公开(公告)号：US20070216006A1

公开(公告)日：2007-09-20

申请号：US11276942

申请日：2006-03-17

申请人： DongSam Park ,  Choong Bin Yim ,  In Sang Yoon

发明人： DongSam Park ,  Choong Bin Yim ,  In Sang Yoon

IPC分类号： H01L23/02

CPC分类号： H01L25/105 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A integrated circuit package on package system is provided including providing a base substrate having a base stackable connection, attaching a base integrated circuit on the base substrate, forming a stackable package including the base integrated circuit encapsulated with the base stackable connection partially exposed, and attaching a bottom package on the stackable package.

摘要翻译： 提供了一种集成电路封装在封装系统上，包括提供具有基本可堆叠连接的基底基板，将基底集成电路连接在基底基板上，形成可堆叠的封装，其包括基部集成电路，该基本集成电路封装有部分露出的基部可堆叠连接， 可堆叠包装上的底部包装。

公开(公告)号：US08367465B2

公开(公告)日：2013-02-05

申请号：US11276942

申请日：2006-03-17

申请人： DongSam Park ,  Choong Bin Yim ,  In Sang Yoon

发明人： DongSam Park ,  Choong Bin Yim ,  In Sang Yoon

IPC分类号： H01L21/00

CPC分类号： H01L25/105 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A integrated circuit package on package system is provided including providing a base substrate having a base stackable connection, attaching a base integrated circuit on the base substrate, forming a stackable package including the base integrated circuit encapsulated with the base stackable connection partially exposed, and attaching a bottom package on the stackable package.

摘要翻译： 提供了一种集成电路封装在封装系统上，包括提供具有基本可堆叠连接的基底基板，将基底集成电路连接在基底基板上，形成可堆叠的封装，其包括基部集成电路，该基本集成电路封装有部分露出的基部可堆叠连接， 可堆叠包装上的底部包装。

公开(公告)号：US09905491B1

公开(公告)日：2018-02-27

申请号：US14039938

申请日：2013-09-27

申请人： In Sang Yoon ,  DeokKyung Yang ,  SeongHun Mun

发明人： In Sang Yoon ,  DeokKyung Yang ,  SeongHun Mun

IPC分类号： H01L21/50 ,  H01L23/538 ,  H01L23/31

CPC分类号： H01L23/3128

摘要： Semiconductor packages with multiple substrates can incorporate cavities in a portion of an upper substrate to minimize or reduce void formations during a molding process. The cavities can be formed substantially over the integrated circuit devices and not over the internal interconnects to further facilitate the flow of the molding compound. The combination with extension members or recesses on a top or exterior surface of the upper substrate can further cut down on bleeding or spill over of the molding compound between adjacent packages and improve device reliability and yield.

公开(公告)号：US20140284791A1

公开(公告)日：2014-09-25

申请号：US14214765

申请日：2014-03-15

申请人： Byung Tai Do ,  Arnel Senosa Trasporto ,  Sung Soo Kim ,  Asri Yusof ,  In Sang Yoon

发明人： Byung Tai Do ,  Arnel Senosa Trasporto ,  Sung Soo Kim ,  Asri Yusof ,  In Sang Yoon

IPC分类号： H01L23/28 ,  H01L23/498 ,  H01L23/00

CPC分类号： H01L24/81 ,  H01L21/4846 ,  H01L21/486 ,  H01L21/561 ,  H01L21/683 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2221/68381 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2732 ,  H01L2224/27334 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81411 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81464 ,  H01L2224/8385 ,  H01L2224/85444 ,  H01L2224/9202 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A system and method for manufacturing an integrated circuit packaging system includes: forming a base substrate including: providing a sacrificial carrier: mounting a metallic sheet on the sacrificial carrier, applying a top trace to the metallic sheet, forming a conductive stud on the top trace, forming a base encapsulation over the metallic sheet, the top trace, and the conductive stud, the top trace exposed from a top surface of the base encapsulation, and removing the sacrificial carrier and the metallic sheet; mounting an integrated circuit device on the base substrate; and encapsulating the integrated circuit device and the base substrate with a top encapsulation.

