Housing features of an electronic device
    11.
    发明授权
    Housing features of an electronic device 有权
    电子设备的外壳特性

    公开(公告)号:US09591110B2

    公开(公告)日:2017-03-07

    申请号:US14618744

    申请日:2015-02-10

    Applicant: Apple Inc.

    CPC classification number: H04M1/0249

    Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.

    Abstract translation: 公开了一种用于形成外壳的外壳和方法。 外壳可以由诸如铝的金属形成,并且还包括允许透射和接收电磁波的非金属部分。 非金属部分可以互锁到外壳,特别是与外壳内的区域相连,包括与非金属部分相比具有相对高的强度和刚度的第一材料。 联锁装置可以包括形成燕尾切口进入外壳以接纳非金属部分,钻入包围内部的孔或空腔,其包括内螺纹,以及插入第一材料中的杆以向非金属部分提供张力。 还公开了使用阳极氧化组装内部部件的方法。

    SENSOR ASSEMBLIES FOR ELECTRONIC DEVICES

    公开(公告)号:US20210191458A1

    公开(公告)日:2021-06-24

    申请号:US17192722

    申请日:2021-03-04

    Applicant: Apple Inc.

    Abstract: Sensor assemblies for electronic devices are described. According to some embodiments, the sensor assemblies include solid-state sensors, such as capacitive sensors, piezoelectric sensors or piezoresistive sensors. The sensor assemblies can include a number of features that provide a compact profile, making them well suited for integration into small spaces of electronic device enclosures. The sensor assemblies can also include features that isolate movement of various parts of the sensor assemblies, allowing for accurate detection of a sensing event. According to some embodiments, the sensor assemblies are coupled to haptic actuators, speaker, or both, which mimic the feel of a mechanical button and enhance a user's experience.

    Housing features of an electronic device

    公开(公告)号:US11070655B2

    公开(公告)日:2021-07-20

    申请号:US16740668

    申请日:2020-01-13

    Applicant: Apple Inc.

    Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.

    HOUSING FEATURES OF AN ELECTRONIC DEVICE
    20.
    发明申请

    公开(公告)号:US20200153950A1

    公开(公告)日:2020-05-14

    申请号:US16740668

    申请日:2020-01-13

    Applicant: Apple Inc.

    Abstract: An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.

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