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    Heat-peelable pressure-sensitive adhesive sheet and method of recovering adherend
    11.
    发明申请
    Heat-peelable pressure-sensitive adhesive sheet and method of recovering adherend 审中-公开
    热剥离性粘合片和回收被粘物的方法

    公开(公告)号：US20100028588A1

    公开(公告)日：2010-02-04

    申请号：US12311974

    申请日：2007-10-18

    申请人： Kazuyuki Kiuchi

    发明人： Kazuyuki Kiuchi

    IPC分类号： C09J7/02 ,  C09J11/00 ,  C09J201/00 ,  B32B38/10

    CPC分类号： H01L21/6836 ,  C08K9/10 ,  C09J5/06 ,  C09J7/29 ,  C09J2205/102 ,  C09J2205/11 ,  C09J2205/302 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2924/19041 ,  Y10T428/1495 ,  Y10T428/24372 ,  Y10T428/2495

    摘要： To provide a heat-peelable pressure-sensitive adhesive sheet which, even when applied to a flexible adherend or extremely small adherend, enables the adherend to be efficiently peeled and recovered therefrom without breakage.The heat-peelable pressure-sensitive adhesive sheet includes a substrate, and arranged on one side thereof in the following order, an intermediate layer having a thickness “A”, and a heat-peelable pressure-sensitive adhesive layer having a thickness “B” and containing heat-expandable microspheres with a largest particle diameter “C”. The parameters A, B, and C satisfy the following conditions: C≦(A+B)≦60 (μm) and 0.25C≦B≦0.8C, and the heat-peelable pressure-sensitive-adhesive layer, when subjected to a heating treatment, shows an adhesive strength of less than 0.1 N/20 mm after the heating treatment. The heat-peelable pressure-sensitive adhesive layer after the heating treatment preferably has an arithmetic mean surface roughness Ra of 5 μm or smaller and a maximum height of the profile Rmax of 25 μm or smaller. The substrate preferably has a glass transition temperature (Tg) of 60° C. or higher and a thickness of 50 μm or smaller.

    摘要翻译： 为了提供一种即使应用于柔性被粘物或非常小的被粘物也能够有效地剥离被剥离并且不被破坏的被剥离体的热剥离性粘合片。 可热剥离性粘合片包括基板，按照以下顺序设置有厚度“A”的中间层和厚度“B”的热剥离性粘合剂层， 并含有最大粒径“C”的热膨胀性微球。 参数A，B和C满足以下条件：C <=（A + B）<= 60（母）和0.25℃<= B <= 0.8℃，并且可热剥离的压敏粘合剂层， 当进行加热处理时，在加热处理后显示小于0.1N / 20mm的粘合强度。 加热处理后的热剥离性粘合剂层的算术平均表面粗糙度Ra优选为5μm以下，轮廓Rmax的最大高度为25μm以下。 基板的玻璃化转变温度（Tg）优选为60℃以上，厚度为50μm以下。

    Method for thermally releasing chip cut piece from thermal release type pressure sensitive adhesive sheet, electronic component and circuit board
    14.
    发明申请
    Method for thermally releasing chip cut piece from thermal release type pressure sensitive adhesive sheet, electronic component and circuit board 审中-公开
    热释放型压敏粘合片，电子部件和电路板热切芯片切片的方法

    公开(公告)号：US20070111392A1

    公开(公告)日：2007-05-17

    申请号：US11650449

    申请日：2007-01-08

    申请人： Akihisa Murata ,  Toshiyuki Oshima ,  Yukio Arimitsu ,  Kazuyuki Kiuchi ,  Masaaki Sato ,  Michirou Kawanishi

    发明人： Akihisa Murata ,  Toshiyuki Oshima ,  Yukio Arimitsu ,  Kazuyuki Kiuchi ,  Masaaki Sato ,  Michirou Kawanishi

    IPC分类号： H01L21/00

    CPC分类号： H01L21/6836 ,  C09J7/22 ,  C09J7/38 ,  C09J2203/326 ,  C09J2205/11 ,  H01L2221/68327 ,  H01L2924/19041 ,  Y10T428/28

    摘要： A method of overheating and releasing a chip cut piece from a thermal release type pressure sensitive adhesive sheet is a method by which a chip cut piece stuck onto a thermal release type pressure sensitive adhesive sheet having a base material, and a thermally expandable microsphere-containing thermally expandable pressure sensitive adhesive layer provided on a surface of the base material is thermally released from the thermal release type pressure sensitive adhesive sheet and which is characterized by including the step of overheating while restraining the overheat and release type pressure sensitive adhesive sheet to thereby release the chip cut piece. A means for restraining the thermal release type pressure sensitive adhesive sheet may be an absorption means using suction or may be a bonding means using an adhesive agent. In this manner, the chip cut piece can be thermally released from the overheat and release type pressure sensitive adhesive sheet while position displacement in a horizontal direction can be prevented.

