公开(公告)号：US20100251825A1

公开(公告)日：2010-10-07

申请号：US12819958

申请日：2010-06-21

Applicant: Anthony D. Kurtz ,  Nora Kurtz

Inventor： Anthony D. Kurtz ,  Nora Kurtz

IPC: G01L9/06

CPC classification number: G01L19/0645 ,  G01L15/00 ,  G01L19/0038

Abstract: A combined wet-wet differential transducer and a gage pressure transducer located in the same housing, comprising a semiconductor chip which comprises a gage sensor chip on one section and a differential sensor chip on a second section. Each sensor chip has a Wheatstone bridge comprising piezoresistors and is responsive to an applied pressure. The gage chip and the differential chip are placed in a header having a front section and a back section adapted to receive a first and second pressure, respectively. The sensors are in communication with first and second pressure ports such that the absolute sensor provides an output indicative of a pressure applied to a first port and the differential sensor provides an output indicative of the pressure difference between the first and second pressure ports.

Abstract translation: 一种组合的湿湿差压换能器和位于同一壳体中的量规压力传感器，包括半导体芯片，其包括一个部分上的量规传感器芯片和在第二部分上的差分传感器芯片。 每个传感器芯片具有包括压敏电阻器的惠斯通电桥，并且响应所施加的压力。 计量芯片和差分芯片被放置在具有分别适于接收第一和第二压力的前部分和后部部分的集管中。 传感器与第一和第二压力端口连通，使得绝对传感器提供指示施加到第一端口的压力的输出，并且差动传感器提供指示第一和第二压力端口之间的压力差的输出。

公开(公告)号：US07779682B2

公开(公告)日：2010-08-24

申请号：US12074314

申请日：2008-10-06

Applicant: Anthony D. Kurtz ,  Robert Gardner ,  Richard Martin ,  Leo Geras

Inventor： Anthony D. Kurtz ,  Robert Gardner ,  Richard Martin ,  Leo Geras

IPC: B60C23/02

CPC classification number: G01L17/00 ,  B60C23/0408 ,  B60C23/0496

Abstract: A pressure transducer, particularly adapted to measure the pressure in a tire and to enable the tire to be filled includes a first housing, having an internal hollow. Positioned in the hollow of the first housing is a second housing, also having an internal hollow. The second housing is supported within the first housing so that a passageway for airflow exists between the housings. The second housing has a pressure port for monitoring the pressure of a tire. The first housing has an inlet port for receiving a source of pressure. The inlet port contains a valve which is selectively operated. The valve, when operated, permits air to flow into the hollow of the first housing and to flow about the periphery of the second housing to enter the pressure port associated with the second housing. The pressure port may, as indicated, be associated with a tire and the second housing contains a pressure sensing device which monitors the pressure in the tire via the pressure port. In this manner, the pressure in the tire can be monitored while additional air can be added through the valve which air flows around the second housing to enter the tire or other device coupled to the pressure transducer.

Abstract translation: 特别适用于测量轮胎中的压力并使轮胎能够被填充的压力传感器包括具有内部空心的第一壳体。 位于第一壳体的中空部分中的是具有内部空心的第二壳体。 第二壳体被支撑在第一壳体内，使得在壳体之间存在气流通道。 第二壳体具有用于监测轮胎压力的压力端口。 第一壳体具有用于接收压力源的入口。 入口端口包含选择性操作的阀。 该阀在操作时允许空气流入第一壳体的中空部并且绕第二壳体的周边流动以进入与第二壳体相关联的压力端口。 如图所示，压力端口可以与轮胎相关联，并且第二壳体包含经由压力端口监测轮胎中的压力的​​压力感测装置。 以这种方式，可以监测轮胎中的压力，同时可以通过阀添加额外的空气，其中空气围绕第二壳体流动以进入轮胎或联接到压力传感器的其它装置。

