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公开(公告)号：US20240357271A1
公开(公告)日：2024-10-24
申请号：US18626112
申请日：2024-04-03
Applicant: APPLE INC.
Inventor： Edward Siahaan , Daniel R. Bloom , Jason J. LeBlanc , Phillip Qian
IPC: H04R1/10 , H04R5/033 , H04R5/04 , G10K11/178
CPC classification number: H04R1/1008 , H04R1/1033 , H04R1/1041 , H04R1/105 , H04R1/1066 , H04R1/1075 , H04R1/1083 , H04R5/0335 , H04R5/04 , G10K11/17861 , G10K11/17873
Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
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公开(公告)号：US11985463B2
公开(公告)日：2024-05-14
申请号：US18197672
申请日：2023-05-15
Applicant: APPLE INC.
Inventor： Edward Siahaan , Daniel R. Bloom , Jason J. LeBlanc , Phillip Qian
IPC: H04R25/00 , H04R1/10 , H04R5/033 , H04R5/04 , G10K11/178
CPC classification number: H04R1/1008 , H04R1/1033 , H04R1/1041 , H04R1/105 , H04R1/1066 , H04R1/1075 , H04R1/1083 , H04R5/0335 , H04R5/04 , G10K11/17861 , G10K11/17873
Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
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公开(公告)号：US10856068B2
公开(公告)日：2020-12-01
申请号：US16445117
申请日：2019-06-18
Applicant: Apple Inc.
Inventor： Phillip Qian , Edward Siahaan , Erik L. Wang , Christopher J. Stringer , Matthew Dean Rohrbach , Daniel Max Strongwater , Jason J. LeBlanc
IPC: H04R1/10 , A61B5/024 , A61B5/00 , H04R1/40 , H04R5/04 , A61B5/1455 , A61B5/01 , H04R5/033 , H04R3/00
Abstract: This application relates to earbuds configured with one or more biometric sensors. At least one of the biometric sensors is configured to be pressed up against a portion of the tragus for making biometric measurements. In some embodiments, the housing of the earbud can be symmetric so that the earbud can be worn interchangeably in either a left or a right ear of a user. In such an embodiment, the earbud can include a sensor and circuitry configured to determine and alter operation of the earbud in accordance to which ear the earbud is determined to be sitting in.
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公开(公告)号：US20200280784A1
公开(公告)日：2020-09-03
申请号：US16878536
申请日：2020-05-19
Applicant: Apple Inc.
Inventor： Jason J. LeBlanc , Daniel R. Bloom , Edward Siahaan , Phillip Qian , Lee M. Panecki , Eugene Antony Whang , Jared M. Kole , Audrey L. Sheng , Tian Shi Li
IPC: H04R1/10
Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
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公开(公告)号：US20190306613A1
公开(公告)日：2019-10-03
申请号：US16445117
申请日：2019-06-18
Applicant: Apple Inc.
Inventor： Phillip Qian , Edward Siahaan , Erik L. Wang , Christopher J. Stringer , Matthew Dean Rohrbach , Daniel Max Strongwater , Jason J. LeBlanc
Abstract: This application relates to earbuds configured with one or more biometric sensors. At least one of the biometric sensors is configured to be pressed up against a portion of the tragus for making biometric measurements. In some embodiments, the housing of the earbud can be symmetric so that the earbud can be worn interchangeably in either a left or a right ear of a user. In such an embodiment, the earbud can include a sensor and circuitry configured to determine and alter operation of the earbud in accordance to which ear the earbud is determined to be sitting in.
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Patent Agency Ranking
公开(公告)号：US09838775B2
公开(公告)日：2017-12-05
申请号：US14856344
申请日：2015-09-16
Applicant: Apple Inc.
Inventor： Phillip Qian , Edward Siahaan , Scott C. Grinker , Jason J. LeBlanc
CPC classification number: H04R1/1091 , A61B5/01 , A61B5/02416 , A61B5/14552 , A61B5/14557 , A61B5/6817 , H04R1/1016 , H04R1/1041 , H04R1/105 , H04R1/1083 , H04R1/406 , H04R3/005 , H04R5/033 , H04R5/04 , H04R2201/109 , H04R2420/03 , H04R2420/07 , H04R2460/03
Abstract: This application relates to earbuds configured with one or more biometric sensors. At least one of the biometric sensors is configured to be pressed up against a portion of the tragus for making biometric measurements. In some embodiments, the housing of the earbud can be symmetric so that the earbud can be worn interchangeably in either a left or a right ear of a user. In such an embodiment, the earbud can include a sensor and circuitry configured to determine and alter operation of the earbud in accordance to which ear the earbud is determined to be positioned within.
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公开(公告)号：US12133038B2
公开(公告)日：2024-10-29
申请号：US17901751
申请日：2022-09-01
Applicant: Apple Inc.
Inventor： Thanh P. Hua , Priyanka Venkatesh , Jarrett B. Lagler , Jason J. LeBlanc , Hanchi Chen
CPC classification number: H04R1/1016 , H04R1/2823
Abstract: An in-ear electronic device comprising: an enclosure that defines an enclosed space surrounding a driver and an acoustic vent to an ambient environment surrounding the enclosure; and an acoustic frame having an outer surface coupled to the enclosure and defining an acoustic channel between a back volume chamber of the driver to the acoustic vent.
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公开(公告)号：US20240080603A1
公开(公告)日：2024-03-07
申请号：US17901751
申请日：2022-09-01
Applicant: Apple Inc.
Inventor： Thanh P. Hua , Priyanka Venkatesh , Jarrett B. Lagler , Jason J. LeBlanc , Hanchi Chen
CPC classification number: H04R1/1016 , H04R1/2823
Abstract: An in-ear electronic device comprising: an enclosure that defines an enclosed space surrounding a driver and an acoustic vent to an ambient environment surrounding the enclosure; and an acoustic frame having an outer surface coupled to the enclosure and defining an acoustic channel between a back volume chamber of the driver to the acoustic vent.
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公开(公告)号：US20230353931A1
公开(公告)日：2023-11-02
申请号：US18141351
申请日：2023-04-28
Applicant: APPLE INC.
Inventor： Phillip Qian , Edward Siahaan , Erik L. Wang , Christopher J. Stringer , Matthew Dean Rohrbach , Daniel Max Strongwater , Jason J. LeBlanc
CPC classification number: H04R1/1091 , H04R1/105 , A61B5/02416 , A61B5/6817 , H04R1/1016 , H04R1/1041 , H04R1/406 , H04R5/04 , H04R1/1083 , A61B5/14557
Abstract: This application relates to earbuds configured with one or more biometric sensors. At least one of the biometric sensors is configured to be pressed up against a portion of the tragus for making biometric measurements. In some embodiments, the housing of the earbud can be symmetric so that the earbud can be worn interchangeably in either a left or a right ear of a user. In such an embodiment, the earbud can include a sensor and circuitry configured to determine and alter operation of the earbud in accordance to which ear the earbud is determined to be sitting in.
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公开(公告)号：US11700471B2
公开(公告)日：2023-07-11
申请号：US17804274
申请日：2022-05-26
Applicant: Apple Inc.
Inventor： Edward Siahaan , Daniel R. Bloom , Jason J. LeBlanc , Phillip Qian
IPC: H04R25/00 , H04R1/10 , H04R5/033 , H04R5/04 , G10K11/178
CPC classification number: H04R1/1008 , H04R1/105 , H04R1/1033 , H04R1/1041 , H04R1/1066 , H04R1/1075 , H04R1/1083 , H04R5/0335 , H04R5/04 , G10K11/17861 , G10K11/17873
Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
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