公开(公告)号：US20170141007A1

公开(公告)日：2017-05-18

申请号：US14943519

申请日：2015-11-17

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ya-Yu HSIEH ,  Hong-Ping LIN ,  Dao-Long CHEN ,  Ping-Feng YANG ,  Meng-Kai SHIH

IPC: H01L23/29 ,  H01L23/00 ,  C08K3/36 ,  C09D163/00 ,  C08K3/04

CPC classification number: H01L23/295 ,  C08G59/42 ,  C08K3/04 ,  C08K3/36 ,  C08K5/5435 ,  C08K5/544 ,  C09D163/00 ,  H01L21/563 ,  H01L23/296 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/29393 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/01006 ,  H01L2924/05442 ,  H01L2924/0665 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: The present disclosure relates to a filler composition for a semiconductor package. The filler composition comprises carbon and silica.