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公开(公告)号:US20240427253A1
公开(公告)日:2024-12-26
申请号:US18682892
申请日:2022-07-15
Applicant: ASML Netherlands B.V.
Inventor: Henricus Petrus Maria PELLEMANS , Benoit Herve GAURY
Abstract: A method of determining an overlay measurement of a substrate includes: injecting charge into a charge injection element of the substrate; determining a first capacitance of a first pair of elements and a second capacitance of a second pair of elements; and determining a capacitance ratio based on the first capacitance and the second capacitance. The overlay measurement may be determined based on the capacitance ratio, which may indicate an imbalance.
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公开(公告)号:US20240241454A1
公开(公告)日:2024-07-18
申请号:US18619839
申请日:2024-03-28
Applicant: ASML NETHERLANDS B.V.
Inventor: Simon Reinald HUISMAN , Sebastianus Adrianus GOORDEN , Harm Jan Willem BELT , Filippo ALPEGGIANI , Irwan Dani SETIJA , Henricus Petrus Maria PELLEMANS
CPC classification number: G03F9/7019 , G03F7/70633 , G03F7/70641 , G03F7/706839 , G03F7/70725 , G03F9/7049 , G03F9/7088
Abstract: Disclosed is a method for measuring a parameter of interest from a target and associated apparatuses. The method comprises obtaining measurement acquisition data relating to measurement of a target on a production substrate during a manufacturing phase; obtaining a calibration correction database and/or a trained model having been trained on said calibration correction database, operable to correct for effects in the measurement acquisition data; correcting for effects in the measurement acquisition data using first correction data from said calibration correction database and/or using said trained model so as to obtain corrected measurement data and/or a corrected parameter of interest which is/are corrected for at least said effects; and updating said calibration correction data and/or said trained model with said corrected measurement data and/or corrected parameter of interest.
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公开(公告)号:US20240094643A1
公开(公告)日:2024-03-21
申请号:US18269983
申请日:2021-12-20
Applicant: ASML NETHERLANDS B.V.
Inventor: Filippo ALPEGGIANI , Harm Jan Willem BELT , Sebatianus Adrianus GOORDEN , Irwan Dani SETIJA , Simon Reinald HUISMAN , Henricus Petrus Maria PELLEMANS
IPC: G03F7/00
CPC classification number: G03F7/706845 , G03F7/70633 , G03F7/70641 , G03F7/706839
Abstract: A method for measuring a parameter of interest from a target and associated apparatuses. The method includes obtaining measurement acquisition data relating to measurement of the target and finite-size effect correction data and/or a trained model operable to correct for at least finite-size effects in the measurement acquisition data. At least finite-size effects in the measurement acquisition data is corrected for using the finite-size effect correction data and/or the trained model to obtain corrected measurement data and/or obtain a parameter of interest; and where the correcting does not directly determine the parameter of interest, determining the parameter of interest from the corrected measurement data.
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公开(公告)号:US20220397832A1
公开(公告)日:2022-12-15
申请号:US17773384
申请日:2020-10-19
Applicant: ASML Netherlands B.V.
Inventor: Filippo ALPEGGIANI , Henricus Petrus Maria PELLEMANS , Sebastianus Adrianus GOORDEN , Simon Reinald HUISMAN
Abstract: Disclosed is a method of metrology such as alignment metrology. The method comprises obtaining pupil plane measurement dataset at a pupil plane relating to scattered radiation resultant from a measurement of a structure. The method comprises determining a measurement value or correction therefor using the pupil plane measurement dataset and a sensor term relating to sensor optics used to perform said measurement.
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公开(公告)号:US20220100107A1
公开(公告)日:2022-03-31
申请号:US17435115
申请日:2020-02-14
Applicant: ASML NETHERLANDS B.V.
Inventor: Henricus Martinus Johannes VAN DE GROES , Johannes Hubertus Antonius VAN DE RIJDT , Marcel Pieter Jacobus PEETERS , Chien-Hung TSENG , Henricus Petrus Maria PELLEMANS
IPC: G03F9/00
Abstract: A method of aligning a substrate within an apparatus. The method includes determining a substrate grid based on measurements of a plurality of targets, each at different locations on a substrate. The determining includes repetitions of updating the substrate grid after each measurement of a target, and using the updated grid to align a measurement of a subsequent target.
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16.
公开(公告)号:US20190056216A1
公开(公告)日:2019-02-21
申请号:US16168355
申请日:2018-10-23
Applicant: ASML Netherlands B.V.
Inventor: Henricus Petrus Maria PELLEMANS , Arie Jeffrey Den Boef
CPC classification number: G01B11/24 , G03F7/70191 , G03F7/70633 , G03F7/7085
Abstract: A device manufacturing method is disclosed. A radiated spot is directed onto a target pattern formed on a substrate. The radiated spot is moved along the target pattern in a series of discrete steps, each discrete step corresponding to respective positions of the radiated spot on the target pattern. Measurement signals are generated that correspond to respective ones of the positions of the radiated spot on the target pattern. A single value is determined that is based on the measurement signals and that is representative of the property of the substrate.
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公开(公告)号:US20130329204A1
公开(公告)日:2013-12-12
申请号:US13902285
申请日:2013-05-24
Applicant: ASML Netherlands B.V.
Inventor: Henricus Petrus Maria PELLEMANS , Pavel Stanislavovich ANTSIFEROV , Vladimir Mihailovitch KRIVTSUN , Johannes Matheus Marie DE WIT , Ralph Jozef Johannes Gerardus Anna Maria SMEETS , Gerbrand VAN DER ZOUW
CPC classification number: H05H1/24 , G01N21/956 , G01N2201/061 , G03F7/20 , G03F7/70033 , G03F7/70483 , G03F7/70616 , G03F7/70641 , H01J61/02 , H01J61/54 , H01J61/545 , H01J65/04 , H05B41/38 , H05G2/003 , H05G2/008
Abstract: A laser driven light source comprises laser and focusing optics. These produce a beam of radiation focused on a plasma forming zone within a container containing a gas (e.g., Xe). Collection optics collects photons emitted by a plasma maintained by the laser radiation to form a beam of output radiation. Plasma has an elongate form (L>d) and collecting optics is configured to collect photons emerging in the longitudinal direction from the plasma. The brightness of the plasma is increased compared with sources which collect radiation emerging transversely from the plasma. A metrology apparatus using the light source can achieve greater accuracy and/or throughput as a result of the increased brightness. Back reflectors may be provided. Microwave radiation may be used instead of laser radiation to form the plasma.
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