公开(公告)号：US07762139B2

公开(公告)日：2010-07-27

申请号：US12313761

申请日：2008-11-24

Applicant: Anthony D. Kurtz ,  Scott Goodman

Inventor： Anthony D. Kurtz ,  Scott Goodman

IPC: G01L7/00

CPC classification number: G01L13/025 ,  G01L19/143

Abstract: A pressure header assembly has a closed front and back surface. The back surface has an aperture for accommodating a separate dual die pressure header. The dual die pressure header has an absolute and differential pressure sensor positioned thereon. A differential pressure port is located on a side surface of the pressure header assembly and is directed to a bore in the pressure header assembly. The bore contains an elongated tube which is positioned in the pressure header assembly and locked in place by means of a crush nut and locking nut assembly. One end of the tube is coupled to the differential pressure port, while the other end of the tube accommodates a differential pressure tube which is bent in an arcuate position and directed to the underside of the sensor of the differential sensor assembly mounted in the dual die pressure header. Suitable leads from the dual die pressure header assembly are directed to a terminal board which is mounted within a pressure transducer housing shell, which terminal board coacts with an outboard contact cap assembly forming the transducer. The pressure header assembly portion also contains extending tabs which have apertures for external mounting.

Abstract translation: 压头组件具有封闭的前表面和后表面。 后表面具有用于容纳单独的双模压头的孔。 双模压头具有位于其上的绝对压差传感器和差压传感器。 差压端口位于压力总成组件的侧表面上并且被引导到压力头组件中的孔。 该孔包含一个细长管，该细长管位于压力总成组件中，并通过一个挤压螺母和锁定螺母组件锁定在适当位置。 管的一端连接到差压端口，而管的另一端容纳差压管，该压差管弯曲成弓形位置并且引导到安装在双模中的差动传感器组件的传感器的下侧 压力头。 来自双模压力集管组件的合适引线被引导到端子板，该端子板安装在压力传感器壳体壳体内，该端子板与形成换能器的外侧接触盖组件共同作用。 压头组件部分还包含具有用于外部安装的孔的延伸突片。

公开(公告)号：US20100185403A1

公开(公告)日：2010-07-22

申请号：US12321521

申请日：2009-01-22

Applicant: Anthony D. Kurtz ,  Alexander A. Ned ,  Joseph Van DeWeert

Inventor： Anthony D. Kurtz ,  Alexander A. Ned ,  Joseph Van DeWeert

IPC: G01L9/06 ,  G01M9/02

CPC classification number: G01L9/00 ,  G01L9/065 ,  G01L15/00 ,  G01M9/06

Abstract: A system for measuring a multiplicity of pressures as those experienced by a model in a wind tunnel is depicted. The system includes individual sensor devices which are connected to an Acquisition and Compensation electronics module. The individual sensor or transducer devices are semiconductor piezoresistive devices and are connected to the Acquisition and Compensation electronics module by means of a cable in a first embodiment. In an alternate embodiment the system uses connectors which connect each of the individual sensor devices to the Acquisition and Compensation electronics module via a mating connector located therein. The connectors may also include a memory which stores compensation coefficients associated with each of the various sensor devices. In this manner as described, the transducers which are small devices are connected via electrical lines or cables to the central Acquisition and Compensation electronics modules. This module houses electronics which digitally converts the data from the sensors and then compensates the data for temperature effects. The advantage of the system is that each individual sensor does not have any compensation and it can be made very small to operate at very high temperatures without any loss of accuracy. Thus, a large number of sensors can be utilized in a very small volume, even under extreme environmental conditions. It is noted that the Acquisition and Compensation electronics module can be located remotely in a safe environment outside of the wind tunnel and therefore respond extremely accurately to the pressure and temperatures subjected by the model in the wind tunnel.

