公开(公告)号：US20180366834A1

公开(公告)日：2018-12-20

申请号：US15780403

申请日：2016-11-29

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Michael S. Graff ,  Seong-Woo Woo ,  Chuang Wei Chiu

IPC: H01Q17/00

CPC classification number: H01Q17/00 ,  H01F1/15333 ,  H01F1/24 ,  H01F27/365 ,  H01F38/14 ,  H01P1/365 ,  H01Q1/38 ,  H01Q7/00 ,  H01Q7/06

Abstract: A magnetic isolator includes a dielectric film having a layer of electrically-conductive soft magnetic material bonded thereto. The layer of electrically-conductive soft magnetic material comprises substantially coplanar electrically-conductive soft magnetic islands separated one from another by a network of interconnected gaps. The interconnected gaps are at least partially filled with a thermoset dielectric material. The network of interconnected gaps at least partially suppresses electrical eddy current induced within the layer of soft magnetic material when in the presence of applied external magnetic field. An electronic device including the magnetic isolator and a method of making the magnetic isolator are also disclosed.

公开(公告)号：US20250046508A1

公开(公告)日：2025-02-06

申请号：US18718177

申请日：2022-12-12

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Jinwook Kim ,  Seong-Woo Woo

IPC: H01F27/28 ,  H01F27/29

Abstract: The present disclosure relates to a coil assembly. Specifically, according to an embodiment of the disclosure, there is provided a coil assembly including: a coil; and at least one pair of terminals among first terminals, second terminals, and third terminals for electrically connecting different electronic devices, wherein the coil includes: major coil surfaces which face each other and are substantially planar; and at least a first film and a second film which are laminated and are wound to form a plurality of loops which are substantially concentric, and wherein the first film and the second film include at least one electrically conductive layer, respectively.

公开(公告)号：US11962367B2

公开(公告)日：2024-04-16

申请号：US17800384

申请日：2021-02-24

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Seong-Woo Woo ,  Jinwook Kim ,  Jung Ju Suh ,  Jennifer J. Sokol ,  Charles L Bruzzone

IPC: H04B5/79 ,  H01F5/00 ,  H01F27/28 ,  H01F38/14 ,  H04B5/26 ,  H02J50/10

CPC classification number: H04B5/79 ,  H01F5/003 ,  H01F27/2804 ,  H01F38/14 ,  H04B5/26 ,  H02J50/10

Abstract: An antenna for transfer of information or energy is described. The antenna includes an electrically conductive first layer having a width in a thickness direction of the antenna and extending longitudinally along a length of the first layer between first and second longitudinal ends of the first layer, and an electrically insulative thermally conductive second layer bonded to the first layer along the length of the first layer. The first and second layers are wound to form a plurality of substantially concentric loops. A width and a length of the second layer are substantially co-extensive with the respective width and length of the first layer so as to expose opposing longitudinal edge surfaces of the first layer along the length of the first layer. Coils and assemblies useful for making coils are also described.

公开(公告)号：US20220262740A1

公开(公告)日：2022-08-18

申请号：US17737285

申请日：2022-05-05

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Jiwoong Kong ,  Jung Ju Suh ,  Seong-Woo Woo

IPC: H01L23/552 ,  H05K9/00

Abstract: An electronic assembly according to an embodiment includes: a circuit board including a first edge surface and a trace having an electrical conductivity; an electronic element including a lateral edge spatially spaced apart from the first edge surface, and mounted on the circuit board and electrically connected to the trace; a protection layer including a second edge surface and disposed on the electronic element to substantially cover the electronic element; a magnetic field shielding film including a third edge surface and disposed on the protection layer; and a first metal layer. The first edge surface connects a main top surface of the circuit board and a main bottom surface of the circuit board, the second edge surface connects a main top surface of the protection layer and a main bottom surface of the protection layer, and the third edge surface connects a main top surface of the magnetic field shielding film and a main bottom surface of the magnetic field shielding film, and the first edge surface, the second edge surface, and the third edge surface are substantially aligned with one another to form a coupling edge surface which is substantially planar. In addition, the first metal layer is disposed on the magnetic field shielding film, and covers the main top surface of the magnetic field shielding film and the coupling edge surface.

公开(公告)号：US10985111B2

公开(公告)日：2021-04-20

申请号：US16822145

申请日：2020-03-18

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Jiwoong Kong ,  Jung Ju Suh ,  Seong-Woo Woo

IPC: H01L23/552 ,  H05K9/00

Abstract: An electronic assembly according to an embodiment includes: a circuit board including a first edge surface and a trace having an electrical conductivity; an electronic element including a lateral edge spatially spaced apart from the first edge surface, and mounted on the circuit board and electrically connected to the trace; a protection layer including a second edge surface and disposed on the electronic element to substantially cover the electronic element; a magnetic field shielding film including a third edge surface and disposed on the protection layer; and a first metal layer. The first edge surface connects a main top surface of the circuit board and a main bottom surface of the circuit board, the second edge surface connects a main top surface of the protection layer and a main bottom surface of the protection layer, and the third edge surface connects a main top surface of the magnetic field shielding film and a main bottom surface of the magnetic field shielding film, and the first edge surface, the second edge surface, and the third edge surface are substantially aligned with one another to form a coupling edge surface which is substantially planar. In addition, the first metal layer is disposed on the magnetic field shielding film, and covers the main top surface of the magnetic field shielding film and the coupling edge surface.