    摘要翻译： 从热脱模型压敏粘合片过热释放切屑的方法是将切屑粘贴到具有基材的热释放型压敏粘合片和含有热膨胀性微球的热释放型微球的方法 设置在基材表​​面上的可热膨胀的压敏粘合剂层从热释放型压敏粘合片热释放，其特征在于包括过热的步骤，同时限制过热和释放型压敏粘合片从而释放 切片切片。 用于抑制热释放型压敏粘合片的装置可以是使用吸附的吸收装置，或者可以是使用粘合剂的粘合装置。 以这种方式，切屑切片可以从过热和释放型压敏粘合片热释放，同时可以防止在水平方向上的位置偏移。

    Heat-peelable pressure-sensitive adhesive sheet
    15.
    发明授权
    Heat-peelable pressure-sensitive adhesive sheet 失效
    热剥离性粘合片

    公开(公告)号：US06998175B2

    公开(公告)日：2006-02-14

    申请号：US09853787

    申请日：2001-05-14

    申请人： Akihisa Murata ,  Toshiyuki Oshima ,  Yukio Arimitsu ,  Kazuyuki Kiuchi

    发明人： Akihisa Murata ,  Toshiyuki Oshima ,  Yukio Arimitsu ,  Kazuyuki Kiuchi

    IPC分类号： C09J7/02 ,  B32B27/00

    CPC分类号： C09J7/22 ,  C09J7/38 ,  C09J2205/11 ,  Y10S428/922 ,  Y10T428/14 ,  Y10T428/28 ,  Y10T428/2813 ,  Y10T428/2848 ,  Y10T428/2852 ,  Y10T428/2857 ,  Y10T428/2878 ,  Y10T428/2891

    摘要： A heat-peelable pressure-sensitive adhesive sheet which, even when used for temporarily fixing electronic parts having poor resistance to static electricity, such as magnetic heads, is effective in preventing the yield of such electronic parts from being reduced by electrostatic breakage, while ensuring its functions of adhesiveness before heating and peelability after heating. The heat-peelable pressure-sensitive adhesive sheet comprises a substrate and formed on at least one side thereof a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres, wherein the heat-expandable pressure-sensitive adhesive layer has a surface resistivity of 1012 Ω/□ or lower. In this heat-peelable pressure-sensitive adhesive sheet, the heat-expandable pressure-sensitive adhesive layer before heating may have a center line average surface roughness of 2 μm or less and a maximum surface roughness of 5 μm or less. The adhesive sheet may have a rubber-like organic elastic layer interposed between the substrate and the heat-expandable pressure-sensitive adhesive layer.

    摘要翻译： 即使用于临时固定耐静电性差的电子部件（例如磁头）的热剥离性粘合片也能有效地防止这种电子部件的收率因静电破坏而减少，同时确保 其加热前的粘合性和加热后的剥离性的功能。 热剥离性粘合片包括基材，在其至少一面形成有含有热膨胀性微球的热膨胀性压敏粘合剂层，其中，热膨胀性压敏粘合剂层的表面电阻率 10 12Ω/□以下。 在该热剥离性粘合片中，加热前的热膨胀性压敏粘合剂层的中心线平均表面粗糙度可以为2μm以下，最大表面粗糙度为5μm以下。 粘合片可以具有插入在基板和热膨胀性压敏粘合剂层之间的橡胶状有机弹性层。

    Radiation-curable heat-peelable pressure-sensitive adhesive sheet and process for producing cut pieces with the same
    16.
    发明授权
    Radiation-curable heat-peelable pressure-sensitive adhesive sheet and process for producing cut pieces with the same 失效
    可辐射固化的可热剥离的压敏粘合片及其制造方法

    公开(公告)号：US06488803B2

    公开(公告)日：2002-12-03

    申请号：US09782037

    申请日：2001-02-14

    申请人： Kazuyuki Kiuchi ,  Toshiyuki Oshima ,  Akihisa Murata ,  Yukio Arimitsu

    发明人： Kazuyuki Kiuchi ,  Toshiyuki Oshima ,  Akihisa Murata ,  Yukio Arimitsu

    IPC分类号： B32B712

    CPC分类号： H01L21/6836 ,  C09J7/22 ,  C09J7/38 ,  C09J2203/326 ,  C09J2205/11 ,  C09J2433/00 ,  H01L2221/68327 ,  H01L2924/19041 ,  Y10T428/28 ,  Y10T428/2809 ,  Y10T428/2839 ,  Y10T428/2848 ,  Y10T428/2852 ,  Y10T428/2887

