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1.发明授权公开(公告)号：US09252415B2
公开(公告)日：2016-02-02
申请号：US13524304
申请日：2012-06-15
IPC分类号： H01M2/10 , H01M2/20 , H01M2/24 , H01M2/26 , H01M10/0562 , H01M10/0585 , H01M10/647 , H01M6/40 , H01M6/46 , H01M2/22 , H01M10/04 , H01M10/0525 , A61N1/378 , A61N1/375
CPC分类号： H01M2/204 , A61N1/3758 , A61N1/378 , H01M2/1066 , H01M2/202 , H01M2/22 , H01M2/24 , H01M2/266 , H01M6/40 , H01M6/46 , H01M10/0436 , H01M10/0525 , H01M10/0562 , H01M10/0585 , H01M10/647 , Y02E60/122 , Y10T29/49112
摘要： Arrays of planar solid state batteries are stacked in an aligned arrangement for subsequent separation into individual battery stacks. Prior to stacking, a redistribution layer (RDL) is formed over a surface of each wafer that contains an array; each RDL includes first and second groups of conductive traces, each of the first extending laterally from a corresponding positive battery contact, and each of the second extending laterally from a corresponding negative battery contact. Conductive vias, formed before or after stacking, ultimately couple together corresponding contacts of aligned batteries. If before, each via extends through a corresponding battery contact of each wafer and is coupled to a corresponding conductive layer that is included in another RDL formed over an opposite surface of each wafer. If after, each via extends through corresponding aligned conductive traces and, upon separation of individual battery stacks, becomes an exposed conductive channel of a corresponding battery stack.
摘要翻译： 平面固态电池的阵列以对准的布置堆叠，以便随后分离成单独的电池堆叠。 在堆叠之前，在包含阵列的每个晶片的表面上形成重分布层（RDL）; 每个RDL包括第一和第二组导电迹线，每个导体迹线首先从对应的正电池触点横向延伸，并且每个第二组从相应的负电池触点横向延伸。 在堆叠之前或之后形成的导电通孔最终将对准的电池的相应触点耦合在一起。 如果之前，每个通孔延伸穿过每个晶片的对应的电池触点并且耦合到相应的导电层，该导电层被包括在形成于每个晶片的相对表面上的另一个RDL中。 如果之后，每个通孔延伸通过对应的对准的导电迹线，并且在单独的电池堆分离时，成为相应电池堆的暴露的导电通道。
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2.发明申请WAFER LEVEL PACKAGES OF HIGH VOLTAGE UNITS FOR IMPLANTABLE MEDICAL DEVICES AND CORRESPONDING FABRICATION METHODS 审中-公开用于可植入医疗器械的高压单元的水平包装和相应的制造方法公开(公告)号：US20130334680A1
公开(公告)日：2013-12-19
申请号：US13524253
申请日：2012-06-15
申请人： Mark R. Boone , Mohsen Askarinya , Randolph E. Crutchfield , Erik J. Herrmann , Mark S. Ricotta , Lejun Wang
发明人： Mark R. Boone , Mohsen Askarinya , Randolph E. Crutchfield , Erik J. Herrmann , Mark S. Ricotta , Lejun Wang
IPC分类号： H01L23/498 , H01L21/56
CPC分类号： A61N1/3956 , F04C2270/041 , H01L23/49548 , H01L23/49575 , H01L25/16 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2924/01015 , H01L2924/01047 , H01L2924/13055 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： A multi-chip modular wafer level package of a high voltage unit for an implantable cardiac defibrillator includes one or more high voltage (HV) component chips encapsulated with other components thereof in a polymer mold compound of a single reconstituted wafer, wherein all interconnect segments are preferably located on a single side of the wafer. To electrically couple a contact surface of each HV chip, located on a side of the chip opposite the interconnect side of the wafer, the reconstituted wafer may include conductive through polymer vias; alternately, either wire bonds or layers of conductive polymer are formed to couple the aforementioned contact surface to the corresponding interconnect, prior to encapsulation of the HV chips. In some cases one or more of the components encapsulated in the reconstituted wafer of the package are reconstituted chips.