Abstract translation: 描绘了一种用于测量如风洞中的模型所经历的多种压力的系统。 该系统包括连接到采集和补偿电子模块的各个传感器设备。 单独的传感器或换能器装置是半导体压阻器件，并且在第一实施例中通过电缆连接到采集和补偿电子模块。 在替代实施例中，系统使用通过位于其中的匹配连接器将各个传感器设备中的每一个连接到采集和补偿电子模块的连接器。 连接器还可以包括存储器，其存储与各种传感器装置中的每一个相关联的补偿系数。 以这种方式，小型设备的换能器通过电线或电缆连接到中央采集和补偿电子模块。 该模块内置电子设备，数字转换传感器的数据，然后补偿温度影响的数据。 该系统的优点是每个传感器不具有任何补偿，并且可以使其非常小以在非常高的温度下工作，而不会有任何的精度损失。 因此，即使在极端的环境条件下，也可以以非常小的体积使用大量的传感器。 需要注意的是，采集和补偿电子模块可以远程位于风洞外的安全环境中，因此对风洞中模型所承受的压力和温度非常准确地做出反应。

公开(公告)号：US20100083764A1

公开(公告)日：2010-04-08

申请号：US12286810

申请日：2008-10-02

Applicant: Anthony D. Kurtz

Inventor： Anthony D. Kurtz

IPC: G01L9/06

CPC classification number: G01L9/0054 ,  G01L13/025 ,  G01L15/00

Abstract: There is disclosed a redundant pressure sensing chip which includes first and second redundant devices. Each pressure sensing device produces an output proportional to applied pressure irrespective of vibration/acceleration of the device. Each device also provides an output proportional to pressure and because of the nature of the devices, thermal effects as well as acceleration and the vibration are canceled. Based on chip operation and subtracting the signals from the two diaphragms, acceleration/vibration is canceled but also the effects of absolute pressure and differential pressure is also canceled. Therefore the chip can be used as a redundant absolute pressure sensor as well as a differential pressure sensor.

Abstract translation: 公开了一种包括第一和第二冗余设备的冗余压力感测芯片。 每个压力感测装置产生与施加的压力成比例的输出，而与装置的振动/加速度无关。 每个设备还提供与压力成比例的输出，并且由于设备的性质，热效应以及加速度和振动被消除。 基于芯片操作和减去两个隔膜的信号，加速/振动被取消，绝对压力和压差的影响也被取消。 因此，该芯片可用作冗余绝对压力传感器以及差压传感器。

公开(公告)号：US20100016990A1

公开(公告)日：2010-01-21

申请号：US12220012

申请日：2008-07-21

Applicant: Anthony D. Kurtz

Inventor： Anthony D. Kurtz

IPC: A61F2/48

CPC classification number: A61F2/58 ,  A61F2/68 ,  A61F2/72 ,  A61F2002/5061 ,  A61F2002/6827 ,  A61F2002/701 ,  A61F2002/704 ,  A61F2002/705 ,  A61F2002/707 ,  A61F2002/7635

Abstract: A medical system employs wireless transmission and provides sensory signals to a user of a prosthetic or other medical device. A series of pressure, force or strain sensors are placed upon various areas of the prosthetic device. The sensors are strategically placed according to anticipated functions of the prosthetic device and the sensors may be placed in clusters, where each cluster may include more than one sensor. The prosthetic device is normally operated by a biometric controller. The biometric controller is controlled by the handicapped user via muscles or other devices to enable the prosthetic device to perform various desired functions. During performing of such functions, the sensors will respond and produce outputs according to applied pressure or strain. These voltage outputs are transmitted by a transmitter to a remote receiver which is located on the body or person of the handicapped user. The receiver demodulates the transmitted signal to provide output signals proportional to the sensor signals as transmitted. These output signals are then directed to electrodes, probes or terminal pads imbedded in the body of the handicapped user by a physician or suitable technician. The imbedded probes or electrodes receive the sensor signals from the receiver and operate to stimulate the nerves so that a user can receive signals indicative of the force applied to given areas of the prosthetic device. In this manner the user can better control prosthetic device operation.

