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公开(公告)号：US20220013398A1
公开(公告)日：2022-01-13
申请号：US17295036
申请日：2020-05-09
发明人： Lili WANG , Chuhang WANG , Chao LIU , Qiangwei CUI , Ke MENG , Linhui GONG
IPC分类号： H01L21/683 , H01L25/075 , H01L33/62
摘要： A micro-LED transfer method, including: moving a passing substrate to a position above a donor substrate and moving the pasting substrate in a direction approaching the donor substrate to paste up LED grains so that the LED grains are separated from the bearing substrate; moving the pasting substrate with the LED grains to a position above a target substrate with the LED grains being closer to the target substrate than the pasting substrate, and conducting an alignment so that the LED grains are directly opposite to positions on the target substrate where the LED grains are to be arranged; and heating the pasting substrate with the LED grains to a first temperature greater than or equal to a melting temperature of the hot melt adhesive film to melt the hot melt adhesive film, so that the LED grains are separated from the pasting substrate and transferred to the target substrate.
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公开(公告)号：US20200312820A1
公开(公告)日：2020-10-01
申请号：US16753955
申请日：2019-05-28
发明人： Chao LIU , Yujun ZHANG , Jing YU
IPC分类号： H01L25/075 , H05K1/18 , H05K3/32
摘要： The present disclosure relates to a display panel and a method for manufacturing a display panel. The display panel includes a first substrate having a first wiring, a second substrate having a second wiring, the first substrate, and the second substrate being laminated on each other to form a laminated structure, and a third wiring located on a side surface of the laminated structure, wherein the third wiring connects the first wiring and the second wiring.
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13.发明申请公开(公告)号：US20170004970A1
公开(公告)日：2017-01-05
申请号：US14908678
申请日：2015-07-16
发明人： Yanan NIU , Chao LIU , Zengsheng HE , Lei CHEN , Yujun ZHANG
IPC分类号： H01L21/02 , H01L27/12 , H01L29/786 , H01L21/308 , H01L29/66
CPC分类号： H01L21/02675 , H01L21/02057 , H01L21/02532 , H01L21/02592 , H01L21/02686 , H01L21/3085 , H01L21/3086 , H01L27/1222 , H01L27/1274 , H01L27/1285 , H01L27/1288 , H01L27/1296 , H01L29/66757 , H01L29/786 , H01L29/78675
摘要： A method of manufacturing a low temperature polycrystalline silicon thin film and a thin film transistor, a thin film transistor, a display panel and a display device are provided. The method includes: forming an amorphous silicon thin film (01) on a substrate (1); forming a pattern of a silicon oxide thin film (02) covering the amorphous silicon thin film (01), a thickness of the silicon oxide thin film (02) located at a preset region being larger than that of the silicon oxide thin film (02) located at other regions; and irradiating the silicon oxide thin film (02) by using excimer laser to allow the amorphous silicon thin film (01) forming an initial polycrystalline silicon thin film (04), the initial polycrystalline silicon thin film (04) located at the preset region being a target low temperature polycrystalline silicon thin film (05). The polycrystalline silicon thin film has more uniform crystal size.
摘要翻译： 提供一种制造低温多晶硅薄膜和薄膜晶体管，薄膜晶体管，显示面板和显示装置的方法。 该方法包括：在衬底（1）上形成非晶硅薄膜（01）; 形成覆盖非晶硅薄膜（01）的氧化硅薄膜（02）的图案，位于比氧化硅薄膜（02）的预设区域大的氧化硅薄膜（02）的厚度 ）位于其他地区 通过使用准分子激光照射氧化硅薄膜（02），使形成初始多晶硅薄膜（04）的非晶硅薄膜（01），位于预设区域的初始多晶硅薄膜（04）为 目标低温多晶硅薄膜（05）。 多晶硅薄膜具有更均匀的晶体尺寸。
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公开(公告)号：US20240284702A1
公开(公告)日：2024-08-22
申请号：US18025062
申请日：2022-05-31
发明人： Yongkai WU , Zhengping XIONG , Yunzhi WANG , Haoyuan FAN , Bo ZHANG , Jinyu CHAO , Shuaimin JIAN , Yixiang YANG , Gaoyun WANG , Chao LIU
IPC分类号： H10K50/842 , H10K59/40 , H10K59/80 , H10K102/00
CPC分类号： H10K50/8423 , H10K59/40 , H10K59/873 , H10K2102/311
摘要： Provides are a display panel, a display module, and a display device. The display panel includes an opening region, a barrier region surrounding the opening region, a display region surrounding the barrier region, a base substrate, a crack blocking structure surrounding the opening region; a barrier wall surrounding the crack blocking structure. The barrier wall and the crack blocking structure include a first metal layer and a first organic layer, an edge of side of the first metal layer away from the base substrate is indented relative to an edge of side of the first organic layer proximal to the base substrate. The barrier wall and the crack blocking structure includes a deep groove penetrating through a film layer between the first organic layer and the base substrate, the deep groove surrounds the opening region. The first organic layer fills the deep groove and is connected to the base substrate.