摘要翻译： 一种用于制造集成电路封装系统的系统和方法，包括：形成基底基底，包括：提供牺牲载体：将金属片安装在牺牲载体上，向金属片施加顶部迹线，在顶部迹线上形成导电柱 在所述金属片，所述顶部迹线和所述导电柱上形成基底封装，所述顶部迹线从所述基底封装的顶部表面露出，以及移除所述牺牲载体和所述金属片; 在基底基板上安装集成电路器件; 并用顶部封装封装集成电路器件和基底衬底。

公开(公告)号：US08765525B2

公开(公告)日：2014-07-01

申请号：US13162566

申请日：2011-06-16

申请人： In Sang Yoon ,  DeokKyung Yang ,  Sungmin Song

发明人： In Sang Yoon ,  DeokKyung Yang ,  Sungmin Song

IPC分类号： H01L21/00

CPC分类号： H01L23/481 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5385 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A method of manufacture of an integrated packaging system includes: providing a substrate; mounting an integrated circuit on the substrate; mounting an interposer substrate having an interposer pad on the integrated circuit; covering an encapsulant over the integrated circuit and the interposer substrate; forming a hole through the encapsulant aligned over the interposer pad; and placing a conductive connector on and in direct contact with the interposer pad.

摘要翻译： 一种集成包装系统的制造方法包括：提供基板; 在基板上安装集成电路; 在所述集成电路上安装具有插入器焊盘的插入器基板; 覆盖集成电路和插入器衬底上的密封剂; 通过所述密封剂形成穿过所述插入器衬垫的孔; 并且将导电连接器放置在与插入器垫直接接触的位置。

公开(公告)号：US08130512B2

公开(公告)日：2012-03-06

申请号：US12273541

申请日：2008-11-18

申请人： In Sang Yoon ,  SeongMin Lee ,  Sungmin Song

发明人： In Sang Yoon ,  SeongMin Lee ,  Sungmin Song

IPC分类号： H01R9/00

CPC分类号： H05K1/144 ,  H01L23/3128 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/141 ,  H05K3/3436 ,  H05K2201/09709 ,  H05K2201/09972 ,  H05K2201/10734 ,  H05K2203/049 ,  H01L2924/00012 ,  H01L2224/32225 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method of manufacturing an integrated circuit package system including: providing a circuit board having an interconnect thereon; mounting a first device offset on the circuit board; and applying a first encapsulant of a first thickness over the first device, the first encapsulant of a second thickness thinner than the first thickness over the remainder of the circuit board with the interconnect exposed, or a second encapsulant of a third thickness over a second device on an opposite surface of the circuit board and differently offset from the first device.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供其上具有互连的电路板; 在电路板上安装第一设备偏移; 以及在所述第一装置上施加第一厚度的第一密封剂，所述第一密封剂的第二厚度比所述电路板的剩余部分薄于所述第一厚度，所述第一厚度在所述第一装置上暴露，或者在第二装置上具有第三厚度的第二密封剂 在电路板的相对表面上，并且与第一器件不同地偏移。

公开(公告)号：US08102666B2

公开(公告)日：2012-01-24

申请号：US12194506

申请日：2008-08-19

申请人： HyungSang Park ,  In Sang Yoon ,  DeokKyung Yang ,  Soo-San Park

发明人： HyungSang Park ,  In Sang Yoon ,  DeokKyung Yang ,  Soo-San Park

IPC分类号： H01L23/02

CPC分类号： H01L23/4334 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/5385 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: connecting a carrier and an integrated circuit mounted thereover; mounting an interposer, having an opening, over the integrated circuit; connecting an interconnect between the interposer and the carrier through the opening; and forming an encapsulation planar with a carrier vertical side of the carrier and an interposer vertical side of the interposer.

