公开(公告)号：US07619307B1

公开(公告)日：2009-11-17

申请号：US12133898

申请日：2008-06-05

Applicant: Chin-Fa Wang ,  Wan-Jung Hsieh ,  Yu-Mei Hsu

Inventor： Chin-Fa Wang ,  Wan-Jung Hsieh ,  Yu-Mei Hsu

IPC: H01L23/48 ,  H01L23/52 ,  H01L23/495

CPC classification number: H01L23/4951 ,  H01L23/3107 ,  H01L23/49551 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A leadframe-based semiconductor package and a leadframe for the package are revealed. The semiconductor package primarily includes parts of the leadframe including one or more first leads, one or more second leads, and a supporting bar disposed between the first leads and the second leads and further includes a chip attached to the first leads, the second leads and the supporting bar, a plurality of bonding wires and an encapsulant. The supporting bar has an extended portion projecting from the first bonding finger and the second bonding finger and connected to a non-lead side of the encapsulant wherein the extended portion has an arched bend to absorb the pulling stresses and to block stress transmission. Cracks caused by delamination of the supporting bar will not be created during trimming the supporting bar along the non-lead side of the encapsulant. Moisture penetration along the cracks of the supporting bar to the die-bonding plane under the chip is desirably prevented.

Abstract translation: 揭示了一种基于引线框架的半导体封装和封装的引线框架。 半导体封装主要包括引线框架的包括一个或多个第一引线，一个或多个第二引线和布置在第一引线和第二引线之间的支撑杆的部分，还包括附接到第一引线，第二引线和 支撑杆，多根接合线和密封剂。 支撑杆具有从第一接合指和第二接合指突起的延伸部分，并且连接到密封剂的非引线侧，其中延伸部具有拱形弯曲部以吸收拉应力并阻止应力传递。 在沿着密封剂的非引线侧修整支撑杆时不会产生由支撑杆分层引起的裂纹。 期望地防止沿支撑杆的裂纹到芯片下方的芯片接合平面的水分渗透。

公开(公告)号：US07549568B1

公开(公告)日：2009-06-23

申请号：US12052426

申请日：2008-03-20

Applicant: Chin-Ti Chen ,  Chin-Fa Wang ,  Bing-Shun Yu

Inventor： Chin-Ti Chen ,  Chin-Fa Wang ,  Bing-Shun Yu

IPC: B23K31/00

CPC classification number: B23K20/004 ,  B23K2101/42 ,  H01L23/4951 ,  H01L23/544 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2223/54413 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49052 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/78901 ,  H01L2224/83101 ,  H01L2224/83856 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/01031 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A method of forming an identification code for wire bonders is revealed. Firstly, a chip with a plurality of bonding pads is provided and is disposed on a chip carrier with a plurality of bonding fingers. A binary-code baseline is defined on the chip carrier to divide each of the bonding fingers into a first coding area adjacent the bonding pads and a second coding area far away from the bonding pads. Then, a plurality of bonding wires are formed by wire bonding to electrically connect the bonding pads to the bonding fingers and an ID code for wire bonders is formed at the same time where each bonding wire has an end selectively bonded to either the first coding area or the second coding area of the corresponding bonding finger to form an ID code for wire bonders. Since the ID code for wire bonders is constituted by the selected locations of the ends of the bonding wires, the ID code do not get lost or damaged during packaging processes nor contaminate the packages. The ID code for wire bonders can be used to easily and quickly track malfunction wire bonders to save the identification time.

Abstract translation: 揭示了一种形成引线接合器识别码的方法。 首先，提供具有多个接合焊盘的芯片，并且设置在具有多个接合指的芯片载体上。 在芯片载体上定义二进制代码基线，以将每个键合指状物分成与接合焊盘相邻的第一编码区域和远离键合焊盘的第二编码区域。 然后，通过引线接合形成多个接合线，以将接合焊盘电连接到接合爪，并且在每个接合线的端部选择性地接合到第一编码区域的同时形成引线接合器的ID码 或相应的粘结手指的第二编码区域以形成用于引线接合器的ID码。 由于引线接合器的ID代码由接合线的端部的选定位置构成，所以ID码在封装过程中不会损失或损坏，也不会污染封装。 引线接合器的ID代码可用于轻松快速跟踪故障线接合器，以节省识别时间。

公开(公告)号：US20050274101A1

公开(公告)日：2005-12-15

申请号：US10865833

申请日：2004-06-14

Applicant: Chin-Fa Wang

Inventor： Chin-Fa Wang

IPC: D02G3/12 ,  D02G3/36 ,  D02G3/40 ,  D07B1/16 ,  E06C1/52 ,  E06C5/26

CPC classification number: D07B1/162 ,  D02G3/404 ,  D07B1/22 ,  D07B2201/1008 ,  D07B2201/2016 ,  D07B2201/2086

Abstract: A rope includes two groups of yarn wires which are respectively coated by a coating made of PUC foam plastic. The coatings are arranged in parallel with each other and connected by a connection portion. The coatings can be dyed as different colors. Two or more ropes can be woven together to be a reinforced rope when necessary.

Abstract translation: 绳子包括两组纱线，它们分别由由PUC泡沫塑料制成的涂层涂覆。 涂层彼此平行地布置并通过连接部分连接。 涂层可以染成不同的颜色。 必要时可以将两根或多根绳索编织在一起成为加固绳。