摘要翻译： 用于可植入心脏除颤器的高电压单元的多芯片模块化晶片级封装包括在单个重构晶片的聚合物模具化合物中与其他组分封装的一个或多个高电压（HV）组件芯片，其中所有互连部分 优选地位于晶片的单侧上。 为了电耦合位于与晶片的互连侧相对的芯片侧的每个HV芯片的接触表面，重构的晶片可以包括导电的通过聚合物通孔; 交替地，在封装HV芯片之前，形成导线或者导电聚合物层以将上述接触表面耦合到相应的互连。 在一些情况下，封装在包装的重构晶片中的一种或多种组分是重组芯片。
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3.发明申请公开(公告)号：US20130337313A1
公开(公告)日：2013-12-19
申请号：US13524304
申请日：2012-06-15
CPC分类号： H01M2/204 , A61N1/3758 , A61N1/378 , H01M2/1066 , H01M2/202 , H01M2/22 , H01M2/24 , H01M2/266 , H01M6/40 , H01M6/46 , H01M10/0436 , H01M10/0525 , H01M10/0562 , H01M10/0585 , H01M10/647 , Y02E60/122 , Y10T29/49112
摘要： Arrays of planar solid state batteries are stacked in an aligned arrangement for subsequent separation into individual battery stacks. Prior to stacking, a redistribution layer (RDL) is formed over a surface of each wafer that contains an array; each RDL includes first and second groups of conductive traces, each of the first extending laterally from a corresponding positive battery contact, and each of the second extending laterally from a corresponding negative battery contact. Conductive vias, formed before or after stacking, ultimately couple together corresponding contacts of aligned batteries. If before, each via extends through a corresponding battery contact of each wafer and is coupled to a corresponding conductive layer that is included in another RDL formed over an opposite surface of each wafer. If after, each via extends through corresponding aligned conductive traces and, upon separation of individual battery stacks, becomes an exposed conductive channel of a corresponding battery stack.
摘要翻译： 平面固态电池的阵列以对准的布置堆叠，以便随后分离成单独的电池堆叠。 在堆叠之前，在包含阵列的每个晶片的表面上形成重分布层（RDL）; 每个RDL包括第一和第二组导电迹线，每个导体迹线首先从对应的正电池触点横向延伸，并且每个第二组从相应的负电池触点横向延伸。 在堆叠之前或之后形成的导电通孔最终将对准的电池的相应触点耦合在一起。 如果之前，每个通孔延伸穿过每个晶片的对应的电池触点并且耦合到相应的导电层，该导电层被包括在形成于每个晶片的相对表面上的另一个RDL中。 如果之后，每个通孔延伸通过对应的对准的导电迹线，并且在单独的电池堆分离时，成为相应电池堆的暴露的导电通道。
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公开(公告)号：US20120303105A1
公开(公告)日：2012-11-29
申请号：US13113720
申请日：2011-05-23
申请人： Mohsen Askarinya , Erik J. Herrmann
发明人： Mohsen Askarinya , Erik J. Herrmann
CPC分类号： A61N1/375 , A61N1/3754 , A61N1/3756 , Y10T29/49204
摘要： An IMD may include a liquid crystal polymer (LCP) outer housing defining an outer surface of the IMD, an electrical feedthrough extending through the LCP outer housing to the outer surface, and an electrode structure disposed on the outer surface. The electrode structure may include a LCP substrate defining a first major surface and a second major surface substantially opposite the first major surface, a contact pad disposed on the first major surface, and an electrode disposed on the second major surface. The LCP substrate may be attached to the LCP outer housing and the contact pad may be electrically coupled to the electrical feedthrough.
摘要翻译： IMD可以包括限定IMD的外表面的液晶聚合物（LCP）外壳，延伸穿过LCP外壳到外表面的电馈通，以及设置在外表面上的电极结构。 电极结构可以包括限定第一主表面的LCP衬底和与第一主表面大致相对的第二主表面，设置在第一主表面上的接触垫和设置在第二主表面上的电极。 LCP衬底可以附接到LCP外壳，并且接触焊盘可以电耦合到电馈通。
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公开(公告)号：US20120300421A1
公开(公告)日：2012-11-29
申请号：US13113685
申请日：2011-05-23
申请人： Mohsen Askarinya , Erik J. Herrmann
发明人： Mohsen Askarinya , Erik J. Herrmann
CPC分类号： A61M5/14276 , A61M2205/02 , A61M2205/0244 , A61M2205/04 , A61M2205/8243 , H05K3/284 , Y10T29/49117 , Y10T29/49124
摘要： An implantable medical device (IMD) may include a liquid crystal polymer (LCP) outer housing defining an outer surface of the IMD, circuitry disposed within the LCP outer housing, and an electrical feedthrough extending from a first end proximate the circuitry to a second end proximate to the outer surface. The electrical feedthrough may define a major axis extending between the first end and the second end, wherein the electrical feedthrough comprises non-uniform width measured in a direction along a plane substantially orthogonal to the major axis.
