公开(公告)号：US11888376B2

公开(公告)日：2024-01-30

申请号：US17154697

申请日：2021-01-21

Applicant: DENSO CORPORATION

Inventor： Ryota Tanabe ,  Yuta Hashimoto ,  Tomohisa Sano ,  Tomoyuki Shinkai

IPC: H02K5/20 ,  H02K11/33 ,  H02K5/22

CPC classification number: H02K5/203 ,  H02K5/20 ,  H02K5/225 ,  H02K11/33

Abstract: A rotary electric machine unit including a rotary electric machine, and an electric power conversion device having a plurality of power modules. The rotary electric machine includes a stator, a rotor, and a housing. The housing includes a housing flow path through which a refrigerant flows. The power modules of the electric power conversion device and the rotary electric machine are configured to be cooled by the refrigerant.

公开(公告)号：US11509234B2

公开(公告)日：2022-11-22

申请号：US16782158

申请日：2020-02-05

Applicant: DENSO CORPORATION

Inventor： Tetsuya Matsuoka ,  Ryota Tanabe ,  Yuu Yamahira ,  Kazuma Fukushima ,  Kosuke Kamiya

IPC: H02M7/00 ,  H01L23/473 ,  H01L25/18 ,  H02M7/5387 ,  H01L23/367 ,  H01L23/31 ,  H02P27/06

Abstract: A power conversion apparatus has a positive electrode bus bar and a negative electrode bus bar. The power conversion apparatus has a first semiconductor module incorporating an upper-arm switching element and including a positive electrode terminal and a second semiconductor module incorporating a lower-arm switching element and including a negative electrode terminal. The first semiconductor module and the second semiconductor module are placed such that the positive electrode terminal and the negative electrode terminal face each other in a direction orthogonal to a protruding direction. The positive electrode bus bar and the negative electrode bus bar respectively have coexisting parts placed together between the positive electrode terminal and the negative electrode terminal as seen in the protruding direction of power terminals. The coexisting parts are at least partially placed in a space between the positive electrode terminal and the negative electrode terminal.

公开(公告)号：US11496017B2

公开(公告)日：2022-11-08

申请号：US16708570

申请日：2019-12-10

Applicant: DENSO CORPORATION

Inventor： Naoki Hirasawa ,  Ryota Tanabe ,  Yuta Hashimoto

IPC: H02K3/50 ,  H02K7/08 ,  H02K21/22 ,  H02K15/00 ,  H02K11/33

Abstract: A rotating electric machine includes a field that includes a magnet unit having a plurality of magnetic poles, an armature including a multi-phase armature coil, and an electric power conversion device that is configured to perform electric power conversion and supply electric power resulting from the electric power conversion to the armature. Moreover, one of the field and the armature is configured as a rotor while the other is configured as a stator. The electric power conversion device includes at least one band-shaped busbar through which electric current flows during the electric power conversion. The at least one busbar has a cross section where a thickness in a lateral direction of the cross section at one end of the cross section in a longitudinal direction of the cross section is smaller than a thickness in the lateral direction at the other end of the cross section in the longitudinal direction.

公开(公告)号：US10554145B2

公开(公告)日：2020-02-04

申请号：US15990954

申请日：2018-05-29

Applicant: DENSO CORPORATION

Inventor： Naoki Hirasawa ,  Ryota Tanabe ,  Taijiro Momose

IPC: H02M7/00 ,  H02M7/537 ,  H02M3/158 ,  H02B1/20 ,  H01G4/228 ,  H01G4/38 ,  H02G5/00 ,  H01G4/40 ,  H01L23/64 ,  H01L29/739

Abstract: An electrical power conversion apparatus includes a high-voltage bus bar, a low-voltage bus bar, and a relay bus bar which are integrated together in the form of a bus bar assembly. The high-voltage bus bar includes semiconductor-side high-voltage terminals and capacitor-side high-voltage terminals. The low-voltage bus bar includes semiconductor-side low-voltage terminals and capacitor-side low-voltage terminals. The relay bus bar includes a reactor-side relay terminal and a capacitor-side relay terminal 532. The capacitor-side high-voltage terminals, the capacitor-side low-voltage terminals, and the capacitor-side relay terminal are arranged in the form of a terminal array. The capacitor-side high-voltage terminals and the capacitor-side low-voltage terminals are arranged adjacent each other. The capacitor-side relay terminal is located at an end of an array of the capacitor-side high-voltage terminals and the capacitor-side low-voltage terminals. With these arrangements, the electrical power conversion apparatus is capable of reducing the inductance and facilitating the assembling and downsizing thereof.

公开(公告)号：US10522957B2

公开(公告)日：2019-12-31

申请号：US16039587

申请日：2018-07-19

Applicant: DENSO CORPORATION

Inventor： Ryota Tanabe ,  Akihumi Kurita ,  Yohei Yoshimura

IPC: H05K7/00 ,  H01R25/16 ,  H01L23/50 ,  H02M7/00

Abstract: In a power converter, a semiconductor module incorporates therein a semiconductor element that constitutes a power converter circuit. The semiconductor module has a power terminal extending therefrom, and the power terminal has opposing first and second terminal surfaces. The power converter includes a capacitor electrically connected to the semiconductor module. The power converter includes a busbar. The busbar includes a capacitor-connection terminal connected to the capacitor, and at least first and second semiconductor-connection terminals that are at least partly joined to the respective first and second terminal surfaces of the power terminal.

