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11.发明申请公开(公告)号：US20080295966A1
公开(公告)日：2008-12-04
申请号：US12188667
申请日：2008-08-08
申请人： Chun Christine Dong , Wayne Thomas McDermott , Alexander Schwarz , Gregory Khosrov Arslanian , Richard E. Patrick , Gary A. Orbeck , Donald A. Seccombe, JR.
发明人： Chun Christine Dong , Wayne Thomas McDermott , Alexander Schwarz , Gregory Khosrov Arslanian , Richard E. Patrick , Gary A. Orbeck , Donald A. Seccombe, JR.
IPC分类号： C23F1/08
CPC分类号： H01J37/32431 , B23K1/008 , B23K1/206 , B23K35/268 , B23K35/38 , C23G5/00 , H01L21/31116 , H01L21/67069 , H01L2924/0002 , H01L2924/00
摘要： An apparatus and a method comprising same for removing metal oxides from a substrate surface are disclosed herein. In one particular embodiment, the apparatus comprises an electrode assembly that has a housing that is at least partially comprised of an insulating material and having an internal volume and at least one fluid inlet that is in fluid communication with the internal volume; a conductive base connected to the housing comprising a plurality of conductive tips that extend therefrom into a target area and a plurality of perforations that extend therethrough and are in fluid communication with the internal volume to allow for a passage of a gas mixture comprising a reducing gas.
摘要翻译： 本文公开了一种用于从衬底表面去除金属氧化物的装置和方法。 在一个特定实施例中，该装置包括电极组件，该电极组件至少部分地由绝缘材料构成并具有内部容积和与内部容积流体连通的至少一个流体入口的壳体; 连接到壳体的导电基座包括从其延伸到目标区域中的多个导电尖端和穿过其延伸并与内部体积流体连通的多个穿孔，以允许包含还原气体的气体混合物通过 。
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12.发明申请Removal of Surface Oxides by Electron Attachment for Wafer Bumping Applications 有权通过用于晶片冲击应用的电子附件去除表面氧化物公开(公告)号：US20080149690A1
公开(公告)日：2008-06-26
申请号：US12042055
申请日：2008-03-04
申请人： Chun Christine Dong , Wayne Thomas McDermott , Alexander Schwarz , Gregory Khosrov Arslanian , Richard E. Patrick
发明人： Chun Christine Dong , Wayne Thomas McDermott , Alexander Schwarz , Gregory Khosrov Arslanian , Richard E. Patrick
IPC分类号： B23K1/20
CPC分类号： H01J37/32431 , B23K1/008 , B23K1/206 , B23K35/268 , B23K35/38 , C23G5/00 , H01L21/31116 , H01L21/67069 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a method for removing metal oxides from a substrate surface. In one particular embodiment, the method comprises: providing a substrate, a first, and a second electrode that reside within a target area; passing a gas mixture comprising a reducing gas through the target area; supplying an amount of energy to the first and/or the second electrode to generate electrons within the target area wherein at least a portion of the electrons attach to a portion of the reducing gas and form a negatively charged reducing gas; and contacting the substrate with the negatively charged reducing gas to reduce the metal oxides on the surface of the substrate.
摘要翻译： 本发明涉及从衬底表面去除金属氧化物的方法。 在一个特定实施例中，该方法包括：提供驻留在目标区域内的衬底，第一和第二电极; 将包含还原气体的气体混合物通过所述目标区域; 向第一和/或第二电极提供一定量的能量以在目标区域内产生电子，其中至少一部分电子附着到一部分还原气体并形成带负电荷的还原气体; 并使基板与带负电荷的还原气体接触以减少基板表面上的金属氧化物。
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13.发明授权Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment and remote ion generation 有权通过涉及电子附着和远程离子生成的无通量技术去除表面氧化物的装置和方法公开(公告)号：US07307826B2
公开(公告)日：2007-12-11
申请号：US11389772
申请日：2006-03-27
IPC分类号： H01T23/00
CPC分类号： C23G5/00 , B08B7/00 , B23K1/0016 , B23K1/008 , B23K1/012 , B23K1/206 , H05K3/3489 , H05K2203/095
摘要： The present invention provides a method and apparatus for the dry fluxing of at least one component and/or solder surface via electron attachment. In one embodiment, there is provided a method for removing oxides from the surface of a component comprising: providing a component on a substrate wherein the substrate is grounded or has a positive electrical potential to form a target assembly; passing a gas mixture comprising a reducing gas through an ion generator comprising a first and a second electrode; supplying an amount of voltage to at least one of the first and second electrodes sufficient to generate electrons wherein the electrons attach to at least a portion of the reducing gas and form a negatively charged reducing gas; and contacting the target assembly with the negatively charged reducing gas to reduce the oxides on the component.
