Multi-Tier Co-Placement for Integrated Circuitry

    公开(公告)号:US20190303523A1

    公开(公告)日:2019-10-03

    申请号:US15939047

    申请日:2018-03-28

    Applicant: Arm Limited

    Abstract: Various implementations described herein are directed to a method that defines tiers of an integrated circuit having standard cells placed adjacent to each other in a multi-tier placement. The integrated circuit includes multi-tier nets connected with inter-tier connections. The method includes pairing inter-tier connections as inter-tier-connection pairs belonging to a same net. The method includes grouping standard cells in groups with or without inter-tier-connection pairs from the tiers. The method includes relating the standard cells with or without inter-tier-connection pairs within each group from the groups by generating a multi-tier fence boundary around physical locations of the standard cells with or without inter-tier-connection pairs. The method includes iteratively adjusting a location of the standard cells with or without a location of inter-tier connections so as to converge the location of the standard cells with or without the location of the inter-tier connections to optimized or legal locations.

    Wirelength Distribution Schemes and Techniques

    公开(公告)号:US20190163860A1

    公开(公告)日:2019-05-30

    申请号:US15826649

    申请日:2017-11-29

    Applicant: Arm Limited

    Abstract: Implementations described herein are directed to a device with a processor and memory having stored thereon instructions that, when executed by the processor, cause the processor to acquire an integrated circuit layout of physical cells from a database and define wirelength relationships between input/output connections and a cell count for the physical cells in multiple domains. The instructions may cause the processor to define wirelength parameters of the integrated circuit layout in each domain of the multiple domains and generate a data file for the integrated circuit layout of the physical cells based on the wirelength relationships and the wirelength parameters to guide power and performance of the integrated circuit layout of the physical cells. The instructions may cause the processor to fabricate, or contribute to the fabrication of, an integrated circuit based on the data file for the integrated circuit layout of the physical cells.

    OPTICAL WAVEGUIDE CONNECTING DEVICE

    公开(公告)号:US20210389520A1

    公开(公告)日:2021-12-16

    申请号:US17288498

    申请日:2019-10-23

    Applicant: Arm Limited

    Abstract: Disclosed are devices and techniques for facilitating transmission of light signals between optical waveguides formed on integrated circuit (IC) devices. In an implementation, one or more first waveguides may be formed in a structure such that at least a portion of the one or more first waveguides are exposed for optical connectivity. The structure may comprise first features to enable the structure to be interlocked with an IC device comprising second features complementary with the first features, so as to align at least a portion of the one or more first waveguides exposed to optically couple with one or more second waveguides formed in the first integrated circuit device.

    Multi-tier co-placement for integrated circuitry

    公开(公告)号:US11120191B2

    公开(公告)日:2021-09-14

    申请号:US16820471

    申请日:2020-03-16

    Applicant: Arm Limited

    Abstract: Various implementations described herein are directed to a method that defines tiers of an integrated circuit having standard cells placed adjacent to each other in a multi-tier placement. The integrated circuit includes multi-tier nets connected with inter-tier connections. The method includes pairing inter-tier connections as inter-tier-connection pairs belonging to a same net. The method includes grouping standard cells in groups with or without inter-tier-connection pairs from the tiers. The method includes relating the standard cells with or without inter-tier-connection pairs within each group from the groups by generating a multi-tier fence boundary around physical locations of the standard cells with or without inter-tier-connection pairs. The method includes iteratively adjusting a location of the standard cells with or without a location of inter-tier connections so as to converge the location of the standard cells with or without the location of the inter-tier connections to optimized locations or legal locations.

    Wirelength distribution schemes and techniques

    公开(公告)号:US10657218B2

    公开(公告)日:2020-05-19

    申请号:US15826649

    申请日:2017-11-29

    Applicant: Arm Limited

    Abstract: Implementations described herein are directed to a device with a processor and memory having stored thereon instructions that, when executed by the processor, cause the processor to acquire an integrated circuit layout of physical cells from a database and define wirelength relationships between input/output connections and a cell count for the physical cells in multiple domains. The instructions may cause the processor to define wirelength parameters of the integrated circuit layout in each domain of the multiple domains and generate a data file for the integrated circuit layout of the physical cells based on the wirelength relationships and the wirelength parameters to guide power and performance of the integrated circuit layout of the physical cells. The instructions may cause the processor to fabricate, or contribute to the fabrication of, an integrated circuit based on the data file for the integrated circuit layout of the physical cells.

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