公开(公告)号：US20210005371A1

公开(公告)日：2021-01-07

申请号：US16904997

申请日：2020-06-18

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Jinwook Kim ,  Seong-Woo Woo ,  Jung Ju Suh ,  Matthew R.C. Atkinson

IPC: H01F10/08

Abstract: A magnetic film includes one or more magnetically conductive layers. Each magnetically conductive layer is cracked to form a plurality of first through-cracks defining a plurality of magnetically conductive segments. The first through-cracks extend along a first direction and form a first regular pattern along an orthogonal second direction at a first pitch P1, such that a Fourier transform of the first regular pattern has a first peak along the second direction at a first spatial frequency corresponding to the first pitch P1. The first through-cracks have an average length L1 along the first direction. L1/P1 is greater than or equal to 5.

公开(公告)号：US20200303320A1

公开(公告)日：2020-09-24

申请号：US16822145

申请日：2020-03-18

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Jiwoong Kong ,  Jung Ju Suh ,  Seong-Woo Woo

IPC: H01L23/552

Abstract: An electronic assembly according to an embodiment includes: a circuit board including a first edge surface and a trace having an electrical conductivity; an electronic element including a lateral edge spatially spaced apart from the first edge surface, and mounted on the circuit board and electrically connected to the trace; a protection layer including a second edge surface and disposed on the electronic element to substantially cover the electronic element; a magnetic field shielding film including a third edge surface and disposed on the protection layer; and a first metal layer. The first edge surface connects a main top surface of the circuit board and a main bottom surface of the circuit board, the second edge surface connects a main top surface of the protection layer and a main bottom surface of the protection layer, and the third edge surface connects a main top surface of the magnetic field shielding film and a main bottom surface of the magnetic field shielding film, and the first edge surface, the second edge surface, and the third edge surface are substantially aligned with one another to form a coupling edge surface which is substantially planar. In addition, the first metal layer is disposed on the magnetic field shielding film, and covers the main top surface of the magnetic field shielding film and the coupling edge surface.

公开(公告)号：US20250069799A1

公开(公告)日：2025-02-27

申请号：US18944390

申请日：2024-11-12

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Seong-Woo Woo ,  Jung Ju Suh ,  Charles L. Bruzzone ,  Jennifer J. Sokol ,  Sergei A. Manuilov

IPC: H01F27/36 ,  H01F1/153 ,  H01F10/13

Abstract: A magnetic film includes iron and copper distributed between opposing first and second major surfaces of the magnetic film. The copper has a first atomic concentration C1 at a first depth d1 from the first major surface and a peak second atomic concentration C2 at a second depth d2 from the first major surface, d2>d1, C2/C1≥5.

公开(公告)号：US12176139B2

公开(公告)日：2024-12-24

申请号：US18105980

申请日：2023-02-06

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Seong-Woo Woo ,  Jung Ju Suh ,  Charles L. Bruzzone ,  Jennifer J. Sokol ,  Sergei A. Manuilov

IPC: H01F27/36 ,  H01F1/153 ,  H01F10/13

Abstract: A magnetic film includes iron and copper distributed between opposing first and second major surfaces of the magnetic film. The copper has a first atomic concentration C1 at a first depth d1 from the first major surface and a peak second atomic concentration C2 at a second depth d2 from the first major surface, d2>d1, C2/C1≥5.

公开(公告)号：US11664850B2

公开(公告)日：2023-05-30

申请号：US16553476

申请日：2019-08-28

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Seong-Woo Woo ,  Jinwook Kim ,  Charles L. Bruzzone ,  Jennifer J. Sokol ,  Matthew R. C. Atkinson

IPC: H01F27/30 ,  H01F27/00 ,  H01F5/00 ,  H01F27/36 ,  H04B5/00 ,  H02J50/10 ,  H01F38/14 ,  H01Q7/00 ,  H01F41/066 ,  H01Q1/38 ,  H01F41/04

CPC classification number: H04B5/0031 ,  H01F5/003 ,  H01F27/006 ,  H01F27/30 ,  H01F27/366 ,  H01F38/14 ,  H01F41/066 ,  H01Q1/38 ,  H01Q7/00 ,  H02J50/10 ,  H04B5/0037 ,  H01F41/046

Abstract: A coil for transfer of information or energy is described. The coil includes an electrically conductive magnetically insulative first layer and a magnetically conductive second layer bonded to the first layer along the length of the first layer. The first and second layers are wound to form a plurality of substantially concentric loops. A width and a length of the second layer may be substantially co-extensive with a respective width and length of the first layer so as to expose opposing longitudinal edge surfaces of the first layer along the length of the first layer. At least one of the opposing longitudinal edge surfaces may include a regular pattern extending substantially along a same first direction and across substantially the entire coil. A method of making the coil is described.