摘要翻译： 本发明提供了一种用于通过电子附件干燥熔化至少一种组分和/或焊料表面的方法和装置。 在一个实施方案中，提供了从组分表面去除氧化物的方法，包括：在基底上提供组分，其中所述基底接地或具有正电位以形成靶组件; 使包含还原气体的气体混合物通过包括第一和第二电极的离子发生器; 向所述第一和第二电极中的至少一个电极供应足以产生电子的电压，其中所述电子附着到所述还原气体的至少一部分并形成带负电荷的还原气体; 并将目标组件与带负电荷的还原气体接触以减少部件上的氧化物。
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14.发明授权Apparatus and method for removal of surface oxides via fluxless technique electron attachment and remote ion generation 有权通过无电流技术电子附着和远程离子生成去除表面氧化物的装置和方法公开(公告)号：US07079370B2
公开(公告)日：2006-07-18
申请号：US10425426
申请日：2003-04-28
IPC分类号： H01T23/00
CPC分类号： C23G5/00 , B08B7/00 , B23K1/0016 , B23K1/008 , B23K1/012 , B23K1/206 , H05K3/3489 , H05K2203/095
摘要： The present invention provides a method and apparatus for the dry fluxing of at least one component and/or solder surface via electron attachment. In one embodiment, there is provided a method for removing oxides from the surface of a component comprising: providing a component on a substrate wherein the substrate is grounded or has a positive electrical potential to form a target assembly; passing a gas mixture comprising a reducing gas through an ion generator comprising a first and a second electrode; supplying an amount of voltage to at least one of the first and second electrodes sufficient to generate electrons wherein the electrons attach to at least a portion of the reducing gas and form a negatively charged reducing gas; and contacting the target assembly with the negatively charged reducing gas to reduce the oxides on the component.
摘要翻译： 本发明提供了一种用于通过电子附件干燥熔化至少一种组分和/或焊料表面的方法和装置。 在一个实施方案中，提供了从组分表面去除氧化物的方法，包括：在基底上提供组分，其中所述基底接地或具有正电位以形成靶组件; 使包含还原气体的气体混合物通过包括第一和第二电极的离子发生器; 向所述第一和第二电极中的至少一个电极供应足以产生电子的电压，其中所述电子附着到所述还原气体的至少一部分并形成带负电荷的还原气体; 并将目标组件与带负电荷的还原气体接触以减少部件上的氧化物。
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公开(公告)号：US07897029B2
公开(公告)日：2011-03-01
申请号：US12119701
申请日：2008-05-13
IPC分类号： C25F5/00
CPC分类号： B23K1/008 , B23K1/206 , B23K35/268 , B23K35/38 , C23G5/00 , H01J37/32431 , H01L21/31116 , H01L21/67069 , H05K3/3489 , H05K2203/087 , H05K2203/105 , H05K2203/1157
摘要： The present invention relates to a method for removing metal oxides from a substrate surface. In one particular embodiment, the method comprises: providing a substrate, a first, and a second electrode that reside within a target area; passing a gas mixture comprising a reducing gas through the target area; supplying an amount of energy to the first and/or the second electrode to generate electrons within the target area wherein at least a portion of the electrons attach to a portion of the reducing gas and form a negatively charged reducing gas; and contacting the substrate with the negatively charged reducing gas to reduce the metal oxides on the surface of the substrate.
