FABRICATION METHODS OF TRANSPARENT CONDUCTIVE ELECTRODE AND ARRAY SUBSTRATE
    14.
    发明申请
    FABRICATION METHODS OF TRANSPARENT CONDUCTIVE ELECTRODE AND ARRAY SUBSTRATE 有权
    透明导电电极和阵列基板的制造方法

    公开(公告)号:US20160086981A1

    公开(公告)日:2016-03-24

    申请号:US14436576

    申请日:2014-09-15

    Abstract: Fabrication methods of a transparent conductive electrode (301) and an array substrate are provided. The fabrication method of the transparent conductive electrode (301) comprises: forming a sacrificial layer pattern (201) on a substrate (10) having a first region (A1) and a second region (A2) adjacent to each other, wherein the sacrificial layer pattern (201) is located in the second region (A2), and has an upper sharp corner profile formed on a side adjacent to the first region (A1); forming a transparent conductive thin-film (30) in the first region (A1) and the second region (A2) of the substrate (10) with the sacrificial layer pattern (201) formed thereon, wherein a thickness ratio of the transparent conductive thin-film (30) to the sacrificial layer pattern (201) is less than or equal to 1:1.5, and the transparent conductive thin-film (30) is disconnected at the upper sharp corner profile of the sacrificial layer pattern (201), such that at least a part of a side surface of the sacrificial layer pattern (201) facing the first region (A1) is exposed; and removing the sacrificial layer pattern (201) so as to reserve the transparent conductive thin-film (30) in the first region as the transparent conductive electrode (301).

    Abstract translation: 提供透明导电电极(301)和阵列基板的制造方法。 透明导电电极(301)的制造方法包括:在具有彼此相邻的第一区域(A1)和第二区域(A2)的基板(10)上形成牺牲层图案(201),其中牺牲层 图案(201)位于第二区域(A2)中,并且具有形成在与第一区域(A1)相邻的一侧上的上部锐角分布; 在其上形成有牺牲层图案(201)的第一区域(A1)和第二区域(A2)中形成透明导电薄膜(30),其中透明导电薄膜 牺牲层图案(201)的薄膜(30)小于或等于1:1.5,透明导电薄膜(30)在牺牲层图案(201)的上部锐角分布处断开, 使得牺牲层图案(201)的面向第一区域(A1)的侧表面的至少一部分被露出; 以及去除所述牺牲层图案(201)以便在所述第一区域中保留所述透明导电薄膜(30)作为所述透明导电电极(301)。

    THIN FILM TRANSISTOR, METHOD FOR FABRICATING THE SAME AND DISPLAY APPARATUS
    15.
    发明申请
    THIN FILM TRANSISTOR, METHOD FOR FABRICATING THE SAME AND DISPLAY APPARATUS 有权
    薄膜晶体管,其制造方法和显示装置

    公开(公告)号:US20150349140A1

    公开(公告)日:2015-12-03

    申请号:US14409333

    申请日:2014-06-20

    Abstract: Embodiments of the present invention provide a thin film transistor, method for fabricating the thin film transistor and display apparatus. The method includes steps of: forming an active layer pattern which has a mobility greater than a predetermined threshold from an active layer material; and performing ion implantation on the active layer pattern. The energy of a compound bond formed from the implanted ions is greater than that of a compound bond formed from ions in the active layer material, thereby reducing the chance of vacancy formation and reducing the carrier concentration. Therefore, the mobility of the active layer surface is reduced, the leakage current is reduced, the threshold voltage is adjusted to shift toward positive direction and performance of the thin film transistor is improved.

    Abstract translation: 本发明的实施例提供一种薄膜晶体管,用于制造薄膜晶体管和显示装置的方法。 该方法包括以下步骤:从有源层材料形成具有大于预定阈值的迁移率的有源层图案; 并对活性层图案进行离子注入。 由注入的离子形成的化合物键的能量大于由活性层材料中的离子形成的化合物键的能量,从而减少空位形成和降低载流子浓度的机会。 因此,有源层表面的迁移率降低,泄漏电流降低,阈值电压被调整为向正方向移动,提高了薄膜晶体管的性能。

    SUBSTRATE, METHOD FOR FORMING THE SAME, DISPLAY DEVICE AND FOR FORMING THE SAME

    公开(公告)号:US20230006107A1

    公开(公告)日:2023-01-05

    申请号:US17784437

    申请日:2021-07-06

    Inventor: Meili WANG Qi QI

    Abstract: A substrate includes a base substrate, at least two bonding pads are arranged on the base substrate, the base substrate and an electronic element are bonded to each other through the at least two bonding pads, at least two pins are arranged on the electronic element, a protective layer is arranged at a side of the bonding pads away from the base substrate, and an opening region is arranged in the protective layer at each bonding pad, to expose partial surface of the bonding pad. A bonding combination layer made of a low-melting-point alloy material is arranged in the opening region, and the low-melting-point alloy material is capable of being melted at a first predetermined temperature, to enable the bonding pads and the pins to be bonded to each other.

    DISPLAY COMPONENT AND DISPLAY APPARATUS

    公开(公告)号:US20210223447A1

    公开(公告)日:2021-07-22

    申请号:US16087138

    申请日:2018-03-28

    Abstract: A display component includes a transflective layer, a reflective layer, and at least one sidewall. The reflective layer is arranged opposing to the transflective layer, and the at least one sidewall is arranged between the reflective layer and the transflective layer. The transflective layer, the reflective layer, and the at least one sidewall are together configured, upon an input of an incident light through the transflective layer, to output a light of a target color out through the transflective layer. One or more of the at least one sidewall comprise at least one light-conversion layer configured to emit a light of the target color upon excitement by a light of a different color shedding thereupon. The display component can be configured to output a red light, a green light, or a blue light.

    BACKLIGHT AND LIQUID CRYSTAL DISPLAY DEVICE

    公开(公告)号:US20210041745A1

    公开(公告)日:2021-02-11

    申请号:US16081804

    申请日:2018-02-11

    Abstract: A backlight includes a plurality of light sources of at least three different colors disposed on a base substrate, and a plurality of grating units that are disposed on a light exit side of the plurality of light sources and are in one-to-one correspondence with the plurality of light sources. Each of the plurality of grating units is used for splitting light emitted by a corresponding one of the plurality of light sources to form in an array of uniformly distributed monochromatic spots, so that the backlight may form an array of colored spots in which at least three different colors of light spots are alternately arranged in sequence along a first direction, wherein the first direction is a row direction or a column direction of the array of colored spots.

    ELECTRONIC DEVICE, THIN FILM TRANSISTOR, ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20180174863A1

    公开(公告)日:2018-06-21

    申请号:US15553695

    申请日:2017-02-10

    Inventor: Meili WANG

    Abstract: Disclosed are an electronic device and the manufacturing method thereof, a manufacturing method of a thin film transistor, and an array substrate and manufacturing method thereof. The manufacturing method of an electronic device includes: forming a metallic structure on a base substrate; forming an oxygen-free insulating layer on the metallic structure and the base substrate; and forming an insulating protective layer on the oxygen-free insulating layer. The manufacturing method of the electronic device protects a metallic structure by forming an oxygen-free insulating layer, not containing oxygen elements, on the metallic structure, and hence prevents the metallic structure from being oxidized.

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