Abstract translation: 医疗系统采用无线传输，并向假肢或其他医疗设备的用户提供感觉信号。 将一系列压力，力或应变传感器放置在假体装置的各个区域上。 传感器根据假肢装置的预期功能被策略地放置，并且传感器可以被放置在群集中，其中每个群集可以包括多于一个的传感器。 假体装置通常由生物计量控制器操作。 生物统计控制器由残疾用户通过肌肉或其他装置来控制，以使假肢装置执行各种所需的功能。 在执行这些功能时，传感器将根据施加的压力或应变响应并产生输出。 这些电压输出由发射机传输到位于身体或残疾人的人身上的远程接收器。 接收机解调发射信号，以提供与传输信号成比例的输出信号。 然后，这些输出信号被医生或合适的技术人员引导到嵌入在残疾人使用者的身体中的电极，探针或端子垫。 嵌入的探针或电极从接收器接收传感器信号并且操作以刺激神经，使得用户可以接收指示施加于假体装置的给定区域的力的信号。 以这种方式，用户可以更好地控制假肢装置的操作。

公开(公告)号：US20090280002A1

公开(公告)日：2009-11-12

申请号：US12387078

申请日：2009-04-28

Applicant: Tonghuo Shang ,  Anthony D. Kurtz

Inventor： Tonghuo Shang ,  Anthony D. Kurtz

IPC: F01D11/18 ,  F01D25/00

CPC classification number: G01B13/12 ,  F01D11/06 ,  F01D11/20 ,  F05D2270/301

Abstract: A system for sensing at least one physical characteristic associated with an engine including a turbine having a plurality of blades turning inside a casing, the system including: a pressure sensor coupled substantially adjacent to the casing and including at least one output; a port in the turbine casing for communicating a pressure indicative of a clearance between the blades and casing to the pressure sensor; a cooling cavity substantially surrounding the pressure sensor; and, an inlet for receiving fluid from the engine and feeding the fluid to the cooling cavity to cool the pressure sensor; wherein, the pressure sensor output is indicative of the clearance between the blades and casing.

公开(公告)号：US20090160069A1

公开(公告)日：2009-06-25

申请号：US12004638

申请日：2007-12-22

Applicant: Anthony D. Kurtz ,  Joseph Van DeWeert

Inventor： Anthony D. Kurtz ,  Joseph Van DeWeert

IPC: H01L23/52 ,  H01L21/00

CPC classification number: G01L19/0069 ,  G01L19/147 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/8114 ,  H01L2224/81191 ,  H01L2924/15788

Abstract: There is disclosed a mounting technique for mounting a semiconductor chip of the leadless or so-called flip chip type to a header. The header has an insert made of glass or other suitable non-conductive material within the header hollow. Mounted into the glass insert are a series of conductive metal pins which are placed in areas so that when a chip is mounted in the header, the chip makes contact with these conductive pins and allows one to make outside connections. Also positioned in the header are a series of nonconductive guide pins. These pins are placed in suitable positions in the header to enable one to contact the outside surfaces of the chip when the chip is placed in the header. In this manner, the chip is constrained from movement from side to side or from rotation. However, due to the positioning of the nonconductive pins within the header, it is possible to move the chip up and down while mounting.

Abstract translation: 公开了一种用于将无引线或所谓的倒装芯片类型的半导体芯片安装到集管上的安装技术。 集管具有由玻璃或其他合适的非导电材料制成的插入件在集管空腔内。 安装在玻璃插入件中的是一系列导电金属销，它们放置在区域中，使得当芯片安装在集管中时，芯片与这些导电引脚接触并允许外部连接。 还设置在集管中的是一系列不导电的导向销。 这些引脚放置在插头中的适当位置，以便当芯片放置在插头中时，可使它们接触芯片的外表面。 以这种方式，芯片被限制为从一侧移动到另一侧或从旋转移动。 然而，由于不导电销在集管内的定位，可以在安装时上下移动芯片。

