Polydiode structure for photo diode
    11.
    发明授权
    Polydiode structure for photo diode 有权
    光电二极管的多晶硅结构

    公开(公告)号:US08367457B2

    公开(公告)日:2013-02-05

    申请号:US13205017

    申请日:2011-08-08

    IPC分类号: H01L21/00

    摘要: An integrated circuit device for converting an incident optical signal into an electrical signal comprises a semiconductor substrate, a well region formed inside the semiconductor substrate, a dielectric layer formed over the well region, and a layer of polysilicon for receiving the incident optical signal, formed over the dielectric layer, including a p-type portion, an n-type portion and an undoped portion disposed between the p-type and n-type portions, wherein the well region is biased to control the layer of polysilicon for providing the electrical signal.

    摘要翻译: 用于将入射光信号转换成电信号的集成电路装置包括半导体衬底,形成在半导体衬底内部的阱区,形成在阱区上的电介质层和用于接收入射光信号的多晶硅层,形成 包括p型部分,n型部分和设置在p型和n型部分之间的未掺杂部分,其中阱区被偏置以控制多晶硅层以提供电信号 。

    Poly diode structure for photo diode
    12.
    发明授权
    Poly diode structure for photo diode 有权
    光二极管的聚二极管结构

    公开(公告)号:US07439597B2

    公开(公告)日:2008-10-21

    申请号:US11618247

    申请日:2006-12-29

    IPC分类号: H01L27/14

    摘要: An integrated circuit device for converting an incident optical signal into an electrical signal comprises a semiconductor substrate, a well region formed inside the semiconductor substrate, a dielectric layer formed over the well region, and a layer of polysilicon for receiving the incident optical signal, formed over the dielectric layer, including a p-type portion, an n-type portion and an undoped portion disposed between the p-type and n-type portions, wherein the well region is biased to control the layer of polysilicon for providing the electrical signal.

    摘要翻译: 用于将入射光信号转换成电信号的集成电路装置包括半导体衬底,形成在半导体衬底内部的阱区,形成在阱区上的电介质层和用于接收入射光信号的多晶硅层,形成 包括p型部分,n型部分和设置在p型和n型部分之间的未掺杂部分,其中阱区被偏置以控制多晶硅层以提供电信号 。

    Polydiode structure for photo diode
    13.
    发明授权
    Polydiode structure for photo diode 有权
    光电二极管的多晶硅结构

    公开(公告)号:US07205641B2

    公开(公告)日:2007-04-17

    申请号:US11017053

    申请日:2004-12-21

    IPC分类号: H01L31/075

    摘要: An integrated circuit device for converting an incident optical signal into an electrical signal comprises a semiconductor substrate, a well region formed inside the semiconductor substrate, a dielectric layer formed over the well region, and a layer of polysilicon for receiving the incident optical signal, formed over the dielectric layer, including a p-type portion, an n-type portion and an undoped portion disposed between the p-type and n-type portions, wherein the well region is biased to control the layer of polysilicon for providing the electrical signal.

    摘要翻译: 用于将入射光信号转换成电信号的集成电路装置包括半导体衬底,形成在半导体衬底内部的阱区,形成在阱区上的电介质层和用于接收入射光信号的多晶硅层,形成 包括p型部分,n型部分和设置在p型和n型部分之间的未掺杂部分,其中阱区被偏置以控制多晶硅层以提供电信号 。

    Charged device model electrostatic discharge protection for integrated circuits
    16.
    发明授权
    Charged device model electrostatic discharge protection for integrated circuits 有权
    集成电路充电装置型静电放电保护

    公开(公告)号:US06437407B1

    公开(公告)日:2002-08-20

    申请号:US09706807

    申请日:2000-11-07

    IPC分类号: H01L2362

    CPC分类号: H01L27/0251

    摘要: A charged-device model (CDM) electrostatic discharge (ESD) protection for complementary metal oxide semiconductor (CMOS) integrated circuits such as input/output (I/O) circuits. A CDM ESD clamp device is disposed on an output buffer or an input stage of the CMOS circuit in order to clamp the CDM ESD overstress voltage across the gate oxide during a CDM ESD event. When applied to I/O circuits, a bi-directional diode string with multiple diodes is used in conjunction with the CDM ESD clamp device. During the CDM ESD event, CDM charges (CDM Q) originally stored in the common substrate are discharged through the desired CDM ESD clamp device so as to protect all functional devices in the input, output or I/O circuits, and effectively improve the CDM ESD level in integrated circuit (IC) products.

