公开(公告)号：US20090134509A1

公开(公告)日：2009-05-28

申请号：US12360644

申请日：2009-01-27

申请人： Choong Bin Yim ,  Hyeog Chan Kwon ,  Jong-Woo Ha

发明人： Choong Bin Yim ,  Hyeog Chan Kwon ,  Jong-Woo Ha

IPC分类号： H01L23/31 ,  H01L21/71 ,  H01L23/522

CPC分类号： H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a carrier having a top side and a bottom side; forming an edge terminal pad on the top side and an inner terminal pad on the bottom side; connecting an integrated circuit die to an inner portion of the edge terminal pad; and encapsulating the integrated circuit die and the inner portion of the edge terminal pad with the outer portion of the edge terminal pad exposed.

摘要翻译： 集成电路封装系统的制造方法包括：形成具有顶侧和底侧的载体; 在顶侧形成边缘端子焊盘，在底侧形成内端子焊盘; 将集成电路管芯连接到所述边缘端子焊盘的内部; 并封装集成电路管芯和边缘端子焊盘的内部，边缘端子焊盘的外部部分露出。

公开(公告)号：US07482203B2

公开(公告)日：2009-01-27

申请号：US12005499

申请日：2007-12-26

申请人： Sungmin Song ,  Choong Bin Yim ,  SeongMin Lee ,  Jaehyun Lim ,  Joungin Yang ,  DongSam Park

发明人： Sungmin Song ,  Choong Bin Yim ,  SeongMin Lee ,  Jaehyun Lim ,  Joungin Yang ,  DongSam Park

IPC分类号： H01L21/00

CPC分类号： H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stacked integrated circuit package-in-package system is provided forming a first device having a first integrated circuit package comprises forming a first substrate with a first integrated circuit thereon, electrically connecting first electrical interconnects between the first integrated circuit and a top side of the first substrate, encapsulating a first top molding compound to cover the first electrical interconnects and a portion of the top side of the first substrate, and encapsulating a first bottom molding compound to cover the first integrated circuit and a bottom side the first substrate, and stacking a second device, having a second integrated circuit package, below the first device with a second top molding compound of the second device providing a space between the first device and the second device, wherein the second device includes the second top molding compound and a second bottom molding compound in a similar manner to the first device.

摘要翻译： 提供了一种堆叠式集成电路封装封装系统，其形成具有第一集成电路封装的第一器件，其包括在其上形成具有第一集成电路的第一衬底，电连接第一集成电路和第一集成电路的顶侧之间的第一电互连 第一基板，封装第一顶部模制化合物以覆盖第一电气互连和第一基板的顶侧的一部分，并且封装第一底部模制化合物以覆盖第一集成电路，底侧覆盖第一基板，并且堆叠 第二装置，具有第二集成电路封装，在第一装置下方具有第二装置的第二顶部模制化合物，其在第一装置和第二装置之间提供空间，其中第二装置包括第二顶部模塑料和第二装置 底部模塑料与第一装置类似。

公开(公告)号：US07312519B2

公开(公告)日：2007-12-25

申请号：US11331564

申请日：2006-01-12

申请人： Sungmin Song ,  Choong Bin Yim ,  Seongmin Lee ,  Jaehyun Lim ,  Joungin Yang ,  Dongsam Park

发明人： Sungmin Song ,  Choong Bin Yim ,  Seongmin Lee ,  Jaehyun Lim ,  Joungin Yang ,  Dongsam Park

IPC分类号： H01L23/02

CPC分类号： H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stacked integrated circuit package-in-package system is provided forming a first device having a first integrated circuit package comprises forming a first substrate with a first integrated circuit thereon, electrically connecting first electrical interconnects between the first integrated circuit and a top side of the first substrate, encapsulating a first top molding compound to cover the first electrical interconnects and a portion of the top side of the first substrate, and encapsulating a first bottom molding compound to cover the first integrated circuit and a bottom side the first substrate, and stacking a second device, having a second integrated circuit package, below the first device with a second top molding compound of the second device providing a space between the first device and the second device, wherein the second device includes the second top molding compound and a second bottom molding compound in a similar manner to the first device.

公开(公告)号：US20070108604A1

公开(公告)日：2007-05-17

申请号：US11306805

申请日：2006-01-11

申请人： Choong Bin Yim

发明人： Choong Bin Yim

IPC分类号： H01L23/48

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L24/48 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stacked integrated circuit leadframe package system including forming a leadframe, packaging a top integrated circuit on a one side of the leadframe, packaging a bottom integrated circuit on an opposite side of the leadframe, and forming external electrical interconnects on the leadframe.

摘要翻译： 一种堆叠集成电路引线框封装系统，包括形成引线框架，在引线框架的一侧封装顶部集成电路，在引线框架的相对侧封装底部集成电路，以及在引线框架上形成外部电互连。

公开(公告)号：US07884460B2

公开(公告)日：2011-02-08

申请号：US12360644

申请日：2009-01-27

申请人： Choong Bin Yim ,  Hyeog Chan Kwon ,  Jong-Woo Ha

发明人： Choong Bin Yim ,  Hyeog Chan Kwon ,  Jong-Woo Ha

IPC分类号： H01L23/02

CPC分类号： H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a carrier having a top side and a bottom side; forming an edge terminal pad on the top side and an inner terminal pad on the bottom side; connecting an integrated circuit die to an inner portion of the edge terminal pad; and encapsulating the integrated circuit die and the inner portion of the edge terminal pad with the outer portion of the edge terminal pad exposed.

