公开(公告)号：US10285303B2

公开(公告)日：2019-05-07

申请号：US15730394

申请日：2017-10-11

Applicant: Apple Inc.

Inventor： Reuben J. Williams ,  Vinh H. Diep ,  Jonathan Matheson

IPC: H05K7/20 ,  F28D7/00 ,  F28D21/00 ,  H01L23/40 ,  G06F1/20

Abstract: An exemplary electronic device with integrated passive and active cooling includes a main logic board, a heat sink, and a cooling fan. A first surface of the heat sink faces the main logic board and contacts a heat-generating component of the main logic board. A second surface of the heat sink faces away from the main logic board and has a recess formed thereon. The heat sink further includes a plurality of fins that surround the recess. The cooling fan is at least partially enclosed within the recess by a fan shroud. The cooling fan is operable to draw air into the recess via channels defined by a first subset of the plurality of fins, and expel air from the recess via channels defined by a second subset of the plurality of fins.

公开(公告)号：US20180348827A1

公开(公告)日：2018-12-06

申请号：US16042804

申请日：2018-07-23

Applicant: Apple Inc.

Inventor： Jonathan A. Matheson ,  Vinh H. Diep ,  Brian L. Chuang ,  Judith C. Segura ,  Frank F. Liang ,  Leanne Bach Lien T. Ly ,  Kevin Z. Lo ,  Po W. Chiu ,  Lukose Ninan ,  Chong Li

IPC: G06F1/20 ,  H05K1/02 ,  H05K7/20 ,  H05K9/00

CPC classification number: G06F1/20 ,  G06F1/1656 ,  H05K1/0206 ,  H05K1/0209 ,  H05K7/20436 ,  H05K9/0049 ,  H05K2201/066 ,  H05K2201/0715 ,  H05K2201/10416

Abstract: Electronic devices have a PCB with a heat-generating component (e.g., POP or SOC), a heat sink, and an EMI shielding structure. A combination structure can include a top heat spreader/EMI shield located above and in thermal contact with the POP/SOC top, a bottom heat spreader/EMI shield located below and in thermal contact with the POP/SOC bottom, and a heat-directing component located on the PCB, laterally surrounding a majority of the POP/SOC sides, and between and in thermal contact with the top and bottom heat spreaders. Resulting heat paths for the POP/SOC include one through its top to the top heat spreader, another through its bottom to the bottom heat spreader, and others through its sides through the PCB through the heat-directing component to the top and bottom heat spreaders. The heat-directing component can be a metal horseshoe shaped pad integrally formed onto the PCB.

公开(公告)号：US09408334B2

公开(公告)日：2016-08-02

申请号：US13874164

申请日：2013-04-30

Applicant: Apple Inc.

Inventor： Vikas K. Sinha ,  Phillip S. Satterfield ,  Vinh H. Diep ,  Daniele De Iuliis

IPC: H05K9/00 ,  G06F1/18 ,  G11B33/08 ,  G11B33/12 ,  G11B33/14 ,  G06F1/16

CPC classification number: H05K9/0015 ,  G06F1/1656 ,  G06F1/182 ,  G06F1/187 ,  G11B33/08 ,  G11B33/124 ,  G11B33/1493 ,  H05K9/0007 ,  H05K9/003 ,  H05K9/0043

Abstract: An electronic device may have a hard disk drive mounted diagonally within a housing. Electromagnetic interference shielding structures may enclose the hard disk drive. The shielding structures may include conductive elastomeric structures. A printed circuit board may be mounted diagonally in parallel with the hard disk drive. Connectors on the printed circuit board may be angled away from the printed circuit board at a non-zero angle and may be retained against the housing with a slide and lock connector retention member. An accelerometer may detect when the device is tipped over so that control circuitry may protect the hard disk drive. A fan may cause air to flow upwards on one side of the device and downwards on the other side of the device. The housing may rest on housing support structures with angled air vents and integral elastomeric feet.

Abstract translation: 电子设备可以具有对角地安装在壳体内的硬盘驱动器。 电磁干扰屏蔽结构可能包围硬盘驱动器。 屏蔽结构可以包括导电弹性体结构。 印刷电路板可以与硬盘驱动器对角地平行安装。 印刷电路板上的连接器可以以非零角度与印刷电路板成角度，并且可以用滑动件和锁定连接器保持构件保持抵靠壳体。 加速度计可以检测设备何时翻转，以便控制电路可以保护硬盘驱动器。 风扇可能导致空气在设备的一侧向上流动，并在设备的另一侧向下流动。 外壳可以放置在具有倾斜通风孔和整体弹性脚的外壳支撑结构上。