公开(公告)号：US20160059380A1

公开(公告)日：2016-03-03

申请号：US14832767

申请日：2015-08-21

Applicant: EBARA CORPORATION

Inventor： Kuniaki YAMAGUCHI ,  Itsuki KOBATA ,  Toshio MIZUNO ,  Mitsuru MIYAZAKI ,  Naoki TOYOMURA ,  Takuya INOUE

IPC: B24B53/017 ,  B08B3/12 ,  B08B3/10 ,  B08B3/02 ,  H01L21/306 ,  B08B1/00

CPC classification number: B24B53/017 ,  B08B1/04 ,  B08B3/02 ,  B08B2203/0288 ,  H01L21/67046 ,  H01L21/67051

Abstract: An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.

Abstract translation: 本发明的实施例提供了一种buff处理模块。 抛光处理模块包括：抛光台，其上安装有加工对象物体; 保持用于将预定处理应用于处理目标对象的抛光垫的抛光头; 一个支撑和摆动buff头的抛光臂; 用于打磨抛光垫的梳妆台; 以及清洁机构，其布置在抛光台和修整器之间并且用于清洁抛光垫。

公开(公告)号：US20190118338A1

公开(公告)日：2019-04-25

申请号：US16228525

申请日：2018-12-20

Applicant: EBARA CORPORATION

Inventor： Kuniaki YAMAGUCHI ,  Itsuki KOBATA ,  Toshio MIZUNO ,  Mitsuru MIYAZAKI ,  Naoki TOYOMURA ,  Takuya INOUE

IPC: B24B53/017 ,  H01L21/67 ,  B08B3/02 ,  B08B1/04

Abstract: An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.

公开(公告)号：US20160346902A1

公开(公告)日：2016-12-01

申请号：US15167464

申请日：2016-05-27

Applicant: EBARA CORPORATION

Inventor： Naoki TOYOMURA ,  Mitsuru MIYAZAKI ,  Junji KUNISAWA

IPC: B24B57/02 ,  H01L21/306 ,  B24B37/04

CPC classification number: B24B57/02 ,  B24B37/04

Abstract: Provided is a wet substrate processing apparatus for processing a substrate. The apparatus comprises a table for holding a substrate, and a process liquid feeding mechanism for feeding process liquid to the substrate held on the table. The table includes a support face for supporting the substrate, a first opening formed in the support face, a second opening formed in the support face and arranged at least partially around the first opening, a first fluid path configured to extend to the first opening of the support face via the table and be connectable to a vacuum source, and a second fluid path configured to extend to the second opening of the support face via the table and discharge the process liquid.

Abstract translation: 提供了一种用于处理基板的湿式基板处理装置。 该装置包括用于保持基板的工作台和用于将工艺液体供给到保持在工作台上的衬底的工艺液体供给机构。 桌子包括用于支撑基底的支撑面，形成在支撑面上的第一开口，形成在支撑面中并且至少部分地围绕第一开口布置的第二开口，第一流体路径被配置成延伸到第一开口 所述支撑面经由所述工作台并且可连接到真空源，以及第二流体路径，其被配置为经由所述工作台延伸到所述支撑面的所述第二开口并排出所述工艺液体。

公开(公告)号：US20160099156A1

公开(公告)日：2016-04-07

申请号：US14872342

申请日：2015-10-01

Applicant: EBARA CORPORATION

Inventor： Kuniaki YAMAGUCHI ,  Toshio MIZUNO ,  Itsuki KOBATA ,  Mitsuru MIYAZAKI ,  Naoki TOYOMURA ,  Takuya INOUE

IPC: H01L21/306 ,  H01L21/02

CPC classification number: H01L21/67248 ,  B24B37/105 ,  B24B37/345 ,  B24B49/14 ,  B24B53/017 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67109 ,  H01L21/67178 ,  H01L21/67219

Abstract: A polishing apparatus is provided. The polishing apparatus includes: a polishing unit configured to polish a substrate by bringing a polishing tool into contact with the substrate and moving the substrate relatively to the polishing tool; a cleaning unit; and a first transfer robot configured to transfer the substrate before polishing to the polishing unit and/or configured to transfer the substrate after polishing from the polishing unit to the cleaning unit. The cleaning unit includes: at least one cleaning module, a buff processing module configured to perform a buff process to the substrate, and a second transfer robot configured to transfer the substrate between the cleaning module and the buff processing module, the second transfer robot being different from the first robot.

Abstract translation: 提供了一种抛光装置。 抛光装置包括：抛光单元，被配置为通过使抛光工具与基板接触并相对于抛光工具移动基板来抛光基板; 清洁单元; 以及第一传送机器人，其被配置为在抛光之前将所述基板转移到所述抛光单元和/或构造成在从所述抛光单元抛光到所述清洁单元之后将所述基板转移。 所述清洁单元包括：至少一个清洁模块，抛光处理模块，被配置为对所述基板执行抛光处理;以及第二传送机器人，其被配置为在所述清洁模块和所述抛光处理模块之间传送所述基板，所述第二传送机器人 不同于第一台机器人。

公开(公告)号：US20140311532A1

公开(公告)日：2014-10-23

申请号：US14259075

申请日：2014-04-22

Applicant: EBARA CORPORATION

Inventor： Toshio YOKOYAMA ,  Junji KUNISAWA ,  Mitsuru MIYAZAKI ,  Teruaki HOMBO ,  Naoki TOYOMURA

IPC: H01L21/67 ,  H01L21/68 ,  H01L21/677

CPC classification number: H01L21/67046 ,  H01L21/67051 ,  H01L21/68728 ,  H01L21/68764

Abstract: A substrate processing apparatus has a substrate rotating device 10, 20 for holding and rotating a substrate W, a cleaning device 41 configured to clean a substrate W which is rotated by the substrate rotating device 10, 20 at predetermined rotating speed, a movement device 42 configured to move the cleaning device 41 between a cleaning position P3 and a separate position P2, and a control unit 64. The control unit 64 controls the movement device 42 so that the cleaning device 41 located at the separate position P2 starts moving toward the cleaning position P3 before a rotating speed of the substrate W held by the substrate rotating device 10, 20 reaches the predetermined rotating speed and the cleaning device 41 reaches the cleaning position P3 after a rotating speed of the substrate W reaches the predetermined rotating speed. Therefore, it is possible to improve the throughput in the substrate cleaning step.

Abstract translation: 基板处理装置具有用于保持和旋转基板W的基板旋转装置10,20，被构造成以预定转速清洁基板旋转装置10,20旋转的基板W的清洁装置41，移动装置42 被配置为将清洁装置41移动到清洁位置P3和分离位置P2之间，以及控制单元64.控制单元64控制移动装置42，使得位于分离位置P2的清洁装置41开始朝向清洁 在由基板旋转装置10,20保持的基板W的旋转速度之前的位置P3达到预定转速，并且清洁装置41在基板W的转速达到预定转速之后到达清洁位置P3。 因此，可以提高基板清洗工序的生产量。