摘要翻译： 集成电路封装系统的制造方法包括：形成具有顶侧和底侧的载体; 在顶侧形成边缘端子焊盘，在底侧形成内端子焊盘; 将集成电路管芯连接到所述边缘端子焊盘的内部; 并封装集成电路管芯和边缘端子焊盘的内部，边缘端子焊盘的外部部分露出。

公开(公告)号：US20090026597A1

公开(公告)日：2009-01-29

申请号：US12236227

申请日：2008-09-23

申请人： Choong Bin Yim

发明人： Choong Bin Yim

IPC分类号： H01L23/495

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L24/48 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stacked integrated circuit leadframe package system including forming a leadframe, packaging a top integrated circuit on a one side of the leadframe, packaging a bottom integrated circuit on an opposite side of the leadframe, and forming external electrical interconnects on the leadframe.

摘要翻译： 一种堆叠集成电路引线框封装系统，包括形成引线框架，在引线框架的一侧封装顶部集成电路，在引线框架的相对侧封装底部集成电路，以及在引线框架上形成外部电互连。

公开(公告)号：US07298037B2

公开(公告)日：2007-11-20

申请号：US11307722

申请日：2006-02-17

申请人： Choong Bin Yim ,  Sungmin Song ,  SeongMin Lee ,  Jaehyun Lim ,  Joungin Yang ,  DongSam Park

发明人： Choong Bin Yim ,  Sungmin Song ,  SeongMin Lee ,  Jaehyun Lim ,  Joungin Yang ,  DongSam Park

IPC分类号： H01L23/02

CPC分类号： H01L25/0657 ,  H01L23/3128 ,  H01L24/73 ,  H01L24/97 ,  H01L25/03 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2924/01005 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： A stacked integrated circuit package-in-package system is provided forming a first integrated circuit spacer package including a mold compound with a recess provided therein, stacking the first integrated circuit spacer package on an integrated circuit die on a substrate with the recess positioned therebetween, and attaching a first electrical interconnect extending from the recess and connected between the integrated circuit die and the substrate.

摘要翻译： 提供一种堆叠式集成电路封装封装系统，其形成第一集成电路间隔件封装，其包括设置在其中的凹部的模具化合物，其中第一集成电路间隔件封装在基板上的集成电路管芯上，凹部位于其间， 以及附接从所述凹部延伸并连接在所述集成电路管芯和所述衬底之间的第一电互连。

公开(公告)号：US20070216006A1

公开(公告)日：2007-09-20

申请号：US11276942

申请日：2006-03-17

申请人： DongSam Park ,  Choong Bin Yim ,  In Sang Yoon

发明人： DongSam Park ,  Choong Bin Yim ,  In Sang Yoon

IPC分类号： H01L23/02

CPC分类号： H01L25/105 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A integrated circuit package on package system is provided including providing a base substrate having a base stackable connection, attaching a base integrated circuit on the base substrate, forming a stackable package including the base integrated circuit encapsulated with the base stackable connection partially exposed, and attaching a bottom package on the stackable package.

摘要翻译： 提供了一种集成电路封装在封装系统上，包括提供具有基本可堆叠连接的基底基板，将基底集成电路连接在基底基板上，形成可堆叠的封装，其包括基部集成电路，该基本集成电路封装有部分露出的基部可堆叠连接， 可堆叠包装上的底部包装。

公开(公告)号：US08367465B2

公开(公告)日：2013-02-05

申请号：US11276942

申请日：2006-03-17

申请人： DongSam Park ,  Choong Bin Yim ,  In Sang Yoon

发明人： DongSam Park ,  Choong Bin Yim ,  In Sang Yoon

IPC分类号： H01L21/00

CPC分类号： H01L25/105 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A integrated circuit package on package system is provided including providing a base substrate having a base stackable connection, attaching a base integrated circuit on the base substrate, forming a stackable package including the base integrated circuit encapsulated with the base stackable connection partially exposed, and attaching a bottom package on the stackable package.

摘要翻译： 提供了一种集成电路封装在封装系统上，包括提供具有基本可堆叠连接的基底基板，将基底集成电路连接在基底基板上，形成可堆叠的封装，其包括基部集成电路，该基本集成电路封装有部分露出的基部可堆叠连接， 可堆叠包装上的底部包装。

公开(公告)号：US20100230796A1

公开(公告)日：2010-09-16

申请号：US12772128

申请日：2010-04-30

申请人： Choong Bin Yim ,  Hyeog Chan Kwon ,  Jong-Woo Ha

发明人： Choong Bin Yim ,  Hyeog Chan Kwon ,  Jong-Woo Ha

IPC分类号： H01L23/52 ,  H01L21/50 ,  H01L23/31

CPC分类号： H01L23/3128 ,  H01L23/3135 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for making an integrated circuit package-in-package system includes: forming a first integrated circuit package including a first device and a first substrate and having a first interface; stacking a second integrated circuit package including a second device and a second substrate and having a second interface above the first integrated circuit package; and fitting the first interface directly on the second interface.

摘要翻译： 一种制造集成电路封装包装系统的方法，包括：形成包括第一器件和第一衬底并具有第一接口的第一集成电路封装; 堆叠包括第二器件和第二衬底的第二集成电路封装，并且在第一集成电路封装之上具有第二接口; 并将第一个接口直接安装在第二个接口上。