    摘要翻译: 用于互补金属氧化物半导体(CMOS)集成电路(例如输入/输出(I / O))电路的充电器件型号(CDM)静电放电(ESD)保护。 CDM ESD钳位器件设置在CMOS电路的输出缓冲器或输入级上,以便在CDM ESD事件期间钳位栅极氧化物上的CDM ESD过应力电压。 当应用于I / O电路时,具有多个二极管的双向二极管串与CDM ESD钳位装置结合使用。 在CDM ESD事件期间,原始存储在公共基板中的CDM充电(CDM Q)通过所需的CDM ESD钳位装置放电,以保护输入,输出或I / O电路中的所有功能器件,并有效改善CDM 集成电路(IC)产品中的ESD电平。

    POLYDIODE STRUCTURE FOR PHOTO DIODE
    18.
    发明申请
    POLYDIODE STRUCTURE FOR PHOTO DIODE 有权
    光电二极管的聚合物结构

    公开(公告)号:US20110294253A1

    公开(公告)日:2011-12-01

    申请号:US13205017

    申请日:2011-08-08

    IPC分类号: H01L31/18

    摘要: An integrated circuit device for converting an incident optical signal into an electrical signal comprises a semiconductor substrate, a well region formed inside the semiconductor substrate, a dielectric layer formed over the well region, and a layer of polysilicon for receiving the incident optical signal, formed over the dielectric layer, including a p-type portion, an n-type portion and an undoped portion disposed between the p-type and n-type portions, wherein the well region is biased to control the layer of polysilicon for providing the electrical signal.

    摘要翻译: 用于将入射光信号转换成电信号的集成电路装置包括半导体衬底,形成在半导体衬底内部的阱区,形成在阱区上的电介质层和用于接收入射光信号的多晶硅层,形成 包括p型部分,n型部分和设置在p型和n型部分之间的未掺杂部分,其中阱区被偏置以控制多晶硅层以提供电信号 。

    Lateral diffused metal oxide semiconductor device
    19.
    发明授权
    Lateral diffused metal oxide semiconductor device 失效
    横向扩散金属氧化物半导体器件

    公开(公告)号:US07915674B2

    公开(公告)日:2011-03-29

    申请号:US12133388

    申请日:2008-06-05

    IPC分类号: H01L29/66

    摘要: An exemplary lateral diffused metal oxide semiconductor device includes a first-type substrate, a gate oxide film disposed on the first-type substrate, a poly gate disposed on the gate oxide film, a first second-type slightly doped region formed in the first-type substrate and acting as a well, a first first-type highly doped region formed in the well and acting as a body, a first second-type highly doped region formed in the body and acting as a source, a second second-type highly doped region formed in the well and acting as a drain, a second first-type highly doped region formed in the body, and a first first-type doped region formed in the body and is beneath the source.

    摘要翻译: 示例性的横向扩散金属氧化物半导体器件包括第一类型衬底,设置在第一类型衬底上的栅极氧化膜,设置在栅极氧化物膜上的多晶硅栅极,形成在第一衬底中的第一第二类型轻掺杂区域, 形成在阱中并用作体的第一第一第一高掺杂区域,形成在体内并作为源的第一第二第二类型高掺杂区域,第二第二高度掺杂区域 掺杂区域形成在阱中并用作漏极,形成在体内的第二第一第一高掺杂区域和形成在体内并位于源极之下的第一第一掺杂区域。