    摘要： A radiation-curable heat-peelable pressure-sensitive adhesive sheet is disclosed which has tackiness enabling adherends to withstand transportation and other steps, with which cutting can be conducted without flinging up an adhesive waste or causing chipping, and from which the cut pieces can be easily separated and recovered. The radiation-curable heat-peelable pressure-sensitive adhesive sheet comprises a substrate and, formed on at least one side thereof, a pressure-sensitive adhesive layer containing heat-expandable microspheres and a radiation-curable compound. A work to be cut is placed on the surface of the pressure-sensitive adhesive layer of the radiation-curable heat-peelable pressure-sensitive adhesive sheet, and the pressure-sensitive adhesive layer is irradiated with a radiation to cure the adhesive layer. The work is cut into pieces and the pressure-sensitive adhesive layer is then thermally foamed, before the cut pieces are separated and recovered from the adhesive sheet. Thus, cut pieces can be efficiently produced without arousing troubles in processing steps.

    摘要翻译： 公开了一种可辐射固化的可热剥离的压敏粘合片，其具有使被粘物能够承受运输等步骤的粘性，通过该步骤可以进行切割，而不会使粘合剂废料卷起或引起碎裂，并且切割片可以从其 容易分离和回收。 可辐射固化的可热剥离的压敏粘合片包括基底，并且在其至少一个侧面上形成含有热膨胀性微球体和可辐射固化化合物的压敏粘合剂层。 将待切割的工件放置在可辐射固化的可热剥离的压敏粘合片的压敏粘合剂层的表面上，并用辐射照射粘合剂层以固化粘合剂层。 在将切割片从粘合片分离并回收之前，将工件切成块，然后将压敏粘合剂层热发泡。 因此，可以有效地生产切片，而不会在加工步骤中引起麻烦。

    Thermally strippable double faced adhesive sheet and method of working work piece
    18.
    发明申请
    Thermally strippable double faced adhesive sheet and method of working work piece 审中-公开
    可剥离双面胶粘剂片和加工工件的方法

    公开(公告)号：US20090288763A1

    公开(公告)日：2009-11-26

    申请号：US12311980

    申请日：2007-10-29

    申请人： Kazuyuki Kiuchi ,  Yoshinori Yoshida

    发明人： Kazuyuki Kiuchi ,  Yoshinori Yoshida

    IPC分类号： B32B38/10 ,  B32B3/26

    CPC分类号： H01L21/6836 ,  C09J5/06 ,  C09J7/26 ,  C09J7/29 ,  C09J2201/128 ,  C09J2205/302 ,  C09J2400/243 ,  H01L21/6835 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2221/6834 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/19041 ,  Y10T428/249953

    摘要： A thermally strippable double faced adhesive sheet comprising a substrate, a thermally strippable pressure-sensitive adhesive layer (A) arranged on one side of the substrate, and a pressure-sensitive adhesive layer (B) arranged on the other side of the substrate, in which the substrate comprises a porous substrate. The porous substrate preferably has a density of 0.9 g/cm3 or less and a tensile elastic modulus of 20 MPa or less. The substrate may comprise a laminate of the porous substrate and a non-porous substrate. Exemplary usable adhesives for the pressure-sensitive adhesive layer (B) include pressure-sensitive adhesives, ultraviolet-curable pressure-sensitive adhesives, thermally strippable pressure-sensitive adhesives, thermoplastic pressure-sensitive adhesives, and thermosetting pressure-sensitive adhesives.

    摘要翻译： 一种可热剥离的双面粘合片，包括基材，布置在基材一侧的可热剥离的压敏粘合剂层（A）和布置在基材的另一侧上的压敏粘合剂层（B）， 其中基底包括多孔基底。 多孔质基材的密度优选为0.9g / cm 3以下，拉伸弹性模量为20MPa以下。 基底可以包括多孔基底和非多孔基底的层压体。 用于粘合剂层（B）的示例性可用粘合剂包括压敏粘合剂，紫外线固化型压敏粘合剂，热剥离压敏粘合剂，热塑性压敏粘合剂和热固性压敏粘合剂。