摘要翻译： 可植入医疗装置（IMD）可以包括限定IMD的外表面的液晶聚合物（LCP）外壳，设置在LCP外壳内的电路，以及从靠近电路的第一端延伸到第二端的电馈通 靠近外表面。 电馈通可以限定在第一端和第二端之间延伸的长轴，其中电馈通包括在沿着与主轴正交的平面的方向上测量的不均匀宽度。
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公开(公告)号：US20120065497A1
公开(公告)日：2012-03-15
申请号：US12879752
申请日：2010-09-10
申请人： Richard L. Brown , Erik J. Herrmann
发明人： Richard L. Brown , Erik J. Herrmann
IPC分类号： A61B8/08
CPC分类号： A61B90/39 , A61B8/0833 , A61B8/0875 , A61B8/483 , A61B34/20 , A61B2034/2063 , A61B2090/3929
摘要： A method and system is disclosed that is operable to generate a location value associated with an implant that has been implanted in a predetermined location of a vertebra of a spine. The location value can be utilized to generate a three-dimensional animation of the spine in motion. The system includes a plurality of implants that include a controller having a memory. The implants also include a telemetry unit connected with the controller that is used to wirelessly transmit and receive data. In addition, the implants include an acoustic generator that is configured to generate an acoustic pulse in response to a signal from the controller. An external control unit is wirelessly connected with the implant for receiving various data values from the implant.
摘要翻译： 公开了一种方法和系统，其可操作以产生与已经植入脊柱脊椎的预定位置的植入物相关联的位置值。 位置值可用于产生运动中脊柱的三维动画。 该系统包括多个植入物，其包括具有存储器的控制器。 植入物还包括与用于无线地发送和接收数据的控制器连接的遥测单元。 此外，植入物包括响应于来自控制器的信号而被配置为产生声脉冲的声发生器。 外部控制单元与植入物无线连接，用于从植入物接收各种数据值。
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公开(公告)号：US09168384B2
公开(公告)日：2015-10-27
申请号：US13113720
申请日：2011-05-23
申请人： Mohsen Askarinya , Erik J. Herrmann
发明人： Mohsen Askarinya , Erik J. Herrmann
CPC分类号： A61N1/375 , A61N1/3754 , A61N1/3756 , Y10T29/49204
摘要： An IMD may include a liquid crystal polymer (LCP) outer housing defining an outer surface of the IMD, an electrical feedthrough extending through the LCP outer housing to the outer surface, and an electrode structure disposed on the outer surface. The electrode structure may include a LCP substrate defining a first major surface and a second major surface substantially opposite the first major surface, a contact pad disposed on the first major surface, and an electrode disposed on the second major surface. The LCP substrate may be attached to the LCP outer housing and the contact pad may be electrically coupled to the electrical feedthrough.
摘要翻译： IMD可以包括限定IMD的外表面的液晶聚合物（LCP）外壳，延伸穿过LCP外壳到外表面的电馈通，以及设置在外表面上的电极结构。 电极结构可以包括限定第一主表面的LCP衬底和与第一主表面大致相对的第二主表面，设置在第一主表面上的接触垫和设置在第二主表面上的电极。 LCP衬底可以附接到LCP外壳，并且接触焊盘可以电耦合到电馈通。
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公开(公告)号：US11213690B2
公开(公告)日：2022-01-04
申请号：US13524253
申请日：2012-06-15
申请人： Mark R. Boone , Mohsen Askarinya , Randolph E. Crutchfield , Erik J. Herrmann , Mark S. Ricotta , Lejun Wang
发明人： Mark R. Boone , Mohsen Askarinya , Randolph E. Crutchfield , Erik J. Herrmann , Mark S. Ricotta , Lejun Wang
IPC分类号： H01L23/48 , A61N1/39 , H01L23/495 , H01L25/16
摘要： A multi-chip modular wafer level package of a high voltage unit for an implantable cardiac defibrillator includes one or more high voltage (HV) component chips encapsulated with other components thereof in a polymer mold compound of a single reconstituted wafer, wherein all interconnect segments are preferably located on a single side of the wafer. To electrically couple a contact surface of each HV chip, located on a side of the chip opposite the interconnect side of the wafer, the reconstituted wafer may include conductive through polymer vias; alternately, either wire bonds or layers of conductive polymer are formed to couple the aforementioned contact surface to the corresponding interconnect, prior to encapsulation of the HV chips. In some cases one or more of the components encapsulated in the reconstituted wafer of the package are reconstituted chips.
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