公开(公告)号：US20200234977A1

公开(公告)日：2020-07-23

申请号：US16838682

申请日：2020-04-02

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin YEH

IPC: H01L21/56 ,  H01L23/498 ,  H01L23/00

Abstract: In one or more embodiments, a semiconductor package device includes a substrate, a trace, a structure, a barrier element and an underfill. The substrate has a first surface including a filling region surrounded by the trace. The structure is disposed over the filling region and electrically connected to the substrate. The barrier element is disposed on the trace. The underfill is disposed on the filling region.

公开(公告)号：US20180182704A1

公开(公告)日：2018-06-28

申请号：US15390225

申请日：2016-12-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin YEH

IPC: H01L23/522 ,  H01L23/532 ,  H01L23/528 ,  G06K7/10

CPC classification number: H01L23/5227 ,  G06K19/07775 ,  H01L23/49816 ,  H01L23/528 ,  H01L23/5389 ,  H01L23/66 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2924/15311 ,  H01L2924/19107

Abstract: The disclosure relates to an electronic module and a manufacturing method of the same. The electronic module includes a substrate, an electronic component, a first package body, a magnetic layer, a coil and a second package body. The electronic component is on the substrate. The first package body is on the substrate and covers the electronic component. The magnetic layer is on the first package body. The coil is on the magnetic layer. The coil includes a first section and a second section spaced from the first section. The first section and the second section are connected by a conductive material. The second package body is on the magnetic layer and covers the coil.

公开(公告)号：US20230413454A1

公开(公告)日：2023-12-21

申请号：US18239723

申请日：2023-08-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Hung CHEN ,  Yung I YEH ,  Chang-Lin YEH ,  Sheng-Yu CHEN

IPC: H05K5/00 ,  H05K5/06 ,  H05K1/18 ,  H05K9/00 ,  H05K3/28 ,  H05K1/14

CPC classification number: H05K5/0017 ,  H05K5/065 ,  H05K1/181 ,  H05K9/0022 ,  H05K3/284 ,  H05K1/142 ,  H05K1/144 ,  H05K2203/1316 ,  H05K2201/10037 ,  H05K2201/10128 ,  H05K2201/10151 ,  H05K2201/041 ,  H05K2203/1327

Abstract: A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.

公开(公告)号：US20220353619A1

公开(公告)日：2022-11-03

申请号：US17244885

申请日：2021-04-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin YEH

IPC: H04R19/02 ,  B81B7/00 ,  B81C1/00 ,  H04R1/02 ,  H04R7/04 ,  H04R31/00

Abstract: A semiconductor package device and a method of manufacturing a semiconductor package device are provided. The semiconductor package device includes a substrate, a first electronic component, and an encapsulation layer. The substrate has a first surface, a second surface opposite to the first surface, and a first opening extending from the first surface to the second surface. The first electronic component is disposed on the first surface of the substrate. The encapsulation layer is formed on the second surface of the substrate. The encapsulation layer includes a chamber connected to the first opening, and a width of the first opening is smaller than a width of the chamber.

公开(公告)号：US20220344246A1

公开(公告)日：2022-10-27

申请号：US17239482

申请日：2021-04-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin YEH ,  Jen-Chieh KAO

IPC: H01L23/498 ,  H01L25/10 ,  H01L23/31 ,  H01L25/00

Abstract: The present disclosure provides an electronic assembly including a semiconductor device package. The semiconductor device package includes a first package and a conductive element. The first package includes an electronic component and a protection layer covering the electronic component. The conductive element is supported by the protection layer and electrically connected with the electronic component through an electrical contact. A method for manufacturing a semiconductor device package is also provided in the present disclosure.

