公开(公告)号：US20100289607A1

公开(公告)日：2010-11-18

申请号：US12625001

申请日：2009-11-24

Applicant: Choa-Ming Liu ,  Chih-Ming Chen ,  Yu-Chun Lai

Inventor： Choa-Ming Liu ,  Chih-Ming Chen ,  Yu-Chun Lai

IPC: H01F27/06

CPC classification number: H01F21/08 ,  H01F3/14 ,  H01F27/263 ,  H01F27/325

Abstract: A transformer includes a base, a magnetic core assembly and at least one winding coil assembly. The base includes a first receptacle and at least one first receiving recess. The magnetic core assembly includes a first magnetic part, a second magnetic part and a third magnetic part. The base is arranged between the first magnetic part and the second magnetic part. The first magnetic part has a first post accommodated within the first receptacle. The at least one winding coil assembly is disposed on the base. The third magnetic part is optionally accommodated within the first receiving recess, so that an air gap between the third magnetic part and the first magnetic part/the second magnetic part is adjustable.

Abstract translation: 变压器包括基座，磁芯组件和至少一个绕组线圈组件。 底座包括第一容器和至少一个第一容纳凹槽。 磁芯组件包括第一磁性部分，第二磁性部分和第三磁性部分。 基座布置在第一磁性部分和第二磁性部分之间。 第一磁性部件具有容纳在第一容器内的第一柱。 至少一个绕组线圈组件设置在基座上。 第三磁性部件可选地容纳在第一容纳凹部内，使得第三磁性部件和第一磁性部件/第二磁性部件之间的空气间隙是可调节的。

公开(公告)号：US20100156734A1

公开(公告)日：2010-06-24

申请号：US12314940

申请日：2008-12-19

Applicant: Chih-Ming Chen ,  Chih-Wei Chen ,  Chih-Hao Lai ,  Ming-Yi Wu ,  Tzu-Feng Lee

Inventor： Chih-Ming Chen ,  Chih-Wei Chen ,  Chih-Hao Lai ,  Ming-Yi Wu ,  Tzu-Feng Lee

IPC: H01Q7/06 ,  B05D5/12 ,  C25D5/54

CPC classification number: H01Q1/2283 ,  C23C26/00 ,  C25D5/02 ,  H01Q7/00

Abstract: A chip-type antenna for receiving FM broadcasting signal includes a ceramic substrate, a ferrite layer formed on a top surface of the ceramic substrate, and a radiation structure. The ceramic substrate and the ferrite layer form an antenna substrate. The radiation structure is formed on the antenna substrate. The chip-type antenna for receiving FM broadcasting signal utilizes the high dielectric constant of the ceramic substrate and the electric characteristic of the ferrite layer to reduce the dimension of the antenna.

Abstract translation: 用于接收FM广播信号的芯片型天线包括陶瓷基板，形成在陶瓷基板的顶表面上的铁氧体层和辐射结构。 陶瓷基板和铁氧体层形成天线基板。 辐射结构形成在天线基板上。 用于接收FM广播信号的芯片型天线利用陶瓷基片的高介电常数和铁氧体层的电特性来减小天线的尺寸。

公开(公告)号：US20090286814A1

公开(公告)日：2009-11-19

申请号：US12264508

申请日：2008-11-04

Applicant: Chu-chung Lin ,  Kuang-Yuan Lee ,  Yo-chin Liu ,  Pin Lo ,  Rong-Jiunn Chen ,  Chen-Fu Liu ,  Chih-Ming Chen ,  Chi-Hsin Richard King

Inventor： Chu-chung Lin ,  Kuang-Yuan Lee ,  Yo-chin Liu ,  Pin Lo ,  Rong-Jiunn Chen ,  Chen-Fu Liu ,  Chih-Ming Chen ,  Chi-Hsin Richard King

IPC: A61K31/519 ,  C07D239/70 ,  C07D215/00 ,  A61K31/4709 ,  A61P31/12

CPC classification number: C07K5/0804 ,  C07D487/04 ,  C07D519/00 ,  C07K5/081

Abstract: This invention relates to macrocyclic compounds of formula (I) or (II) shown in the specification. These compounds can be used to treat hepatitis C virus infection.

Abstract translation: 本发明涉及说明书中所示的式（I）或（II）的大环化合物。 这些化合物可用于治疗丙型肝炎病毒感染。

公开(公告)号：US20090097179A1

公开(公告)日：2009-04-16

申请号：US11907311

申请日：2007-10-11

Applicant: Chih-Ming Chen

Inventor： Chih-Ming Chen

IPC: H02H3/08

CPC classification number: H02H3/093

Abstract: An over current protection method for a power supply includes steps as follows. Firstly, an output current value of the power supply is received. Secondly, whether the power supply has an over current status is determined in accordance with the received output current value. Thirdly, if the over current status occurs, the over current status is monitored to check whether the over current status continues for more than a setting period of time. If the over current status continues for more than the setting period of time, the power supply is disabled. On the other hand, if the over current status is eliminated with the setting period of time, a process flow returns to the first step of receiving an output current value of the power supply.