摘要翻译： 本发明涉及从衬底表面去除金属氧化物的方法。 在一个特定实施例中，该方法包括：提供驻留在目标区域内的衬底，第一和第二电极; 将包含还原气体的气体混合物通过所述目标区域; 向第一和/或第二电极提供一定量的能量以在目标区域内产生电子，其中至少一部分电子附着到一部分还原气体并形成带负电荷的还原气体; 并使基板与带负电荷的还原气体接触以减少基板表面上的金属氧化物。
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公开(公告)号：US20090236236A1
公开(公告)日：2009-09-24
申请号：US12433108
申请日：2009-04-30
CPC分类号： B23K1/008 , B23K1/206 , B23K35/268 , B23K35/38 , B23K2101/40 , C23G5/00 , H01J37/32431 , H01J37/32706 , H01L21/02068 , H01L21/67069 , H01L2924/0002 , H05K3/26 , H05K3/3489 , H05K2203/087 , H05K2203/095 , H05K2203/105 , H05K2203/1157 , H01L2924/00
摘要： Described herein are a method and an apparatus for removing metal oxides from a substrate surface within a target area. In one particular embodiment, the method and apparatus has an energizing electrode which has an array of protruding conductive tips that are electrically connected by a conductive wire and separated into a first electrically connected group and a second electrically connected group wherein at least a portion of the conductive tips are activated by a DC voltage source that is negatively biased to generate electrons within the target area that attach to at least a portion of a reducing gas that is present in the target area to form a negatively charged reducing gas that contacts the treating surface to reduce the metal oxides on the treating surface of the substrate.
摘要翻译： 这里描述了一种用于从目标区域内的衬底表面去除金属氧化物的方法和装置。 在一个特定实施例中，该方法和装置具有通电电极，该激励电极具有突出的导电尖端的阵列，该阵列通过导线电连接并分离成第一电连接组和第二电连接组，其中至少一部分 导电尖端被直流电压源激活，所述直流电压源被负偏压以在目标区域内产生电子，所述电极附着到存在于目标区域中的至少一部分还原气体，以形成与处理表面接触的带负电荷的还原气体 以还原基材的处理表面上的金属氧化物。
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公开(公告)号：US20090223831A1
公开(公告)日：2009-09-10
申请号：US12119701
申请日：2008-05-13
IPC分类号： C25F5/00
CPC分类号： B23K1/008 , B23K1/206 , B23K35/268 , B23K35/38 , C23G5/00 , H01J37/32431 , H01L21/31116 , H01L21/67069 , H05K3/3489 , H05K2203/087 , H05K2203/105 , H05K2203/1157
摘要： The present invention relates to a method for removing metal oxides from a substrate surface. In one particular embodiment, the method comprises: providing a substrate, a first, and a second electrode that reside within a target area; passing a gas mixture comprising a reducing gas through the target area; supplying an amount of energy to the first and/or the second electrode to generate electrons within the target area wherein at least a portion of the electrons attach to a portion of the reducing gas and form a negatively charged reducing gas; and contacting the substrate with the negatively charged reducing gas to reduce the metal oxides on the surface of the substrate.
摘要翻译： 本发明涉及从衬底表面去除金属氧化物的方法。 在一个特定实施例中，该方法包括：提供驻留在目标区域内的衬底，第一和第二电极; 将包含还原气体的气体混合物通过所述目标区域; 向第一和/或第二电极提供一定量的能量以在目标区域内产生电子，其中至少一部分电子附着到一部分还原气体并形成带负电荷的还原气体; 并使基板与带负电荷的还原气体接触以减少基板表面上的金属氧化物。
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18.发明申请Addition of D2 to H2 to Detect and Calibrate Atomic Hydrogen Formed By Dissociative Electron attachment 审中-公开添加D2至H2以检测和校准通过分离电子附着形成的原子氢公开(公告)号：US20090008426A1
公开(公告)日：2009-01-08
申请号：US12233678
申请日：2008-09-19
IPC分类号： B23K37/00
CPC分类号： B23K1/206 , H01L2924/0002 , H05K3/3489 , H01L2924/00
摘要： A method of detecting and calibrating dry fluxing metal surfaces of one or more components to be soldered by electron attachment using a gas mixture of reducing gas comprising hydrogen and deuterium, comprising the steps of: a) providing one or more components to be soldered which are connected to a first electrode as a target assembly; b) providing a second electrode adjacent the target assembly; c) providing a gas mixture comprising a reducing gas comprising hydrogen and deuterium between the first and second electrodes; d) providing a direct current (DC) voltage to the first and second electrodes to form an emission current between the electrodes and donating electrons to the reducing gas to form negatively charged ionic reducing gas and molecules of hydrogen bonded to deuterium; e) contacting the target assembly with the negatively charged ionic reducing gas and reducing oxides on the target assembly. Related apparatus is also disclosed.
