公开(公告)号：US08460968B2

公开(公告)日：2013-06-11

申请号：US12885137

申请日：2010-09-17

申请人： DongSam Park ,  HanGil Shin ,  HeeJo Chi

发明人： DongSam Park ,  HanGil Shin ,  HeeJo Chi

IPC分类号： H01L21/16

CPC分类号： H01L23/3128 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/5385 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a stack substrate with a component side; connecting an integrated circuit component to the component side; attaching a conductive post to the component side and adjacent the integrated circuit component, the conductive post having a protruded end above the integrated circuit component; forming a protection layer on a top and sides of the protruded end, the protection layer having a width equal to a width of the conductive post; applying a stack encapsulation over the integrated circuit component, over the stack substrate, and around a portion of the conductive post, the protection layer exposed from the stack encapsulation; and mounting a base package under the stack substrate, base package connected to the stack substrate.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有元件侧的堆叠衬底; 将集成电路部件连接到部件侧; 将导电柱附接到部件侧并且与集成电路部件相邻，所述导电柱在集成电路部件上方具有突出端; 在突出端的顶部和侧面上形成保护层，保护层的宽度等于导电柱的宽度; 在所述集成电路部件上，在所述堆叠衬底上以及所述导电柱的一部分周围施加堆叠封装，所述保护层暴露于所述堆叠封装; 并且将基底封装件安装在所述堆叠衬底下方，所述基底封装件连接到所述堆叠衬底。

公开(公告)号：US20130075933A1

公开(公告)日：2013-03-28

申请号：US13679615

申请日：2012-11-16

申请人： DongSam Park ,  JoungIn Yang

发明人： DongSam Park ,  JoungIn Yang

IPC分类号： H01L23/522 ,  H01L23/00

CPC分类号： H01L23/5226 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49827 ,  H01L24/28 ,  H01L24/48 ,  H01L24/73 ,  H01L24/82 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of a package-on-package system includes: providing a substrate connection; attaching a semiconductor die to the substrate connection using an adhesive, with the substrate connection affixed directly by the adhesive; forming an encapsulant around the semiconductor die to have a bottom exposed surface coplanar with a bottom surface of the substrate connection and to have a top exposed surface with through openings extending therefrom through the bottom exposed surface; and creating through vias by applying solder into the through openings, the through vias coplanar with the bottom exposed surface of the encapsulant and coplanar with the top exposed surface of the encapsulant.

摘要翻译： 包装封装系统的制造方法包括：提供衬底连接; 使用粘合剂将半导体管芯附接到基板连接，基板连接由粘合剂直接固定; 在所述半导体管芯周围形成密封剂以具有与所述衬底连接件的底表面共面的底部暴露表面，并具有顶部暴露表面，所述顶部暴露表面具有从其穿过所述底部暴露表面延伸的通孔; 并且通过将焊料施加到通孔中来形成通孔，所述通孔与所述密封剂的底部暴露表面共面并且与所述密封剂的顶部暴露表面共面。

公开(公告)号：US20090152547A1

公开(公告)日：2009-06-18

申请号：US12328717

申请日：2008-12-04

申请人： DongSam Park ,  YoungSik Cho ,  Sang-Ho Lee

发明人： DongSam Park ,  YoungSik Cho ,  Sang-Ho Lee

IPC分类号： H01L23/045 ,  H01L23/12 ,  H01L21/02

CPC分类号： H01L21/4832 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/552 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a substrate; mounting a base integrated circuit on the substrate; forming a leadframe interposer, over the base integrated circuit, by: providing a metal sheet, mounting an integrated circuit die on the metal sheet, injecting a molded package body on the integrated circuit die and the metal sheet, and forming a ball pad, a bond finger, or a combination thereof from the metal sheet that is not protected by the molded package body; coupling a circuit package on the ball pad; and forming a component package on the substrate, the base integrated circuit, and the leadframe interposer.

摘要翻译： 一种集成电路封装系统的制造方法，包括：形成衬底; 将基底集成电路安装在基板上; 在基底集成电路上形成引线框架插入件，通过：提供金属片，在金属片上安装集成电路管芯，将模制封装体注入集成电路管芯和金属片上，并形成球垫， 粘合指状物或其组合从未被模制包装体保护的金属片材; 将电路封装耦合在球垫上; 以及在基板，基底集成电路和引线框架插入件上形成部件封装。

公开(公告)号：US20090072377A1

公开(公告)日：2009-03-19

申请号：US11857206

申请日：2007-09-18

申请人： DongSam Park ,  A Leam Choi ,  Keon Teak Kang

发明人： DongSam Park ,  A Leam Choi ,  Keon Teak Kang

IPC分类号： H01L23/48

CPC分类号： H01L23/3164 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: mounting an integrated circuit die over a carrier; attaching a delamination prevention structure over the integrated circuit die; and encapsulating the delamination prevention structure and the integrated circuit die.

