APPARATUS AND METHOD FOR CONTROLLING SUBSTRATE THICKNESS

    公开(公告)号:US20210053858A1

    公开(公告)日:2021-02-25

    申请号:US16977975

    申请日:2019-03-05

    Abstract: A control apparatus for controlling a thickness of a substrate, such as a glass ribbon. The control apparatus comprises a laser assembly and a shielding assembly. The laser assembly generates an elongated laser beam traveling in a propagation direction along an optical path. The shielding assembly comprises at least one shield selectively disposed in the optical path. The shield is configured to decrease an optical intensity of a region of the elongated laser beam. The shielding assembly is configured to change an intensity profile of the elongated laser beam from an initial intensity profile to a targeted intensity profile. A desired targeted intensity profile can be dictated by an arrangement of the shield(s) relative to the optical path, and can be selected to affect a temperature change at portions of the substrate determined to benefit from a reduction in thickness.

    Method and apparatus for yielding high edge strength in cutting of flexible thin glass

    公开(公告)号:US10144668B2

    公开(公告)日:2018-12-04

    申请号:US15504947

    申请日:2015-08-13

    Abstract: Methods and apparatus for cutting a glass sheet along a cutting line into a desired shape. A laser source is configured to apply a laser beam to a beam location on the cutting line of the glass sheet. A source of cooling fluid is configured to apply a cooling fluid to a cooling band on the glass sheet to reduce a temperature of the glass sheet along the cooling path while elevating the temperature of the glass sheet at the beam location with the laser beam. The source of cooling fluid is configured to apply the cooling path as a cooling ring to circumscribe the beam location on the cutting line with the cooling band circumferentially spaced from the beam location while the cooling path and the beam location move simultaneously together in order to propagate a fracture in the glass sheet along the cutting line.

    Apparatus and method for controlling substrate thickness

    公开(公告)号:US12151962B2

    公开(公告)日:2024-11-26

    申请号:US16977975

    申请日:2019-03-05

    Abstract: A control apparatus for controlling a thickness of a substrate, such as a glass ribbon. The control apparatus comprises a laser assembly and a shielding assembly. The laser assembly generates an elongated laser beam traveling in a propagation direction along an optical path. The shielding assembly comprises at least one shield selectively disposed in the optical path. The shield is configured to decrease an optical intensity of a region of the elongated laser beam. The shielding assembly is configured to change an intensity profile of the elongated laser beam from an initial intensity profile to a targeted intensity profile. A desired targeted intensity profile can be dictated by an arrangement of the shield(s) relative to the optical path, and can be selected to affect a temperature change at portions of the substrate determined to benefit from a reduction in thickness.

    Optical fibers and optical systems comprising the same

    公开(公告)号:US10345604B2

    公开(公告)日:2019-07-09

    申请号:US15874363

    申请日:2018-01-18

    Abstract: An optical fiber for converting a Gaussian laser beam into a Bessel laser beam may include a first segment optically coupled to a second segment with a transition region, the first segment having a first outer diameter greater than a second outer diameter of the second segment. The first segment may include a first core portion with a first cladding portion extending around the first core portion. The first core portion may have an annular core region with a relative refractive index relative to the first cladding portion. The second segment may include a second core portion with a second cladding portion extending around the second core portion. The second core portion has a relative refractive index relative to the second cladding portion and the relative refractive index of the first annular core region may be substantially equal to the relative refractive index of the second core portion.

    APPARATUS AND METHODS FOR LASER PROCESSING TRANSPARENT WORKPIECES USING PHASE SHIFTED FOCAL LINES

    公开(公告)号:US20180221988A1

    公开(公告)日:2018-08-09

    申请号:US15874004

    申请日:2018-01-18

    Abstract: A method for laser processing a transparent workpiece includes forming a contour line having defects in the transparent workpiece, which includes directing a pulsed laser beam oriented along a beam pathway through a beam converting element and through a phase modifying optical element such that the portion of the pulsed laser beam directed into the transparent workpiece includes a phase shifted focal line having a cross-sectional phase contour that includes phase contour ridges induced by the phase modifying optical element and extending along phase ridge lines. Moreover, the phase shifted focal line generates an induced absorption within the transparent workpiece to produce a defect within the transparent workpiece including a central defect region and a radial arm that extends outward from the central defect region in a radial defect direction oriented within 20° of the phase ridge lines of the phase shifted focal line.

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