摘要翻译： 一种通过使用包括氢和氘的还原气体的气体混合物通过电子附着来检测和校准要焊接的一种或多种组分的干熔剂金属表面的方法，包括以下步骤：a）提供一种或多种待焊接的组分， 连接到作为目标组件的第一电极; b）提供邻近目标组件的第二电极; c）在所述第一和第二电极之间提供包含包含氢和氘的还原气体的气体混合物; d）向所述第一和第二电极提供直流（DC）电压以在所述电极之间形成发射电流并且将电子供给到所述还原气体以形成带负电荷的离子还原气体和键合到氘的氢分子; e）使目标组件与负电荷的离子还原气体和目标组件上的还原氧化物接触。 还公开了相关装置。
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公开(公告)号：US20070193026A1
公开(公告)日：2007-08-23
申请号：US11481444
申请日：2006-07-06
申请人： Chun Christine Dong , Eugene Joseph Karwacki , Richard E. Patrick , David Allen Roberts , Robert Krantz Pinschmidt , John Anthony Thomas Norman , John Christopher Ivankovits
发明人： Chun Christine Dong , Eugene Joseph Karwacki , Richard E. Patrick , David Allen Roberts , Robert Krantz Pinschmidt , John Anthony Thomas Norman , John Christopher Ivankovits
IPC分类号： B23K35/38
CPC分类号： H05K3/105 , C23C18/08 , H01L21/4867 , H05K2203/087 , H05K2203/1157 , H05K2203/121 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155
摘要： This invention is directed to a method of forming electrical conductors comprised of conductive metals generally carried on a substrate. In the method, a conductor formulation generally comprised of metal particles or metal precursor or mixture thereof, typically in the form of an ink or paste, is applied to the substrate and converted into a conductive metal by application of sufficient heat and for a sufficient time to effect sintering thereof while in the presence of a negatively charged ionic reducing gas.
摘要翻译： 本发明涉及一种形成电导体的方法，该导体由通常载于衬底上的导电金属组成。 在该方法中，通常由金属颗粒或金属前体或其混合物（通常为油墨或糊状物）组成的导体制剂施加到基底上，并通过施加足够的热量并足够的时间转化为导电金属 在负电荷的离子还原气体的存在下进行烧结。
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公开(公告)号：US08361340B2
公开(公告)日：2013-01-29
申请号：US12433108
申请日：2009-04-30
CPC分类号： B23K1/008 , B23K1/206 , B23K35/268 , B23K35/38 , B23K2101/40 , C23G5/00 , H01J37/32431 , H01J37/32706 , H01L21/02068 , H01L21/67069 , H01L2924/0002 , H05K3/26 , H05K3/3489 , H05K2203/087 , H05K2203/095 , H05K2203/105 , H05K2203/1157 , H01L2924/00
摘要： Described herein are a method and an apparatus for removing metal oxides from a substrate surface within a target area. In one particular embodiment, the method and apparatus has an energizing electrode which has an array of protruding conductive tips that are electrically connected by a conductive wire and separated into a first electrically connected group and a second electrically connected group wherein at least a portion of the conductive tips are activated by a DC voltage source that is negatively biased to generate electrons within the target area that attach to at least a portion of a reducing gas that is present in the target area to form a negatively charged reducing gas that contacts the treating surface to reduce the metal oxides on the treating surface of the substrate.
摘要翻译： 这里描述了一种用于从目标区域内的衬底表面去除金属氧化物的方法和装置。 在一个特定实施例中，该方法和装置具有通电电极，该激励电极具有突出的导电尖端的阵列，该阵列通过导线电连接并分离成第一电连接组和第二电连接组，其中至少一部分 导电尖端被直流电压源激活，所述直流电压源被负偏压以在目标区域内产生电子，所述电极附着到存在于目标区域中的至少一部分还原气体，以形成与处理表面接触的带负电荷的还原气体 以还原基材的处理表面上的金属氧化物。
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