公开(公告)号：US20220406678A1

公开(公告)日：2022-12-22

申请号：US17777549

申请日：2020-11-12

Applicant: Denka Company Limited

Inventor： Atsushi SAKAI ,  Masaya YUMIBA ,  Kentaro NAKAYAMA ,  Yoshitaka TANIGUCHI

IPC: H01L23/373 ,  H01L21/48 ,  C23C4/073 ,  C23C4/08 ,  C23C4/18 ,  C23C28/00

Abstract: A composite substrate includes, in this order: a ceramic plate; a metal layer containing at least one selected from the group consisting of aluminum and an aluminum alloy; and a thermal sprayed layer containing at least one selected from the group consisting of copper and a copper alloy, and an intermetallic compound containing copper and aluminum as constituent elements is scattered between the metal layer and the thermal sprayed layer.

公开(公告)号：US20220154060A1

公开(公告)日：2022-05-19

申请号：US17588757

申请日：2022-01-31

Applicant: DENKA COMPANY LIMITED

Inventor： Go TAKEDA ,  Yoshitaka TANIGUCHI

IPC: C09K5/14 ,  C01B21/064 ,  C08K3/38 ,  C08K9/02 ,  C08K9/04 ,  C09C3/00 ,  C09C3/04 ,  C09C3/06 ,  C09C3/08

Abstract: A surface-treated aggregated boron nitride powder is prepared by using the boron nitride powder as the raw material, adding an oxidizer to the boron nitride aggregated grains, wet-pulverizing or wet-crushing the grains for surface modification treatment of the particles and allowing reaction of the particles with a metal coupling agent. The surface-treated boron nitride aggregated grains are formed by aggregation of hexagonal h-BN primary particles; (B) have any one or more of Si, Ti, Zr, Ce, Al, Mg, Ge, Ga, and V in an amount of 0.1 atm % or more and 3.0 atm % or less in its composition on the surface of 10 nm; (C) have a crushing strength of 5 MPa or more; and (D) have an average particle diameter of 20 μm or more and 100 μm or less.

公开(公告)号：US20170107158A1

公开(公告)日：2017-04-20

申请号：US15127214

申请日：2015-03-18

Applicant: DENKA COMPANY LIMITED

Inventor： Daisuke GOTO ,  Hideki HIROTSURU ,  Yoshitaka TANIGUCHI ,  Goh IWAMOTO ,  Kazunori KOYANAGI

IPC: C04B35/80 ,  H01L21/48 ,  C04B41/00 ,  H01L23/373 ,  C04B41/88 ,  C04B41/51

CPC classification number: C04B35/806 ,  C04B41/009 ,  C04B41/5155 ,  C04B41/88 ,  C04B2111/00844 ,  C04B2235/3826 ,  C04B2235/402 ,  C04B2235/5264 ,  H01L21/4871 ,  H01L23/3733 ,  H01L2924/0002 ,  C04B35/565 ,  C04B38/00 ,  C04B41/4523 ,  H01L2924/00

Abstract: To provide an aluminum-silicon carbide composite which is suitable for use as a power-module base plate. An aluminum-silicon carbide composite wherein a peripheral portion having, as a main component thereof, an aluminum-ceramic fiber composite containing ceramic fibers having an average fiber diameter of at most 20 μm and an average aspect ratio of at least 100, is provided on the periphery of a flat plate-shaped aluminum-silicon carbide composite having a plate thickness of 2 to 6 mm formed by impregnating, with a metal containing aluminum, a porous silicon carbide molded body having a silicon carbide content of 50 to 80 vol %, and wherein the proportion of the aluminum-ceramic fiber composite occupied in the peripheral portion is at least 50 area %.