公开(公告)号：US20220102453A1

公开(公告)日：2022-03-31

申请号：US17549784

申请日：2021-12-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Hung CHEN ,  Sheng-Yu CHEN ,  Chang-Lin YEH ,  Yung-I YEH

IPC: H01L27/32 ,  H01L29/786 ,  H01L51/52 ,  H01L27/11 ,  H01L25/16 ,  H01L27/15

Abstract: A semiconductor device package includes a display device, an electronic module and a conductive adhesion layer. The display device includes a first substrate and a TFT layer. The first substrate has a first surface and a second surface opposite to the first surface. The TFT layer is disposed on the first surface of the first substrate. The electronic module includes a second substrate and an electronic component. The second substrate has a first surface facing the second surface of the first substrate and a second surface opposite to the first surface. The electronic component is disposed on the second surface of the second substrate. The conductive adhesion layer is disposed between the first substrate and the second substrate.

公开(公告)号：US20210090982A1

公开(公告)日：2021-03-25

申请号：US17115629

申请日：2020-12-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin YEH ,  Yu-Chang CHEN

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L25/16

Abstract: A semiconductor device package includes a substrate, a first solder paste, an electrical contact and a first encapsulant. The substrate includes a conductive pad. The first solder paste is disposed on the pad. The electrical contact is disposed on the first solder paste. The first encapsulant encapsulates a portion of the electrical contact and exposes the surface of the electrical contact. The electrical contact has a surface facing away from the substrate. A melting point of the electrical contact is greater than that of the first solder paste. The first encapsulant includes a first surface facing toward the substrate and a second surface opposite to the first surface. The second surface of the first encapsulant is exposed to air.

公开(公告)号：US20190393126A1

公开(公告)日：2019-12-26

申请号：US16262762

申请日：2019-01-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shiu-Fang YEN ,  Chang-Lin YEH ,  Jen-Chieh KAO

IPC: H01L23/367 ,  H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L23/373 ,  H01L23/498 ,  H01L23/66 ,  H01L21/48 ,  H01L21/56 ,  H01Q1/38

Abstract: A semiconductor package device includes a substrate, an electronic component, and a thermal conductive layer. The electronic component is disposed on the substrate and includes a first surface facing away from the substrate. The thermal conductive layer is disposed above the first surface of the electronic component. The thermal conductive layer includes a plurality of portions spaced apart from each other.

公开(公告)号：US20180269708A1

公开(公告)日：2018-09-20

申请号：US15458742

申请日：2017-03-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang-Lin YEH

IPC: H02J7/02 ,  H01L23/31 ,  H01L23/64 ,  H01L23/538 ,  H01L23/48 ,  H01L21/56 ,  H02J50/12 ,  H01F27/28 ,  H01F27/29 ,  H01G4/228 ,  H01G4/40 ,  H01F38/14 ,  H04B5/00

CPC classification number: H04B5/0062 ,  H01F5/003 ,  H01F27/022 ,  H01F27/2804 ,  H01F27/40 ,  H01F38/14 ,  H01G4/228 ,  H01G4/40 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/5381 ,  H01L23/5386 ,  H01L23/645 ,  H01L23/66 ,  H01L2224/16225 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H02J50/10 ,  H01L2924/00012

Abstract: A semiconductor device package includes a substrate, a package body, a conductive layer, a dielectric layer, a magnetic layer, a first insulating layer and a coil. The package body is disposed on the substrate. The package body has a first part and a second part disposed above the first part. The conductive layer is disposed on the first part of the package body and is electrically connected to the substrate. The dielectric layer is disposed on the conductive layer. The magnetic layer is disposed on the dielectric layer. The first insulating layer is disposed on the magnetic layer. The coil is disposed on the first insulating layer. The coil has a first terminal electrically connected with the magnetic layer.

公开(公告)号：US20240429115A1

公开(公告)日：2024-12-26

申请号：US18830517

申请日：2024-09-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi CHEN ,  Chang-Lin YEH ,  Jen-Chieh KAO

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/10 ,  H01L23/498 ,  H01L23/66 ,  H01Q1/22 ,  H01Q13/10 ,  H01Q19/10 ,  H01Q21/06

Abstract: A semiconductor package device includes a first substrate, a second substrate and a first spacer. The first substrate includes a first divided pad. The second substrate includes a second divided pad disposed above the first divided pad. The first spacer is disposed between the first divided pad and the second divided pad. The first spacer is in contact with the first divided pad and the second divided pad.