公开(公告)号：US20110230741A1

公开(公告)日：2011-09-22

申请号：US13151601

申请日：2011-06-02

申请人： Bradley Chi Liang ,  Larry E. Tyler ,  Mohsen Askarinya ,  Charles Robert Gordon ,  Randal C. Schulhauser ,  Kenneth W. Cooper ,  Kris R. Holtzclaw ,  Brian T. Kannard ,  Rajiv Shah

发明人： Bradley Chi Liang ,  Larry E. Tyler ,  Mohsen Askarinya ,  Charles Robert Gordon ,  Randal C. Schulhauser ,  Kenneth W. Cooper ,  Kris R. Holtzclaw ,  Brian T. Kannard ,  Rajiv Shah

IPC分类号： A61B5/1473 ,  G06F19/00 ,  G01R27/08

CPC分类号： A61B5/14532 ,  A61B5/14865

摘要： The invention disclosed herein provides methods and materials for observing the state of a sensor, for example those used by diabetic patients to monitor blood glucose levels. Typically a voltage such as a voltage pulse is applied to the sensor in order to solicit a current response from which for example, factors such as impedance values can be derived. Such values can then be used as indicators of a sensor's state, for example the state of sensor hydration, sensor noise, sensor offset, sensor drift or the like.

摘要翻译： 本文公开的本发明提供了用于观察传感器状态的方法和材料，例如糖尿病患者用于监测血糖水平的传感器的状态。 通常，诸如电压脉冲的电压被施加到传感器，以便征求电流响应，例如可以导出诸如阻抗值的因素。 然后可以将这些值用作传感器状态的指示器，例如传感器水合状态，传感器噪声，传感器偏移，传感器漂移等。

公开(公告)号：US20100169035A1

公开(公告)日：2010-07-01

申请号：US12345354

申请日：2008-12-29

申请人： Bradley Chi Liang ,  Larry E. Tyler ,  Mohsen Askarinya ,  Charles Robert Gordon ,  Randal C. Schulhauser ,  Kenneth W. Cooper ,  Kris R. Holtzclaw ,  Brian T. Kannard ,  Rajiv Shah

发明人： Bradley Chi Liang ,  Larry E. Tyler ,  Mohsen Askarinya ,  Charles Robert Gordon ,  Randal C. Schulhauser ,  Kenneth W. Cooper ,  Kris R. Holtzclaw ,  Brian T. Kannard ,  Rajiv Shah

IPC分类号： G06F19/00 ,  G01R19/00 ,  G01R27/00

CPC分类号： A61B5/14532 ,  A61B5/14865

摘要： The invention disclosed herein provides methods and materials for observing the state of a sensor, for example those used by diabetic patients to monitor blood glucose levels. Typically a voltage such as a voltage pulse is applied to the sensor in order to solicit a current response from which for example, factors such as impedance values can be derived. Such values can then be used as indicators of a sensor's state, for example the state of sensor hydration, sensor noise, sensor offset, sensor drift or the like.

摘要翻译： 本文公开的本发明提供了用于观察传感器状态的方法和材料，例如糖尿病患者用于监测血糖水平的传感器的状态。 通常，诸如电压脉冲的电压被施加到传感器，以便征求电流响应，例如可以导出诸如阻抗值的因素。 然后可以将这些值用作传感器状态的指示器，例如传感器水合状态，传感器噪声，传感器偏移，传感器漂移等。

公开(公告)号：US08664756B2

公开(公告)日：2014-03-04

申请号：US13556385

申请日：2012-07-24

申请人： Mark R. Boone ,  Mohsen Askarinya ,  Larry E. Tyler

发明人： Mark R. Boone ,  Mohsen Askarinya ,  Larry E. Tyler

IPC分类号： H01L23/02 ,  H01L23/552 ,  H01L23/48

CPC分类号： H01L23/5389 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/20 ,  H01L29/402 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/12105 ,  H01L2924/00014 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/13099 ,  H01L2224/05552

摘要： A reconstituted wafer level package for a versatile high-voltage capable component is disclosed. The reconstituted wafer package includes a dice substantially encapsulated by a mold material except for a first face. A dielectric layer is disposed on the first face of the dice. The package further includes an array of ball bumps formed on an exterior facing portion of the dielectric layer. Further, a field plate is disposed within the dielectric material and interposed between the first face of the dice and the ball bump array. The field plate may be spaced from the dice by a predetermined distance to prevent dielectric breakdown of the material of the dielectric layer.

摘要翻译： 公开了一种用于多功能高压部件的重构晶片级封装。 重构的晶片封装包括基本上由除第一面之外的模具材料封装的芯片。 介电层设置在骰子的第一面上。 封装还包括形成在电介质层的外部面对部分上的球凸块阵列。 此外，场板设置在电介质材料内并插入在骰子的第一面和球凸块阵列之间。 场板可以与骰子隔开预定距离，以防止电介质层的材料的电介质击穿。

公开(公告)号：US20140027889A1

公开(公告)日：2014-01-30

申请号：US13556385

申请日：2012-07-24

申请人： Mark R. Boone ,  Mohsen Askarinya ,  Larry E. Tyler

发明人： Mark R. Boone ,  Mohsen Askarinya ,  Larry E. Tyler

IPC分类号： H01L23/495

CPC分类号： H01L23/5389 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/20 ,  H01L29/402 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/12105 ,  H01L2924/00014 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/13099 ,  H01L2224/05552

摘要： A reconstituted wafer level package for a versatile high-voltage capable component is disclosed. The reconstituted wafer package includes a dice substantially encapsulated by a mold material except for a first face. A dielectric layer is disposed on the first face of the dice. The package further includes an array of ball bumps formed on an exterior facing portion of the dielectric layer. Further, a field plate is disposed within the dielectric material and interposed between the first face of the dice and the ball bump array. The field plate may be spaced from the dice by a predetermined distance to prevent dielectric breakdown of the material of the dielectric layer.