公开(公告)号：US07516675B2

公开(公告)日：2009-04-14

申请号：US11824920

申请日：2007-07-03

Applicant: Anthony D. Kurtz ,  Adam Kane ,  Richard J. Martin

Inventor： Anthony D. Kurtz ,  Adam Kane ,  Richard J. Martin

IPC: G01D7/00

CPC classification number: G01L5/223 ,  G05G2009/04762

Abstract: A joystick apparatus employs a hermetically sealed load cell having strain gauges placed on flexible beams formed on the load cell. All of the strain gauges are on the same surface of the load cell and therefore wiring is performed on a single side of the load cell. The strain gauges are enclosed in hermetically sealed cavity. The sensing diaphragm consists of a concentric thick inner and outer section joined by thinner diametrically opposed beam elements. The thin beam elements are compliant members which can deflect. Each beam includes strain gauges or sensor elements and the load cell is coupled to a joystick which when moved causes the beams to deflect to cause the sensor elements to produce an electrical output proportional to the force and direction of the joystick. The sensor can yield an output proportional to any angle over the 360° movement of the joystick to provide outputs proportional to the X and Y positions of said joystick. Thus, the joystick arrangement can resolve any angle or force into X and Y components for full directional control.

公开(公告)号：US20090078547A1

公开(公告)日：2009-03-26

申请号：US11903450

申请日：2007-09-21

Applicant: Anthony D. Kurtz ,  Joseph Van DeWeert

Inventor： Anthony D. Kurtz ,  Joseph Van DeWeert

IPC: H01H35/24 ,  H01H35/34

CPC classification number: H01H35/34 ,  G01L1/18 ,  G01L1/20 ,  H01H1/0036 ,  H01H35/2657 ,  H01H2001/0084

Abstract: A pressure switch employs semiconductor silicon on insulator (SOI) technology and utilizes a first silicon wafer which has a deflecting diaphragm. Deposited on the wafer is at least one distinct metal contact. Secured to the semiconductor wafer is a glass wafer having a central aperture defining a deflecting region. Positioned on top of the glass wafer is another metal contact which is positioned to receive the two contacts deposited on the silicon wafer when a given pressure is applied to the silicon wafer. The metal contact on the silicon wafer is connected to a header pin, via apertures formed in the glass wafer, the apertures are filled with a conductive glass metal frit so that contact is made between the header pins and the metal contacts deposited on the silicon wafer. Operation is such that when a pressure is applied of a given magnitude the contact on the silicon wafer will contact the metal contact trace on the glass wafer and therefore a connection would be made between the first metal trace and the second metal trace to create a low impedance path between the two traces thereby connecting the first trace on the silicon wafer to the second trace on the glass wafer. This creates a high impedance or open circuit in a first state and when the pressure exceeds the threshold a slow impedance or short circuit in a second state.

Abstract translation: 压力开关采用半导体绝缘体（SOI）技术，并利用具有偏转膜片的第一硅晶片。 沉积在晶片上的是至少一种不同的金属接触。 安装到半导体晶片的是具有限定偏转区域的中心孔的玻璃晶片。 位于玻璃晶片顶部的另一个金属接触件被定位成当向硅晶片施加给定的压力时接收沉积在硅晶片上的两个触点。 硅晶片上的金属接触通过形成在玻璃晶片中的孔连接到集管引脚，孔被导电玻璃金属玻璃料填充，使得在集管引脚和沉积在硅晶片上的金属触点之间形成接触 。 操作使得当施加给定幅度的压力时，硅晶片上的接触将接触玻璃晶片上的金属接触迹线，因此将在第一金属迹线和第二金属迹线之间形成连接以产生低 两个迹线之间的阻抗路径，从而将硅晶片上的第一迹线连接到玻璃晶片上的第二迹线。 这在第一状态下产生高阻抗或开路，并且当压力超过阈值时，在第二状态下产生缓慢的阻抗或短路。