公开(公告)号：US11762159B2

公开(公告)日：2023-09-19

申请号：US17302854

申请日：2021-05-13

Applicant: Cisco Technology, Inc.

Inventor： Prakash B. Gothoskar ,  Vipulkumar K. Patel ,  Soha Namnabat ,  Ravi S. Tummidi

IPC: G02B6/12 ,  G02B6/30 ,  G02B6/42 ,  H01L31/0232 ,  H01L31/0352 ,  H01L31/105 ,  G02B6/122

CPC classification number: G02B6/4298 ,  G02B6/12004 ,  G02B6/305 ,  G02B6/4203 ,  H01L31/02327 ,  H01L31/03529 ,  H01L31/1055 ,  G02B6/1228 ,  G02B2006/12123

Abstract: Embodiments described herein include an apparatus comprising a semiconductor-based photodiode disposed on a semiconductor layer, and an optical waveguide spaced apart from the semiconductor layer and evanescently coupled with a depletion region of the photodiode. The photodiode may be arranged as a vertical photodiode or a lateral photodiode.

公开(公告)号：US11693200B2

公开(公告)日：2023-07-04

申请号：US17305986

申请日：2021-07-19

Applicant: Cisco Technology, Inc.

Inventor： Vipulkumar K. Patel ,  Ravi S. Tummidi ,  Mark A. Webster

IPC: G02B6/43 ,  G02B6/42

CPC classification number: G02B6/43 ,  G02B6/425 ,  G02B6/4236 ,  G02B6/4274 ,  G02B6/4204

Abstract: Embodiments herein describe using a double wafer bonding process to form a photonic device. In one embodiment, during the bonding process, an optical element (e.g., a high precision optical element) is optically coupled to an optical device in an active surface layer. In one example, the optical element comprises a nitride layer which can be patterned to form a nitride waveguide, passive optical multiplexer or demultiplexer, or an optical coupler.

公开(公告)号：US11675130B2

公开(公告)日：2023-06-13

申请号：US17447145

申请日：2021-09-08

Applicant: Cisco Technology, Inc.

Inventor： Norbert Schlepple ,  Vipulkumar K. Patel

IPC: G02B6/255 ,  G02B6/12

CPC classification number: G02B6/2555 ,  G02B6/12 ,  G02B6/2551 ,  G02B6/2553 ,  G02B2006/12138 ,  G02B2006/12192

Abstract: Techniques for aligning each of a plurality of optical fibers for coupling to a photonic integrated circuit (PIC). Transmission is detected from each respective optical fiber to the PIC using a probe, and the respective optical fiber is aligned based on the detected transmission. Each of the plurality of optical fibers is coupled to the PIC using at least one of: (i) laser splicing, (ii) laser spot welding, or (iii) arc welding.

公开(公告)号：US11513375B2

公开(公告)日：2022-11-29

申请号：US16716139

申请日：2019-12-16

Applicant: Cisco Technology, Inc.

Inventor： Ming Gai Stanley Lo ,  Vipulkumar K. Patel ,  Mark A. Webster ,  Prakash B. Gothoskar

IPC: G02F1/01 ,  G02F1/025 ,  G02F1/225 ,  G02B6/12

Abstract: A thermo-optic phase shifter comprises an optical waveguide comprising a P-type region comprising a first contact, an N-type region comprising a second contact, and a waveguide region disposed between the P-type region and the N-type region and having a raised portion. The thermo-optic phase shifter further comprises one or more heating elements. The one or more heating elements include one or more discrete resistive heating elements or the P-type and N-type regions driven as resistive heating elements.

公开(公告)号：US11067765B2

公开(公告)日：2021-07-20

申请号：US16698458

申请日：2019-11-27

Applicant: Cisco Technology, Inc.

Inventor： Prakash B. Gothoskar ,  Vipulkumar K. Patel ,  Soha Namnabat ,  Ravi S. Tummidi

IPC: G02B6/122 ,  G02B6/30 ,  G02B6/42

Abstract: Embodiments described herein include an apparatus comprising a semiconductor-based photodiode disposed on a semiconductor layer, and an optical waveguide spaced apart from the semiconductor layer and evanescently coupled with a depletion region of the photodiode. The photodiode may be arranged as a vertical photodiode or a lateral photodiode.