摘要翻译： 公开了一种用于多功能高压部件的重构晶片级封装。 重构的晶片封装包括基本上由除第一面之外的模具材料封装的芯片。 介电层设置在骰子的第一面上。 封装还包括形成在电介质层的外部面对部分上的球凸块阵列。 此外，场板设置在电介质材料内并插入在骰子的第一面和球凸块阵列之间。 场板可以与骰子隔开预定距离，以防止电介质层的材料的电介质击穿。

公开(公告)号：US20120303105A1

公开(公告)日：2012-11-29

申请号：US13113720

申请日：2011-05-23

申请人： Mohsen Askarinya ,  Erik J. Herrmann

发明人： Mohsen Askarinya ,  Erik J. Herrmann

IPC分类号： A61N1/05 ,  H01R43/16

CPC分类号： A61N1/375 ,  A61N1/3754 ,  A61N1/3756 ,  Y10T29/49204

摘要： An IMD may include a liquid crystal polymer (LCP) outer housing defining an outer surface of the IMD, an electrical feedthrough extending through the LCP outer housing to the outer surface, and an electrode structure disposed on the outer surface. The electrode structure may include a LCP substrate defining a first major surface and a second major surface substantially opposite the first major surface, a contact pad disposed on the first major surface, and an electrode disposed on the second major surface. The LCP substrate may be attached to the LCP outer housing and the contact pad may be electrically coupled to the electrical feedthrough.

摘要翻译： IMD可以包括限定IMD的外表面的液晶聚合物（LCP）外壳，延伸穿过LCP外壳到外表面的电馈通，以及设置在外表面上的电极结构。 电极结构可以包括限定第一主表面的LCP衬底和与第一主表面大致相对的第二主表面，设置在第一主表面上的接触垫和设置在第二主表面上的电极。 LCP衬底可以附接到LCP外壳，并且接触焊盘可以电耦合到电馈通。

公开(公告)号：US08160834B2

公开(公告)日：2012-04-17

申请号：US13151601

申请日：2011-06-02

申请人： Bradley Chi Liang ,  Larry E. Tyler ,  Mohsen Askarinya ,  Charles R. Gordon ,  Randal C. Schulhauser ,  Kenneth W. Cooper ,  Kris R. Holtzclaw ,  Brian T. Kannard ,  Rajiv Shah

发明人： Bradley Chi Liang ,  Larry E. Tyler ,  Mohsen Askarinya ,  Charles R. Gordon ,  Randal C. Schulhauser ,  Kenneth W. Cooper ,  Kris R. Holtzclaw ,  Brian T. Kannard ,  Rajiv Shah

IPC分类号： G01C19/00 ,  G01C25/00 ,  G01R25/00

CPC分类号： A61B5/14532 ,  A61B5/14865

摘要： The invention disclosed herein provides methods and materials for observing the state of a sensor, for example those used by diabetic patients to monitor blood glucose levels. Typically a voltage such as a voltage pulse is applied to the sensor in order to solicit a current response from which for example, factors such as impedance values can be derived. Such values can then be used as indicators of a sensor's state, for example the state of sensor hydration, sensor noise, sensor offset, sensor drift or the like.

摘要翻译： 本文公开的本发明提供了用于观察传感器状态的方法和材料，例如糖尿病患者用于监测血糖水平的传感器的状态。 通常，诸如电压脉冲的电压被施加到传感器，以便征求电流响应，例如可以导出诸如阻抗值的因素。 然后可以将这些值用作传感器状态的指示器，例如传感器水合状态，传感器噪声，传感器偏移，传感器漂移等。

公开(公告)号：US20060152326A1

公开(公告)日：2006-07-13

申请号：US11034323

申请日：2005-01-12

申请人： Andreas Fenner ,  John Anderson ,  Mohsen Askarinya ,  Tina Abnoosi

发明人： Andreas Fenner ,  John Anderson ,  Mohsen Askarinya ,  Tina Abnoosi

IPC分类号： H01F27/28

CPC分类号： H01F27/2804 ,  A61N1/3956 ,  H01F2027/2819

摘要： Method and apparatus are provided for fabricating a planar transformer assembly for use in an implantable medical device. The planar transformer assembly includes a board, a first core, and a second core. The board has a first side, a second side, and an embedded winding, wherein the embedded winding includes a primary winding and a secondary winding and is at least partially embedded in the board between the first and second sides.

摘要翻译： 提供了用于制造用于可植入医疗装置的平面变压器组件的方法和装置。 平面变压器组件包括板，第一芯和第二芯。 该板具有第一面，第二面和嵌入式绕组，其中嵌入式绕组包括初级绕组和次级绕组，并且至少部分地嵌入在第一和第二侧之间的板中。