MULTILAYER CERAMIC ELECTRONIC COMPONENT
    11.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT 有权
    多层陶瓷电子元件

    公开(公告)号:US20130120898A1

    公开(公告)日:2013-05-16

    申请号:US13572407

    申请日:2012-08-10

    IPC分类号: H01G4/30 H01B1/02 H01G13/00

    摘要: There are provided a multilayer ceramic electronic component and a method of manufacturing the same. The multilayer ceramic electronic component includes: a ceramic body including a dielectric layer; first and second internal electrodes disposed within the ceramic body to face each other, while having the dielectric layer interposed therebetween; and first external electrodes electrically connected to first and second internal electrodes and second external electrodes formed on the first external electrodes, wherein the first and second external electrodes include a conductive metal and a glass, and when the second external electrodes are divided into three equal parts in a thickness direction, an area of the glass in central parts thereof with respect to an area of the central parts is 30 to 80%. Therefore, sealing properties of a chip is improved, whereby a multilayer ceramic electronic component having improved reliability may be implemented.

    摘要翻译: 提供了一种多层陶瓷电子部件及其制造方法。 多层陶瓷电子部件包括:陶瓷体,其包括电介质层; 第一和第二内部电极设置在陶瓷体内以彼此面对,同时介于其间的电介质层; 以及第一外部电极,电连接到形成在第一外部电极上的第一和第二内部电极和第二外部电极,其中第一和第二外部电极包括导电金属和玻璃,并且当第二外部电极被分成三个相等部分 在厚度方向上,中央部分的玻璃的面积相对于中央部的面积为30〜80%。 因此,提高了芯片的密封性,可以实现具有提高的可靠性的多层陶瓷电子部件。

    Multilayer ceramic electronic component and method of fabricating the same
    13.
    发明授权
    Multilayer ceramic electronic component and method of fabricating the same 有权
    多层陶瓷电子元件及其制造方法

    公开(公告)号:US08837112B2

    公开(公告)日:2014-09-16

    申请号:US13620635

    申请日:2012-09-14

    IPC分类号: H01G4/06 H01G4/30 H01G4/005

    摘要: There is provided a multilayer ceramic electronic component, including: a ceramic body including a dielectric layer; a plurality of internal electrodes disposed to face each other within the ceramic body, having the dielectric layer interposed therebetween; and external electrodes electrically connected to the internal electrodes, wherein the ceramic body includes an active layer corresponding to a capacitance forming part and a cover layer formed on at least one of an upper surface and a lower surface of the active layer and corresponding to a non-capacitance forming part, an average thickness of the cover layer is 15 μm or less, the external electrodes include a conductive metal and a glass, and when an area of the external electrodes occupied by the glass is A and an area thereof occupied by the conductive metal is B, 0.05≦A/B≦0.6 is satisfied.

    摘要翻译: 提供了一种多层陶瓷电子部件,包括:包括电介质层的陶瓷体; 多个内部电极,其设置成在陶瓷体内彼此面对,其间插入介电层; 电连接到内部电极的外部电极,其中陶瓷体包括对应于电容形成部分的有源层和形成在有源层的上表面和下表面中的至少一个上的覆盖层, - 电容形成部分,覆盖层的平均厚度为15μm以下,外部电极包括导电性金属和玻璃,并且当玻璃占据的外部电极的面积为A且其占据面积 导电金属为B,0.05≦̸ A / B&NlE; 0.6。

    Multilayer ceramic electronic component
    15.
    发明授权
    Multilayer ceramic electronic component 有权
    多层陶瓷电子元件

    公开(公告)号:US08792223B2

    公开(公告)日:2014-07-29

    申请号:US13620614

    申请日:2012-09-14

    IPC分类号: H01G4/005 H01G4/00

    CPC分类号: H01G4/12

    摘要: There is provided a multilayer ceramic electronic component including: a ceramic body including a dielectric layer; a plurality of internal electrodes disposed within the ceramic body to face each other, having the dielectric layer interposed therebetween; and external electrodes electrically connected to the plurality of internal electrodes, wherein the ceramic body includes an active layer corresponding to a capacitance forming part and a cover layer formed on at least one of an upper surface and a lower surface of the active layer and corresponding to a non-capacitance forming part, an average thickness of the cover layer is 15 μm or less, the external electrodes include a conductive metal and glass portions, and when an average length of the glass portions in a length direction of the external electrodes is Ls, Ls≦10 μm is satisfied.

    摘要翻译: 提供了一种多层陶瓷电子部件,其包括:陶瓷体,其包括电介质层; 设置在所述陶瓷体内的多个内部电极,其彼此面对,具有介电层; 电连接到所述多个内部电极的外部电极,其中所述陶瓷体包括对应于电容形成部分的有源层和形成在所述有源层的上表面和下表面中的至少一个上的覆盖层,并且对应于 非电容形成部,覆盖层的平均厚度为15μm以下,外部电极包括导电性金属和玻璃部,当外部电极的长度方向的玻璃部的平均长度为Ls ,Ls≦̸满足10μm。