻的第一气体和用于等离子体沉积的第二气体被引入到半导体衬底上,该半导体衬底包括掩模图案。 第一气体和第二气体的流量在处理循环期间的流量范围内周期性地变化,使得等离子体蚀刻工艺和等离子体沉积工艺一起进行以在半导体衬底中形成开口。

    METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
    5.
    发明申请
    METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES 有权
    制造半导体器件的方法

    公开(公告)号:US20110318930A1

    公开(公告)日:2011-12-29

    申请号:US13164090

    申请日:2011-06-20

    CPC classification number: H01L21/30655 H01L21/76898

    Abstract: A first gas for plasma etch and a second gas for plasma deposition are introduced onto a semiconductor substrate, the semiconductor substrate including a mask pattern. A flow rate of the first and second gases is periodically changed within a range of flow rates during a process cycle, such that a plasma etch process and a plasma deposition process are performed together to form an opening in the semiconductor substrate.

    Abstract translation: 用于等离子体蚀刻的第一气体和用于等离子体沉积的第二气体被引入到半导体衬底上,该半导体衬底包括掩模图案。 第一气体和第二气体的流量在处理循环期间的流量范围内周期性地变化,使得等离子体蚀刻工艺和等离子体沉积工艺一起进行以在半导体衬底中形成开口。

    Systems and methods for managing diabetes

    公开(公告)号:US12115349B2

    公开(公告)日:2024-10-15

    申请号:US17166372

    申请日:2021-02-03

    CPC classification number: A61M5/1684 A61M5/1723 G16H20/17

    Abstract: Provided are a method, apparatus, and computer program for providing a notification according to a period of use of a drug infusion device. A time point at which the drug infusion device switches from an inactive mode to an active mode may be determined as a use start time point. Also, an impending expiration notification indicating that expiration of a period of use of the drug infusion device is imminent may be provided at a first time point after a certain period from the use start time point, based on a usable period and a user set time of the drug infusion device. In addition, an expiration notification indicating that the period of use of the drug infusion device has expired may be provided at a second time point after the usable period from the use start time point.

    SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME
    8.
    发明申请
    SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号:US20140054713A1

    公开(公告)日:2014-02-27

    申请号:US13751570

    申请日:2013-01-28

    Abstract: A semiconductor device including: a first gate pattern disposed in a peripheral region of a substrate; a second gate pattern disposed in a cell region of the substrate; a first insulator formed on sidewalls of the first gate pattern; and a second insulator formed on sidewalls of the second gate pattern, wherein a dielectric constant of the first insulator is different from a dielectric constant of the second insulator, and wherein a height of the second insulator is greater than a height of the second gate pattern.

    Abstract translation: 一种半导体器件,包括:设置在衬底的周边区域中的第一栅极图案; 设置在所述基板的单元区域中的第二栅极图案; 形成在第一栅极图案的侧壁上的第一绝缘体; 以及形成在所述第二栅极图案的侧壁上的第二绝缘体,其中所述第一绝缘体的介电常数不同于所述第二绝缘体的介电常数,并且其中所述第二绝缘体的高度大于所述第二栅极图案的高度 。

    PLASMA PROCESSING APPARATUS
    9.
    发明申请
    PLASMA PROCESSING APPARATUS 审中-公开
    等离子体加工设备

    公开(公告)号:US20110284163A1

    公开(公告)日:2011-11-24

    申请号:US13086475

    申请日:2011-04-14

    CPC classification number: H01L21/67069 H01J37/32935 H01J37/32972

    Abstract: A plasma processing apparatus includes a chamber for processing a substrate. A plasma generator is provided to generate plasma within the chamber. A window is provided in a sidewall of the chamber, and the window transmits light from the plasma within the chamber. A photocatalytic layer is provided on an inner surface of the window such that the photocatalytic layer is activated as a result of exposure to light from the plasma to decompose a residual product on the inner surface of the window.

    Abstract translation: 等离子体处理装置包括用于处理基板的室。 提供等离子体发生器以在腔室内产生等离子体。 窗口设置在室的侧壁中,并且窗口从腔室内的等离子体透射光。 在窗的内表面上提供光催化层,使得光催化层由于暴露于等离子体的光而被激活,从而在窗的内表面上分解残留产物。

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