摘要翻译： 集成电路封装系统包括：连接载体和安装在其上的集成电路; 在集成电路上安装具有开口的插入器; 通过开口连接插入器和载体之间的互连; 并且形成与载体的载体垂直侧和插入器的插入器垂直侧的平坦的封装。

公开(公告)号：US08035210B2

公开(公告)日：2011-10-11

申请号：US11966219

申请日：2007-12-28

申请人： Joungin Yang ,  Dongjin Jung ,  In Sang Yoon

发明人： Joungin Yang ,  Dongjin Jung ,  In Sang Yoon

IPC分类号： H01L23/48 ,  H01L21/02

CPC分类号： H01L24/73 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/48 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/06568 ,  H01L2225/06575 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit package system includes: providing a base substrate; coupling a base integrated circuit on the base substrate; forming a double side molded interposer unit over the base integrated circuit including: providing an interposer substrate having an interposer top and an interposer bottom, mounting a first integrated circuit to the interposer bottom and electrically connected thereto, mounting a second integrated circuit to the interposer top and electrically connected thereto, and molding a first chip cover on the first integrated circuit and a second chip cover on the second integrated circuit; and coupling an external component to the double side molded interposer unit.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供基底基板; 将基底集成电路耦合在基底基板上; 在所述基底集成电路上形成双面模制插入器单元，包括：提供具有插入器顶部和插入器底部的插入器基板，将第一集成电路安装到所述插入器底部并与其电连接，将第二集成电路安装到所述插入件顶部 并与其电连接，并且在第一集成电路上模制第一芯片盖和在第二集成电路上模制第二芯片盖; 并将外部部件耦合到双面成型插入件单元。

公开(公告)号：US20090127715A1

公开(公告)日：2009-05-21

申请号：US11940969

申请日：2007-11-15

申请人： HanGil Shin ,  In Sang Yoon ,  Jae Han Chung

发明人： HanGil Shin ,  In Sang Yoon ,  Jae Han Chung

IPC分类号： H01L23/50

CPC分类号： H01L25/03 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： A mountable integrated circuit package system includes: mounting a first integrated circuit device over a carrier; mounting a second integrated circuit device over the first integrated circuit device includes: attaching the second integrated circuit device to a first substrate side of a substrate, and connecting a first electrical interconnect between the second integrated circuit device and a second substrate side of the substrate through an opening in the substrate. The mountable integrated circuit package system further including: forming a package encapsulation over the first integrated circuit device and the carrier with the substrate partially exposed.

摘要翻译： 一种可安装的集成电路封装系统，包括：将第一集成电路器件安装在载体上; 在所述第一集成电路器件上安装第二集成电路器件包括：将所述第二集成电路器件连接到衬底的第一衬底侧，以及通过所述第二集成电路器件与所述衬底的第二衬底侧之间的第一电互连连接 在基板上的开口。 可安装的集成电路封装系统还包括：在第一集成电路器件和载体上形成封装封装，衬底​​部分露出。

公开(公告)号：US08633100B2

公开(公告)日：2014-01-21

申请号：US13163643

申请日：2011-06-17

申请人： DeokKyung Yang ,  In Sang Yoon ,  SangJin Lee

发明人： DeokKyung Yang ,  In Sang Yoon ,  SangJin Lee

IPC分类号： H01L21/768

CPC分类号： H01L21/565 ,  H01L21/4853 ,  H01L23/3128 ,  H01L23/49811 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/18161

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a substrate; forming a connection post on the substrate, the connection post having a post top and a post side; mounting an integrated circuit die on the substrate, the integrated circuit die having a top die surface; molding an encapsulation on the integrated circuit die and the connection post; and forming a connector recess in the encapsulation by removing the encapsulation around the connection post exposing a portion of the post side.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供基板; 在所述基板上形成连接柱，所述连接柱具有柱顶和柱侧; 在基板上安装集成电路管芯，集成电路管芯具有顶部管芯表面; 在集成电路管芯和连接柱上成型封装; 以及通过去除暴露一部分柱侧的连接柱周围的封装而在封装中形成连接器凹部。