摘要翻译： 集成电路封装系统包括：将集成电路管芯安装在载体上; 在集成电路模具上附加防分层结构; 并封装防分层结构和集成电路管芯。

公开(公告)号：US20070194423A1

公开(公告)日：2007-08-23

申请号：US11307722

申请日：2006-02-17

申请人： Choong Bin Yim ,  Sungmin Song ,  SeongMin Lee ,  Jaehyun Lim ,  Joungin Yang ,  DongSam Park

发明人： Choong Bin Yim ,  Sungmin Song ,  SeongMin Lee ,  Jaehyun Lim ,  Joungin Yang ,  DongSam Park

IPC分类号： H01L23/02

CPC分类号： H01L25/0657 ,  H01L23/3128 ,  H01L24/73 ,  H01L24/97 ,  H01L25/03 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2924/01005 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： A stacked integrated circuit package-in-package system is provided forming a first integrated circuit spacer package including a mold compound with a recess provided therein, stacking the first integrated circuit spacer package on an integrated circuit die on a substrate with the recess positioned therebetween, and attaching a first electrical interconnect extending from the recess and connected between the integrated circuit die and the substrate.

摘要翻译： 提供一种堆叠式集成电路封装封装系统，其形成第一集成电路间隔件封装，其包括设置在其中的凹部的模具化合物，其中第一集成电路间隔件封装在基板上的集成电路管芯上，凹部位于其间， 以及附接从所述凹部延伸并连接在所述集成电路管芯和所述衬底之间的第一电互连。

公开(公告)号：US09087701B2

公开(公告)日：2015-07-21

申请号：US13098438

申请日：2011-04-30

申请人： DongSam Park ,  YongDuk Lee

发明人： DongSam Park ,  YongDuk Lee

IPC分类号： H01L21/00 ,  H01L23/00 ,  H01L25/10 ,  H01L25/065 ,  H01L23/48

CPC分类号： H01L24/05 ,  H01L23/3107 ,  H01L23/481 ,  H01L23/528 ,  H01L24/03 ,  H01L24/06 ,  H01L24/16 ,  H01L24/19 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05558 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/06181 ,  H01L2224/16145 ,  H01L2224/16147 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/19 ,  H01L2224/05552 ,  H01L2224/81805 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device has a substrate with a first conductive layer over a surface of the substrate and a plurality of cavities exposing the first conductive layer. A first semiconductor die having conductive TSV is mounted into the cavities of the substrate. A first insulating layer is formed over the substrate and first semiconductor die and extends into the cavities to embed the first semiconductor die within the substrate. A portion of the first insulating layer is removed to expose the conductive TSV. A second conductive layer is formed over the conductive TSV. A portion of the first conductive layer is removed to form electrically common or electrically isolated conductive segments of the first conductive layer. A second insulating layer is formed over the substrate and conductive segments of the first conductive layer. A second semiconductor die is mounted over the substrate electrically connected to the second conductive layer.

摘要翻译： 半导体器件具有在衬底的表面上具有第一导电层的衬底和暴露第一导电层的多个空腔。 具有导电TSV的第一半导体管芯被安装到基板的空腔中。 第一绝缘层形成在衬底和第一半导体管芯上并延伸到空腔中以将第一半导体管芯嵌入衬底内。 去除第一绝缘层的一部分以暴露导电TSV。 在导电TSV上形成第二导电层。 去除第一导电层的一部分以形成第一导电层的电通常或电隔离的导电段。 第二绝缘层形成在衬底和第一导电层的导电段上。 第二半导体管芯安装在电连接到第二导电层上的衬底上。

公开(公告)号：US08704365B2

公开(公告)日：2014-04-22

申请号：US13187252

申请日：2011-07-20

申请人： DongSam Park ,  Dongjin Jung

发明人： DongSam Park ,  Dongjin Jung

IPC分类号： H01L23/34

CPC分类号： H01L23/3128 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit packaging system includes: a carrier, having a carrier top side and a carrier bottom side, without an active device attached to the carrier bottom side; an interconnect over the carrier; and a first encapsulation, having a cavity, around the interconnect over the carrier top side with the interconnect partially exposed from the first encapsulation, and with the carrier top side partially exposed with the cavity.

