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公开(公告)号：US07097537B1
公开(公告)日：2006-08-29
申请号：US10922110
申请日：2004-08-18
IPC分类号： B49D1/00
CPC分类号： B24B37/013 , B24B49/105
摘要： A chemical mechanical polishing apparatus and method can use an in-situ monitoring system. A measurement of a position of a carrier head and a sinusoidal first function can be used to define a second function that associates measurements from the series with positions on the substrate. For each measurement in a series from the in-situ monitoring system, the second function can be used to determine a position on the substrate where the measurement was taken. In addition, a measurement of the position of the carrier head, a time when the measurement of the substrate property is made, and a phase correction representing lag resulting from a processing delay in generating the measurement of the position of the carrier head can be used in determining a position on the substrate where a measurement of a substrate property was taken.
摘要翻译： 化学机械抛光装置和方法可以使用原位监测系统。 可以使用载波头位置和正弦第一函数的测量来定义将来自串联的测量与基板上的位置相关联的第二函数。 对于来自原位监测系统的一系列中的每个测量，第二功能可用于确定在测量被测量的基板上的位置。 此外，可以使用载波头的位置的测量，进行基板特性的测量的时间，以及表示在产生载波头的位置的测量的处理延迟时产生的延迟的相位校正 在确定基板特性的测量时在基板上的位置。
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公开(公告)号：US07008297B2
公开(公告)日：2006-03-07
申请号：US11016410
申请日：2004-12-17
摘要： A chemical mechanical polishing apparatus has a polishing pad, a carrier to hold a substrate against a first side of the polishing surface, and a motor coupled to at least one of the polishing pad and carrier head for generating relative motion therebetween. An eddy current monitoring system is positioned to generate an alternating magnetic field in proximity to the substrate, an optical monitoring system generates a light beam and detects reflections of the light beam from the substrate, and a controller receives signals from the eddy current monitoring system and the optical monitoring system.
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公开(公告)号：US20130167614A1
公开(公告)日：2013-07-04
申请号：US13714202
申请日：2012-12-13
申请人： Gabriel Lorimer Miller , Manoocher Birang , Nils Johansson , Boguslaw A. Swedek , Dominic J. Benvegnu
发明人： Gabriel Lorimer Miller , Manoocher Birang , Nils Johansson , Boguslaw A. Swedek , Dominic J. Benvegnu
IPC分类号： G01N19/02
CPC分类号： G01N19/02 , B24B37/013 , B24B49/16
摘要： A system method and apparatus to monitor a frictional coefficient of a substrate undergoing polishing is described. A polishing pad assembly includes a polishing layer including a polishing surface, and a substrate contacting member flexibly coupled to the polishing layer having a top surface to contact an exposed surface of a substrate. At least a portion of the top surface is substantially coplanar with the polishing surface. A sensor is provided to measure a lateral displacement of the substrate contacting member. Some embodiments may provide accurate endpoint detection during chemical mechanical polishing to indicate the exposure of an underlying layer.
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14.发明授权Combined eddy current sensing and optical monitoring for chemical mechanical polishing 有权用于化学机械抛光的组合涡流感测和光学监测公开(公告)号：US06878038B2
公开(公告)日：2005-04-12
申请号：US09900664
申请日：2001-07-06
摘要： A chemical mechanical polishing apparatus has a polishing pad, a carrier to hold a substrate against a first side of the polishing surface, and a motor coupled to at least one of the polishing pad and carrier head for generating relative motion therebetween. An eddy current monitoring system is positioned to generate an alternating magnetic field in proximity to the substrate, an optical monitoring system generates a light beam and detects reflections of the light beam from the substrate, and a controller receives signals from the eddy current monitoring system and the optical monitoring system.
摘要翻译： 化学机械抛光装置具有抛光垫，用于将基板保持在抛光表面的第一侧上的载体，以及耦合到抛光垫和载体头中的至少一个的马达，用于在其之间产生相对运动。 涡流监视系统被定位成在基板附近产生交变磁场，光学监控系统产生光束并检测来自基板的光束的反射，并且控制器从涡流监视系统接收信号，以及 光学监控系统。
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公开(公告)号：US10105811B2
公开(公告)日：2018-10-23
申请号：US13207213
申请日：2011-08-10
IPC分类号： G01B7/06 , B24B37/013 , B24B49/10 , H01L21/67
摘要： An eddy current monitoring system may include an elongated core. One or more coils may be coupled with the elongated core for producing an oscillating magnetic field that may couple with one or more conductive regions on a wafer. The core may be translated relative to the wafer to provide improved resolution while maintaining sufficient signal strength. An eddy current monitoring system may include a DC-coupled marginal oscillator for producing an oscillating magnetic field at a resonant frequency, where the resonant frequency may change as a result of changes to one or more conductive regions. Eddy current monitoring systems may be used to enable real-time profile control.