Abstract translation: 电源的过电流保护方法包括以下步骤。 首先，接收电源的输出电流值。 其次，根据接收到的输出电流值来确定电源是否具有过电流状态。 第三，如果发生过电流状态，则监视过电流状态，以检查过电流状态是否持续超过设定时间。 如果过电流状态持续超过设定期限，电源将被禁止。 另一方面，如果在设定时间段内消除过电流状态，则处理流程返回到接收电源的输出电流值的第一步骤。

公开(公告)号：US07466268B2

公开(公告)日：2008-12-16

申请号：US11480945

申请日：2006-07-06

Applicant: Chih-Ming Chen

Inventor： Chih-Ming Chen

IPC: H01Q1/38

CPC classification number: H01Q9/40 ,  H01Q1/38 ,  H01Q9/36

Abstract: A frequency adjustable antenna apparatus and a manufacturing method thereof are disclosed. The antenna apparatus includes a plurality of antenna paths and the length of the antenna path is changed via the soldering pads. Therefore, the receiving frequency of the antenna can be changed. The frequency adjustable antenna apparatus includes a body, a first path, at least one second path and a printed circuit board. The first path is located on an upper surface of the body and extends to a lower surface. The second path is located on the lower surface. The printed circuit board includes at least one soldering pad. When the lower surface of the body is pasted on the printed circuit board, the first path is connected with the second path via the soldering pads. Thereby, the length of the first path is changed to adjust the frequency of the antenna apparatus.

Abstract translation: 公开了一种频率可调天线装置及其制造方法。 天线装置包括多个天线路径，并且经由焊盘改变天线路径的长度。 因此，可以改变天线的接收频率。 频率可调节天线装置包括主体，第一路径，至少一个第二路径和印刷电路板。 第一路径位于主体的上表面并延伸到下表面。 第二条路径位于下表面。 印刷电路板包括至少一个焊盘。 当主体的下表面粘贴在印刷电路板上时，第一路径经由焊盘与第二路径连接。 由此，改变第一路径的长度，调整天线装置的频率。

公开(公告)号：US20080180632A1

公开(公告)日：2008-07-31

申请号：US11698903

申请日：2007-01-29

Applicant: Chih-Ming Chen

Inventor： Chih-Ming Chen

IPC: G02C1/04 ,  G02C1/00 ,  G02C1/06

CPC classification number: G02C1/04 ,  G02C1/06

Abstract: A lens/frame combination for a pair of glasses includes a frame and at least one lens made of a material different from that of the frame. The frame includes at least one receiving portion having a coupling groove for coupling with the at least one lens. The at least one lens includes a peripheral edge that is at least partially and securely coupled with the coupling groove of the frame, forming a jointing area therebetween. The peripheral edge of the at least one lens is received in the coupling groove of the at least one receiving portion to a depth of 0.7 mm-5.0 mm, preferably 0.9 mm-5.0 mm.

Abstract translation: 用于一对眼镜的透镜/框架组合包括框架和由与框架不同的材料制成的至少一个透镜。 框架包括至少一个具有用于与至少一个透镜耦合的耦合槽的接收部分。 所述至少一个透镜包括周边边缘，其至少部分地并且牢固地与所述框架的所述联接槽耦合，从而在其间形成接合区域。 所述至少一个透镜的外围边缘被容纳在所述至少一个接收部分的所述联接槽中，其深度为0.7mm-5.0mm，优选为0.9mm-5.0mm。

公开(公告)号：US20080142832A1

公开(公告)日：2008-06-19

申请号：US11954679

申请日：2007-12-12

Applicant: Chih-Ming Chen ,  Deng-Huei Hwang ,  Ching-Chi Cheng ,  An-Nong Wen

Inventor： Chih-Ming Chen ,  Deng-Huei Hwang ,  Ching-Chi Cheng ,  An-Nong Wen

IPC: H01L33/00

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L2924/0002 ,  H05K3/3442 ,  H01L2924/00

Abstract: A side-view optical diode package is mounted on a printed circuit board with at least a solder bump. The side-view optical diode package includes a silicon substrate, a holding space, a bonding surface and a positioning structure. The silicon substrate has a first surface and a second surface. The holding space has a top opening in the first surface and a bottom for holding an optical diode thereon. The bonding surface is disposed at a lateral side of the silicon substrate and bonded onto the printed circuit board. The positioning structure has at least a solder-receiving portion beside the bonding surface and corresponding to the solder bump. The solder bump is molten during a soldering process and received in the solder-receiving portion, thereby facilitating positioning the silicon substrate on the printed circuit board.