摘要翻译： 一种集成电路封装系统，包括：载体，具有载体顶侧和载体底侧，而没有附接到载体底侧的有源装置; 在载体上的互连; 以及具有空腔的第一封装，在所述载体顶侧上的所述互连件周围，所述互连部分地从所述第一封装暴露出来，并且所述载体顶侧部分地暴露于所述腔。

公开(公告)号：US08367465B2

公开(公告)日：2013-02-05

申请号：US11276942

申请日：2006-03-17

申请人： DongSam Park ,  Choong Bin Yim ,  In Sang Yoon

发明人： DongSam Park ,  Choong Bin Yim ,  In Sang Yoon

IPC分类号： H01L21/00

CPC分类号： H01L25/105 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A integrated circuit package on package system is provided including providing a base substrate having a base stackable connection, attaching a base integrated circuit on the base substrate, forming a stackable package including the base integrated circuit encapsulated with the base stackable connection partially exposed, and attaching a bottom package on the stackable package.

摘要翻译： 提供了一种集成电路封装在封装系统上，包括提供具有基本可堆叠连接的基底基板，将基底集成电路连接在基底基板上，形成可堆叠的封装，其包括基部集成电路，该基本集成电路封装有部分露出的基部可堆叠连接， 可堆叠包装上的底部包装。

公开(公告)号：US20120273960A1

公开(公告)日：2012-11-01

申请号：US13098440

申请日：2011-04-30

申请人： DongSam Park ,  YongDuk Lee

发明人： DongSam Park ,  YongDuk Lee

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L23/49827 ,  H01L21/4846 ,  H01L21/561 ,  H01L23/295 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/48 ,  H01L24/73 ,  H01L25/16 ,  H01L2221/6835 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/0603 ,  H01L2224/06181 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16145 ,  H01L2224/2518 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73209 ,  H01L2224/73259 ,  H01L2224/73265 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K1/185 ,  H01L2924/00 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2224/19 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device has a carrier or first conductive layer with a plurality of TSV semiconductor die mounted over the carrier or first conductive layer. An encapsulant is deposited around the first semiconductor die and over the carrier or first conductive layer to embed the first semiconductor die. A conductive TMV is formed through the encapsulant. A second conductive layer is formed over a first surface of the encapsulant. A first insulating layer is formed over the first surface of the encapsulant while exposing portions of the second conductive layer. A second insulating layer is formed over the second surface of the encapsulant while exposing portions of the first conductive layer. Alternatively, a first interconnect structure is formed over the first surface of the encapsulant. The carrier is removed and a second interconnect structure is formed over a second surface of the encapsulant.

摘要翻译： 半导体器件具有载体或第一导电层，其具有安装在载体或第一导电层上的多个TSV半导体管芯。 围绕第一半导体管芯并在载体或第一导电层上沉积密封剂以嵌入第一半导体管芯。 通过密封剂形成导电TMV。 在密封剂的第一表面上形成第二导电层。 第一绝缘层形成在密封剂的第一表面上，同时暴露第二导电层的部分。 第二绝缘层形成在密封剂的第二表面上，同时暴露第一导电层的部分。 或者，在密封剂的第一表面上形成第一互连结构。 移除载体并且在密封剂的第二表面上形成第二互连结构。

公开(公告)号：US08110905B2

公开(公告)日：2012-02-07

申请号：US12328717

申请日：2008-12-04

申请人： DongSam Park ,  YoungSik Cho ,  Sang-Ho Lee

发明人： DongSam Park ,  YoungSik Cho ,  Sang-Ho Lee

IPC分类号： H01L23/495 ,  H01L21/58 ,  H01L21/60

CPC分类号： H01L21/4832 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/552 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a substrate; mounting a base integrated circuit on the substrate; forming a leadframe interposer, over the base integrated circuit, by: providing a metal sheet, mounting an integrated circuit die on the metal sheet, injecting a molded package body on the integrated circuit die and the metal sheet, and forming a ball pad, a bond finger, or a combination thereof from the metal sheet that is not protected by the molded package body; coupling a circuit package on the ball pad; and forming a component package on the substrate, the base integrated circuit, and the leadframe interposer.

摘要翻译： 一种集成电路封装系统的制造方法，包括：形成衬底; 将基底集成电路安装在基板上; 在基底集成电路上形成引线框架插入件，通过：提供金属片，在金属片上安装集成电路管芯，将模制封装体注入集成电路管芯和金属片上，并形成球垫， 粘合指状物或其组合从未被模制包装体保护的金属片材; 将电路封装耦合在球垫上; 以及在基板，基底集成电路和引线框架插入件上形成部件封装。