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公开(公告)号：US20210296394A1
公开(公告)日：2021-09-23
申请号：US17264036
申请日：2020-06-15
发明人： Ke MENG , Qiangwei CUI , Chao LIU , Lili WANG , Chuhang WANG , Yutian CHU , Linhui GONG
摘要： An array substrate and a manufacturing method thereof, a display panel, and a display device are provided. The array substrate includes a bonding region and a non-bonding region, and further includes: a rigid substrate, in the non-bonding region, a driving circuit layer, in the non-bonding region; a light-emitting diode layer, on a side of the driving circuit layer away from the rigid substrate; a flexible base layer, m the bonding region and on the same side of the rigid substrate as the driving circuit layer; and a bonding wire layer, on a side of the flexible base layer away from the rigid substrate. The bonding wire layer and the flexible base layer is capable of being bent along an edge of the rigid substrate to a side of the rigid substrate away from the driving circuit layer.
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公开(公告)号：US20210167045A1
公开(公告)日：2021-06-03
申请号：US16862934
申请日：2020-04-30
发明人： Ke MENG , Chao LIU , Qiangwei CUI , Chuhang WANG , Lili WANG , Linhui GONG , Yutian CHU , Fan YANG
IPC分类号： H01L25/075 , H01L27/12 , H01L33/62
摘要： A driving substrate includes a base substrate. The base substrate has a display region and a peripheral region, and the peripheral region includes a bonding region between the display region and a first side face of the base substrate. The driving substrate further includes a plurality of first pads spaced apart from each other, which are disposed in the bonding region of the base substrate. A first side face of each first pad is flush with the first side face of the base substrate. A thickness of the first pad is approximately in a range from 0.5 microns to 2 microns.
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17.发明公开公开(公告)号：US20230207733A1
公开(公告)日：2023-06-29
申请号：US17926791
申请日：2021-08-06
发明人： Linhui GONG , Chao LIU , Haiwei SUN , Chuhang WANG , Lili WANG , Chaoyang WANG , Xue DONG
CPC分类号： H01L33/382 , H01L25/0753 , H01L33/62 , H01L33/005 , G09F9/3026 , G09F9/33 , H01L2933/0016 , H01L2933/0066
摘要： A display panel includes a backplane, a plurality of light-emitting devices, a plurality of first electrodes, and a plurality of connection leads. The backplane includes a first main surface a second main surface and a plurality of side surfaces, and at least one side surface is a selected side surface. The plurality of light-emitting devices and the plurality of first electrodes are disposed on the second main surface. The plurality of connection leads are disposed at least on the first main surface and the selected side surface. Each connection lead includes a first portion on the first main surface and a second portion on the selected side surface, and a ratio of a thickness of the first portion to a thickness of the second portion is range in a range of 0.6 and 1.6. Each connection lead is electrically connected to a first electrode.
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公开(公告)号：US20210159208A1
公开(公告)日：2021-05-27
申请号：US16830834
申请日：2020-03-26
发明人： Lili WANG , Haiwei SUN , Zhenxing TANG , Feng QU , Jing LIU , Chao LIU , Chuhang WANG , Qiangwei CUI , Ke MENG , Linhui GONG
摘要： A chip bonding method and a bonding device. The chip bonding method is used for bonding a chip to a display module, the display module includes a substrate and a functional layer on the substrate, the substrate includes a first substrate portion and a second substrate portion, the functional layer is on the first substrate portion, and an electrode is on an upper side of the second substrate portion. The chip bonding method includes: forming a light absorbing film layer on a side of the second substrate portion facing away from the electrode; coating a conductive adhesive film on the electrode, and placing the chip on the conductive adhesive film; and irradiating, by using a laser beam, a side of the second substrate portion facing away from the electrode.
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公开(公告)号：US20190293995A1
公开(公告)日：2019-09-26
申请号：US16316909
申请日：2018-05-14
发明人： Xiongzhou WEI , Min LI , Qiang XIONG , Chao LIU , Jiaqi PANG , Bin WAN , Hongyu SUN
IPC分类号： G02F1/1335
摘要： A color filter (CF) substrate, a manufacturing method thereof and a display panel are provided. The manufacturing method of the substrate includes: providing a base substrate; and forming a black matrix layer and a plurality of first sub-pixel units on the base substrate, wherein the black matrix layer and the plurality of first sub-pixel units are made of photoresist of a same material, the material of the photoresist includes an irreversible thermochromic pigment, the photoresist is changed into black color upon being heated, and a color of the photoresist before color change is the same as a color of the first sub-pixel units.
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公开(公告)号：US20210193687A1
公开(公告)日：2021-06-24
申请号：US17040510
申请日：2020-03-18
发明人： Yonglian QI , Chao LIU , Lianjie QU , Hebin ZHAO , Shan ZHANG , Ning JIA , Guangdong SHI , Shuai LIU
IPC分类号： H01L27/12 , H01L25/075
摘要： A method of forming an array substrate, the array substrate and a display device are provided. The method of forming the array substrate includes: in a case that a display unit is formed on one of two opposite surfaces of a base substrate and a driving circuit is formed on the other of the two opposite surfaces of the base substrate, performing a roughening treatment on edge regions of the two opposite surfaces of the base substrate and a side surface of the base substrate connecting the edge regions of the two opposite surfaces, to form a roughened region; and forming, at the roughened region, a metal wiring connecting a signal input terminal of the display unit and a signal output terminal of the driving circuit.
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