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公开(公告)号：US20110195528A1
公开(公告)日：2011-08-11
申请号：US13089189
申请日：2011-04-18
IPC分类号： H01L21/66
CPC分类号： B24B37/013 , B24B37/042 , B24B49/12 , B24B51/00 , H01L22/26
摘要： A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an endpoint algorithm is determined from the initial thickness of the substrate, a substrates is polished at a polishing station, and polishing stops when an endpoint criterion is detected using the endpoint algorithm.
摘要翻译： 一种用于化学机械抛光中的过程控制的计算机实现方法，其中在计量站测量衬底的初始预抛光厚度，从衬底的初始厚度确定端点算法的参数，抛光衬底 在抛光台处，当使用端点算法检测到端点标准时抛光停止。
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17.发明授权Computer-implemented method for process control in chemical mechanical polishing 失效化学机械抛光过程控制计算机实现方法公开(公告)号：US07585202B2
公开(公告)日：2009-09-08
申请号：US11923082
申请日：2007-10-24
CPC分类号： B24B37/013 , B24B37/042 , B24B49/12 , B24B51/00 , H01L22/26
摘要： A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an endpoint algorithm is determined from the initial thickness of the substrate, a substrates is polished at a polishing station, and polishing stops when an endpoint criterion is detected using the endpoint algorithm.
摘要翻译： 一种用于化学机械抛光中的过程控制的计算机实现方法，其中在计量站测量衬底的初始预抛光厚度，从衬底的初始厚度确定端点算法的参数，抛光衬底 在抛光台处，当使用端点算法检测到端点标准时抛光停止。
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18.发明授权公开(公告)号：US07374477B2
公开(公告)日：2008-05-20
申请号：US10123917
申请日：2002-04-16
CPC分类号： B24B49/10 , B24B37/013 , B24B37/205 , B24B49/105 , B24B49/12
摘要： A polishing system can have a rotatable platen, a polishing pad secured to the platen, a carrier head to hold a substrate against the polishing pad, and an eddy current monitoring system including a coil or ferromagnetic body that extends at least partially through the polishing pad. A polishing pad can have a polishing layer and a coil or ferromagnetic body secured to the polishing layer. Recesses can be formed in a transparent window in the polishing pad.
摘要翻译： 抛光系统可以具有可旋转的压板，固定到压板的抛光垫，用于将衬底保持在抛光垫上的载体头，以及涡流监测系统，其包括线圈或铁磁体，其至少部分延伸穿过抛光垫 。 抛光垫可以具有固定到抛光层的抛光层和线圈或铁磁体。 凹槽可以在抛光垫的透明窗口中形成。
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公开(公告)号：US07354334B1
公开(公告)日：2008-04-08
申请号：US11124420
申请日：2005-05-06
IPC分类号： B24B1/00
摘要： A polishing system can have a polishing pad with a polishing surface and a bottom surface that includes a recess with a thickness less than the thickness of the polishing pad. An in-situ monitoring module can be positioned in a cavity formed in part by the recess. A vent path is provided with an opening to the cavity.
摘要翻译： 抛光系统可以具有抛光垫，抛光垫具有抛光表面和底表面，该底表面包括厚度小于抛光垫厚度的凹槽。 原位监测模块可以定位在由凹部部分形成的空腔中。 排气通道设有通向空腔的开口。
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公开(公告)号：US07294039B2
公开(公告)日：2007-11-13
申请号：US11467116
申请日：2006-08-24
IPC分类号： B24B49/00
CPC分类号： B24B37/013 , B24B37/042 , B24B49/12 , B24B51/00 , H01L22/26
摘要： A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an endpoint algorithm is determined from the initial thickness of the substrate, a substrates is polished at a polishing station, and polishing stops when an endpoint criterion is detected using the endpoint algorithm.
摘要翻译： 一种用于化学机械抛光中的过程控制的计算机实现方法，其中在计量站测量衬底的初始预抛光厚度，从衬底的初始厚度确定端点算法的参数，抛光衬底 在抛光台处，当使用端点算法检测到端点标准时抛光停止。
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