公开(公告)号：US10070564B2

公开(公告)日：2018-09-04

申请号：US15353337

申请日：2016-11-16

Applicant: DENSO CORPORATION

Inventor： Kazuya Takeuchi ,  Tetsuya Matsuoka ,  Ryota Tanabe

IPC: H05K7/20 ,  H02M7/00 ,  H02M7/537 ,  H05K5/02 ,  H05K5/04

Abstract: An electric power converter performing power conversion includes a plurality of semiconductor modules with built-in semiconductor elements, a plurality of cooling tubes stacked together with the plurality of semiconductor modules, and a pressure member made of metal. The pressure member has a pressing surface for pressing an outer cooling tube in order to press-contact the plurality of cooling tubes and the plurality of semiconductor modules in a stacking direction, and a heat receiving surface that receives heat generated from a capacitor that is an electronic component which is different from the plurality of semiconductor modules, by thermal conduction.

公开(公告)号：US11942869B2

公开(公告)日：2024-03-26

申请号：US17155174

申请日：2021-01-22

Applicant: DENSO CORPORATION

Inventor： Tomohisa Sano ,  Ryota Tanabe ,  Yuta Hashimoto ,  Kazuma Fukushima ,  Mamoru Kuwahara

IPC: H02M7/00 ,  H01L25/18 ,  H02M7/537

CPC classification number: H02M7/003 ,  H01L25/18 ,  H02M7/537

Abstract: A power module is applied to an electric power conversion device in which multiple upper-lower arm circuits are connected to an electric power line in parallel. The power module includes the multiple upper-lower arm circuits; a capacitor connected to each of the multiple upper-lower arm circuits in parallel; an upper wiring that connects an upper arm and a positive electrode terminal of the capacitor; a lower wiring that connects a lower arm and a negative electrode of the capacitor; an upper electric power wiring that is an electric power wiring connected to the electric power line and connects a high potential line of the electric power line and the upper wiring; and a lower electric power wiring that is an electric power wiring connected to the electric power line and connects a lower potential line of the electric power line and the lower wiring.

公开(公告)号：US11682516B2

公开(公告)日：2023-06-20

申请号：US16784514

申请日：2020-02-07

Applicant: DENSO CORPORATION

Inventor： Ryota Tanabe ,  Tatsuya Murakami ,  Hiroshi Shimizu ,  Naoki Hirasawa

IPC: H01F27/10 ,  H01F27/255 ,  H01F37/00 ,  H02M7/48

CPC classification number: H01F27/10 ,  H01F27/255 ,  H01F37/00 ,  H02M7/48

Abstract: A reactor cooling structure includes: a plurality of reactors that are stacked on one another, each reactor including a coil configured to produce magnetic flux when energized; and a cooling mechanism that cools the plurality of reactors, wherein each of the reactors has an exterior member that has: heat radiation surfaces respectively on both sides of the corresponding one of the reactors in a stacking direction of the stacked reactors i.e. a first direction, the heat radiation surfaces of the exterior member of each of the reactors being arranged to cool the coil of the corresponding one of the reactors; the cooling mechanism includes a cooling flow path for directly cooling the first and second heat radiation surfaces of the exterior member of each of the reactors by a refrigerant.

公开(公告)号：US11653481B2

公开(公告)日：2023-05-16

申请号：US17155729

申请日：2021-01-22

Applicant: DENSO CORPORATION

Inventor： Tomohisa Sano ,  Ryota Tanabe ,  Yuta Hashimoto ,  Wataru Funatsu

IPC: H05K7/20 ,  H02M7/00 ,  H02P27/06

CPC classification number: H05K7/20927 ,  H02M7/003 ,  H02P27/06

Abstract: An electric power conversion device includes: a cooler that includes a flow path through which a refrigerant flows, a first surface, and a second surface opposite to the first surface in a thickness direction; and multiple power modules that include a semiconductor device configuring an upper-lower arm circuit, and a capacitor connected to the upper-lower arm circuit in parallel. The capacitor and the semiconductor device are arranged in the thickness direction. The multiple power modules are placed on both of the first surface and the second surface of the cooler.

公开(公告)号：US11456238B2

公开(公告)日：2022-09-27

申请号：US17155696

申请日：2021-01-22

Applicant: DENSO CORPORATION

Inventor： Kosuke Kamiya ,  Ryota Tanabe ,  Tomohisa Sano ,  Takuo Nagase ,  Hiroshi Ishino ,  Shoichiro Omae

IPC: H01L23/495 ,  H01L23/48 ,  H01L23/34 ,  H01L21/00 ,  H05K5/02 ,  H01L23/31 ,  H01L23/00 ,  H01L25/07 ,  H01L25/18 ,  H01L21/48 ,  H01L25/065

Abstract: A semiconductor device configures one arm of an upper-lower arm circuit, and includes: a semiconductor element that includes a first main electrode and a second main electrode, wherein a main current between the first main electrode and the second main electrode; and multiple main terminals that include a first main terminal connected to the first main electrode and a second main terminal connected to the second main electrode. The first main terminal and the second main terminal are placed adjacent to each other; A lateral surface of the first main terminal and a lateral surface of the second main terminal face each other in one direction orthogonal to a thickness direction of the semiconductor element.