ELECTRONIC CIRCUIT BOARD, ASSEMBLY AND A RELATED METHOD THEREOF
    11.
    发明申请
    ELECTRONIC CIRCUIT BOARD, ASSEMBLY AND A RELATED METHOD THEREOF 有权
    电子电路板,组件及其相关方法

    公开(公告)号:US20140036463A1

    公开(公告)日:2014-02-06

    申请号:US13563132

    申请日:2012-07-31

    CPC classification number: H05K3/282 H01L2224/16225 H05K2203/1194

    Abstract: An apparatus includes a substrate and a plurality of conductive traces formed on the substrate. The conductive traces are doped with a concentration of an aluminum material forming a protective layer as a portion of the plurality of conductive traces to inhibit oxidation. A set of first metal contact pads are formed in contact with the plurality of conductive traces. The substrate, the plurality of conductive traces and the set of first metal contact pads define an electronic circuit board configured to operate at a temperature greater than 200 degrees Celsius. A high operating temperature electronic device is configured in electrical communication with the conductive traces defining an assembly configured to operate at a temperature greater than 200 degrees Celsius.

    Abstract translation: 一种装置包括基板和形成在基板上的多个导电迹线。 导电迹线掺杂有形成保护层的铝材料的浓度作为多个导电迹线的一部分以抑制氧化。 形成与多个导电迹线接触的一组第一金属接触焊盘。 衬底,多个导电迹线和第一金属接触焊盘组限定了配置成在大于200摄氏度的温度下操作的电子电路板。 高工作温度电子器件被配置为与导电迹线电连通,导电迹线限定被配置为在大于200摄氏度的温度下操作的组件。

    High temperature optical pressure sensor and method of fabrication of the same
    15.
    发明授权
    High temperature optical pressure sensor and method of fabrication of the same 有权
    高温光学压力传感器及其制造方法

    公开(公告)号:US07966887B2

    公开(公告)日:2011-06-28

    申请号:US12411878

    申请日:2009-03-26

    CPC classification number: G01L9/0079 G01L9/0007

    Abstract: A high-temperature pressure sensor is provided. The sensor includes a quartz substrate with a cavity etched on one side. A reflective coating is deposited on at least a portion of the cavity. The sensor further includes a ferrule section coupled to the quartz substrate with the cavity therebetween. The cavity exists in a vacuum, and cavity gap is formed between the reflective metal coating and a surface of the ferrule. The sensor also includes an optical fiber enclosed by the ferrule section and extending from the cavity gap to an opposing end of the ferrule section and a metal casing surrounding the ferrule section and the quartz substrate with an opening for said optical fiber extending therefrom. The pressure applied to the quartz substrate changes the dimensions of the cavity gap and a reflected signal from the reflective coating is processed as a pressure.

    Abstract translation: 提供高温压力传感器。 该传感器包括具有在一侧蚀刻的腔的石英衬底。 反射涂层沉积在空腔的至少一部分上。 传感器还包括耦合到石英基板的套圈部分,其间具有空腔。 空腔存在于真空中,并且在反射金属涂层和套圈的表面之间形成腔间隙。 传感器还包括由套圈部分包围并从套圈部分的相对端延伸的光纤,以及围绕套圈部分和石英衬底的金属壳体,所述金属壳体具有从其延伸的所述光纤的开口。 施加到石英衬底的压力改变了空腔间隙的尺寸,并且将来自反射涂层的反射信号作为压力进行处理。

    PHOTONIC POWER DEVICES AND METHODS OF MANUFACTURING THE SAME
    17.
    发明申请
    PHOTONIC POWER DEVICES AND METHODS OF MANUFACTURING THE SAME 有权
    光电装置及其制造方法

    公开(公告)号:US20090245735A1

    公开(公告)日:2009-10-01

    申请号:US12060430

    申请日:2008-04-01

    CPC classification number: C07D487/04

    Abstract: A high temperature optoelectronic device package includes a substrate, an optoelectronic die situated on an upper surface of the substrate, a seal surrounding the optoelectronic die and situated on the upper surface of the substrate and a housing disposed on the seal having a ferrule-seating portion. The housing is disposed on the seal such that a fiber optic center of the ferrule-seating portion is aligned with an active portion of the optoelectronic die. The optoelectronic die is in operative communication with electronic traces of the substrate.

    Abstract translation: 高温光电子器件封装包括衬底,位于衬底的上表面上的光电裸片,围绕光电管芯并且位于衬底的上表面上的密封件,以及设置在密封件上的壳体,其具有套圈座部分 。 壳体设置在密封件上,使得套圈座部分的光纤中心与光电管芯的有效部分对齐。 光电管芯与基板的电子迹线工作连通。

    System for detecting faults in electrical wiring, and manufacturing method thereof
    18.
    发明授权
    System for detecting faults in electrical wiring, and manufacturing method thereof 有权
    电线故障检测系统及其制造方法

    公开(公告)号:US08816698B2

    公开(公告)日:2014-08-26

    申请号:US12914066

    申请日:2010-10-28

    CPC classification number: G01R31/1272 G01R15/186 G01R31/008

    Abstract: A diagnostic system for detecting faults in electrical wiring, and manufacturing method thereof is provided. The diagnostic system includes a diagnostic sensor coupled to a data acquisition system. The diagnostic sensor includes a sensor housing with a flexible coil sensor disposed inside. The sensor housing includes a base portion, lid portion, and a joining portion, wherein one end of the lid portion is detachably coupled to a first end of the base portion and another end of the lid portion is coupled to a second end of the base portion via the joining portion. The diagnostic sensor further includes a connector coupled to the flexible coil sensor.

    Abstract translation: 提供一种用于检测电线中故障的诊断系统及其制造方法。 诊断系统包括耦合到数据采集系统的诊断传感器。 诊断传感器包括传感器壳体,其内部设置有柔性线圈传感器。 传感器壳体包括基部,盖部分和接合部分,其中盖部分的一端可拆卸地联接到基部的第一端,并且盖部分的另一端连接到基座的第二端 部分。 诊断传感器还包括连接到柔性线圈传感器的连接器。

Patent Agency Ranking