公开(公告)号：US11762155B2

公开(公告)日：2023-09-19

申请号：US17445914

申请日：2021-08-25

Applicant: Cisco Technology, Inc.

Inventor： Vipulkumar K. Patel ,  Matthew J. Traverso ,  Sandeep Razdan ,  Aparna R. Prasad

IPC: G02B6/42

CPC classification number: G02B6/423 ,  G02B6/4202

Abstract: Embodiments herein describe an optical system that includes a photonic integrated circuit (PIC) bonded to a package containing an electrical integrated circuit (EIC). However, this bond can prevent an edge coupler from optically aligning an optical fiber to an edge of the PIC in order to transfer optical signals. To provide room for the edge coupler, the PIC is arranged to overhang the package containing the EIC so that the package does not interfere with the ability of the edge coupler to align with the side or edge of the PIC. In this manner, an optical fiber can be optically aligned (e.g., butt coupled) to the edge of the PIC rather than having to use a grating coupler or some other less efficient optical coupling in order to transfer optical signals between the PIC and the optical fiber.

公开(公告)号：US11619838B2

公开(公告)日：2023-04-04

申请号：US17302632

申请日：2021-05-07

Applicant: Cisco Technology, Inc.

Inventor： Xunyuan Zhang ,  Vipulkumar K. Patel ,  Prakash B. Gothoskar ,  Ming Gai Stanley Lo

IPC: G02F1/025

Abstract: Embodiments provide for an optical modulator, comprising: a lower guide, comprising: a lower hub, made of monocrystalline silicon; and a lower ridge, made of monocrystalline silicon that extends in a first direction from the lower hub; an upper guide, including: an upper hub; and an upper ridge, made of monocrystalline silicon that extends in a second direction, opposite of the first direction, from the upper hub and is aligned with the lower ridge; and a gate oxide layer separating the lower ridge from the upper ridge and defining a waveguide region with the lower guide and the upper guide.

公开(公告)号：US11462885B2

公开(公告)日：2022-10-04

申请号：US16366756

申请日：2019-03-27

Applicant: Cisco Technology, Inc.

Inventor： Dominic F. Siriani ,  Vipulkumar K. Patel

IPC: H01S5/10 ,  H01S5/026 ,  H03F3/20

Abstract: A master oscillator power amplifier comprises a semiconductor laser formed on a substrate and configured to output an optical signal, and a semiconductor optical amplifier (SOA) formed on the substrate. The SOA comprises an optical waveguide having an optically active region, wherein the optical waveguide is configured to expand a mode size of the optical signal along at least two dimensions.

公开(公告)号：US11181689B2

公开(公告)日：2021-11-23

申请号：US16579330

申请日：2019-09-23

Applicant: Cisco Technology, Inc.

Inventor： Sandeep Razdan ,  Vipulkumar K. Patel ,  Aparna R. Prasad

IPC: G02B6/12 ,  G02B6/13 ,  B23K35/26 ,  H01L23/00

Abstract: Photonic devices include a photonic assembly and a substrate coupled to the photonic assembly. The photonic assembly includes a photonic die and an optical device coupled to the photonic die with an adhesive to form an optical connection between the optical device and the photonic die. The photonic assembly is coupled to the photonic assembly by reflowing a plurality of solder connections at temperature that is less than a cure temperature of the adhesive.

公开(公告)号：US11042050B1

公开(公告)日：2021-06-22

申请号：US16708248

申请日：2019-12-09

Applicant: Cisco Technology, Inc.

Inventor： Yi Ho Lee ,  Ming Gai Stanley Lo ,  Vipulkumar K. Patel ,  Prakash B. Gothoskar

IPC: G02B6/10 ,  G02F1/025 ,  G02B6/27 ,  G02F1/015

Abstract: Embodiments herein describe reverse biasing one or more PIN junctions formed in at least one layer of a PSR. The resulting electric fields in the PIN junctions overlap with the optical path of the optical signal and sweep away photo-generated hole-electron free carriers away. That is, the electric fields in the PIN junctions remove the free carriers from the path of the optical signal and reduces the population of the free carriers, thereby mitigating the negative impact of free-carrier absorption (FCA).