Abstract translation: 侧视光二极管封装安装在至少具有焊料凸块的印刷电路板上。 侧视光二极管封装包括硅衬底，保持空间，接合表面和定位结构。 硅衬底具有第一表面和第二表面。 保持空间在第一表面具有顶部开口，在其上具有用于保持光二极管的底部。 接合表面设置在硅衬底的侧面并且结合到印刷电路板上。 该定位结构在接合面的至少一侧具有焊料接收部，与焊料凸块对应。 焊锡凸块在焊接过程中熔化并被接收在焊料接收部分中，从而便于将硅衬底定位在印刷电路板上。

公开(公告)号：US20080129631A1

公开(公告)日：2008-06-05

申请号：US11633444

申请日：2006-12-05

Applicant: Chih-Ming Chen ,  Min-Sheng Ma

Inventor： Chih-Ming Chen ,  Min-Sheng Ma

IPC: H01Q1/38 ,  H01Q1/52

CPC classification number: H01Q9/0428 ,  H01Q1/38 ,  H01Q1/52

Abstract: A broadband circularly polarization antenna device includes: a dielectric body, a patch, an antenna feed pin, and a grounding layer. The patch is disposed on a top surface of the dielectric body. The antenna feed pin is extended outward from a bottom surface of the dielectric body. One part of the grounding layer is coated on the bottom surface of the dielectric body, and the other part of the grounding layer is coated entirely around a lateral side of the dielectric body. Because the grounding layer is coated on the bottom surface and the lateral side of the dielectric body, the bandwidth of the antenna device is increased and interference from a PCB and other surrounding circuits to the antenna device is greatly reduced, thereby ensuring the antenna device performs well.

Abstract translation: 宽带圆极化天线装置包括：介电体，贴片，天线馈电脚和接地层。 贴片设置在电介质体的顶表面上。 天线馈电销从电介质体的底面向外延伸。 接地层的一部分涂覆在电介质体的底表面上，接地层的另一部分整体涂覆在绝缘体的侧面。 由于接地层被涂覆在电介质体的底面和侧面上，所以天线装置的带宽增加，PCB等周边电路对天线装置的干扰大大降低，从而确保天线装置执行 好。

公开(公告)号：US20080073774A1

公开(公告)日：2008-03-27

申请号：US11566242

申请日：2006-12-04

Applicant: Wen-Kun Yang ,  Dyi-Chung Hu ,  Chih-Ming Chen ,  Hsien-Wen Hsu

Inventor： Wen-Kun Yang ,  Dyi-Chung Hu ,  Chih-Ming Chen ,  Hsien-Wen Hsu

IPC: H01L23/04

CPC classification number: H01L23/5389 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/19 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05026 ,  H01L2224/12105 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01094 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: A chip package including a multilayer substrate, an adhesive core layer and a chip is provided. The multilayer substrate has a plurality of material layers. The adhesive core layer is disposed on the multilayer substrate. The chip is disposed in the adhesive core layer. The chip has an active surface exposed outside the adhesive core layer. The chip includes a plurality of bonding pads disposed on the active surface and a plurality of metal conductive bodies electrically connected to the bonding pads respectively.

Abstract translation: 提供了包括多层基板，粘合芯层和芯片的芯片封装。 多层基板具有多个材料层。 粘合芯层设置在多层基板上。 芯片设置在粘合芯层中。 该芯片具有暴露在粘合芯层外的活性表面。 芯片包括设置在有源表面上的多个接合焊盘和分别与焊盘电连接的多个金属导电体。

公开(公告)号：US20080005889A1

公开(公告)日：2008-01-10

申请号：US11648597

申请日：2007-01-03

Applicant: Bin-Hung Chen ,  Chih-Ming Chen

Inventor： Bin-Hung Chen ,  Chih-Ming Chen

IPC: H01P11/00 ,  H01Q13/00

CPC classification number: H01Q1/243 ,  Y10T29/49016 ,  Y10T156/10

Abstract: A flexible antenna apparatus and a manufacturing method thereof are provided for wireless communication devices. The flexible antenna has a metal layer with an adhesive layer pasted onto the back surface of the metal layer, so that it can be directly pasted onto the housing of the wireless communication device. On another side of the metal layer, there is a transparent protective layer and the metal layer reserves a zone without the transparent protective layer for electrically coupling to the electrical substrate of the wireless communication device. The present flexible antenna apparatus reduces the developing time and cost of the device and the manufacturing process more convenient. The flexible antenna apparatus is suitable for all wireless communication devices and increases the flexibility of the manufacturing process by adding a holder having at least one plastic pin, or a pin.

Abstract translation: 为无线通信装置提供柔性天线装置及其制造方法。 柔性天线具有金属层，该金属层粘附在金属层的背面上，从而可将其直接粘贴到无线通信设备的外壳上。 在金属层的另一侧，存在透明保护层，金属层保留没有透明保护层的区域，用于电耦合到无线通信设备的电气基板。 本发明的柔性天线装置减少了设备的开发时间和成本，并且制造过程更加方便。 柔性天线装置适用于所有无线通信装置，并通过添加具有至少一个塑料针或针的保持器来增加制造过程的灵活性。