公开(公告)号：US20190115230A1

公开(公告)日：2019-04-18

申请号：US16088691

申请日：2017-10-23

Applicant: EBARA CORPORATION

Inventor： Naoki TOYOMURA ,  Akira IMAMURA

IPC: H01L21/67 ,  B08B9/027

CPC classification number: H01L21/67075 ,  B08B9/027 ,  G03F7/70725 ,  G03F7/70841 ,  H01L21/304 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67219 ,  H01L21/683

Abstract: A substrate processing apparatus including: a first valve provided between a gas supply source and an air-water separation tank, the first valve opening and closing a flow path of a gas supplied from the gas supply source; a second valve that opens and closes a flow path of liquid discharged from a discharge port of the air-water separation tank; and a control unit that controls the first valve and the second valve, wherein the discharge port of the air-water separation tank communicates with a discharge port of a cleaning chamber that cleans the substrate, and the control unit controls to close the first valve after preset gas supply time elapses from when the first valve is opened and gas can no longer be discharged from the air-water separation tank and controls to close the second valve after the first valve is closed.

公开(公告)号：US20230405762A1

公开(公告)日：2023-12-21

申请号：US18347464

申请日：2023-07-05

Applicant: EBARA CORPORATION

Inventor： Kuniaki YAMAGUCHI ,  Itsuki KOBATA ,  Toshio MIZUNO ,  Mitsuru MIYAZAKI ,  Naoki TOYOMURA ,  Takuya INOUE

IPC: B24B53/017 ,  B08B3/02 ,  B08B1/04 ,  H01L21/67

CPC classification number: B24B53/017 ,  B08B3/02 ,  B08B1/04 ,  H01L21/67046 ,  H01L21/67051 ,  B08B2203/0288

Abstract: An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.

公开(公告)号：US20170252895A1

公开(公告)日：2017-09-07

申请号：US15604328

申请日：2017-05-24

Applicant: EBARA CORPORATION

Inventor： Kuniaki YAMAGUCHI ,  Itsuki KOBATA ,  Toshio MIZUNO ,  Mitsuru MIYAZAKI ,  Naoki TOYOMURA ,  Takuya INOUE

IPC: B24B53/017 ,  H01L21/67 ,  B08B1/04 ,  B08B3/02

CPC classification number: B24B53/017 ,  B08B1/04 ,  B08B3/02 ,  B08B2203/0288 ,  H01L21/67046 ,  H01L21/67051

Abstract: An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.

公开(公告)号：US20170162409A1

公开(公告)日：2017-06-08

申请号：US15372033

申请日：2016-12-07

Applicant: EBARA CORPORATION

Inventor： Naoki TOYOMURA ,  Mitsuru MIYAZAKI ,  Takuya INOUE

IPC: H01L21/67

CPC classification number: H01L21/67219 ,  H01L21/67196 ,  H01L21/6838 ,  H01L21/68742

Abstract: An object of the present invention is to detach a substrate from a table without damaging the substrate by lift pins.One embodiment of the present invention provides a substrate processing apparatus having a vacuum suction table adapted to have a substrate placed thereon, and a plurality of lift pins disposed along the outer periphery of the vacuum suction table. The lift pins each have a distal end portion including a substrate guide surface capable of guiding the outer peripheral end surface of the substrate, and a proximal end portion including a substrate holding surface extending from the substrate guide surface outwardly in a radial direction of the lift pin. The lift pins are stoppable in a lower end position where the substrate guide surface of each of the lift pins is disposed below a suction-holding surface of the vacuum suction table, an upper end position where the substrate holding surface of each of the lift pins is disposed above the suction-holding surface of the vacuum suction table, and an intermediate position between the lower end position and the upper end position. In the intermediate position, the substrate guide surface of each of the lift pins is disposed above the suction-holding surface of the vacuum suction table, and the substrate holding surface of each of the lift pins is disposed below the suction-holding surface of the vacuum suction table.

公开(公告)号：US20240416390A1

公开(公告)日：2024-12-19

申请号：US18740592

申请日：2024-06-12

Applicant: EBARA CORPORATION

Inventor： Naoki TOYOMURA ,  Junji KUNISAWA ,  Mitsuru MIYAZAKI

IPC: B08B3/02 ,  B08B5/00 ,  H01L21/67

Abstract: The present disclosure provides a substrate processing apparatus capable of adjusting a flow rate of a liquid to be ejected from a nozzle. The substrate processing apparatus according to the present disclosure is a substrate processing apparatus including a nozzle configured to supply a liquid to a substrate, and a liquid supplier configured to supply the liquid to the nozzle, in which the liquid supplier includes a supply pipe which is configured to cause a liquid supply source and the nozzle to be in fluid communication and which has a first pipe constituting a first flow channel from a splitting point to a joining point located downstream of the splitting point and a second pipe constituting a second flow channel from the splitting point to the joining point, a first valve attached to the first pipe, a second valve attached to the second pipe, and a fluid resistance element attached to the second pipe and configured to set a pressure loss of the liquid flowing through the second pipe to be larger than a pressure loss of the liquid flowing through the first pipe.

公开(公告)号：US20230352326A1

公开(公告)日：2023-11-02

申请号：US18349666

申请日：2023-07-10

Applicant: EBARA CORPORATION

Inventor： Kuniaki YAMAGUCHI ,  Toshio MIZUNO ,  Itsuki KOBATA ,  Mitsuru MIYAZAKI ,  Naoki TOYOMURA ,  Takuya INOUE

IPC: H01L21/67 ,  B24B37/10 ,  B24B49/14 ,  B24B53/017 ,  B24B37/34 ,  H01L21/304 ,  H01L21/306 ,  H01L21/02

CPC classification number: H01L21/67248 ,  H01L21/67178 ,  H01L21/67109 ,  H01L21/67051 ,  H01L21/67046 ,  H01L21/67028 ,  H01L21/67219 ,  B24B37/105 ,  B24B49/14 ,  B24B53/017 ,  B24B37/345 ,  H01L21/304 ,  H01L21/30625 ,  H01L21/6704 ,  H01L21/02065 ,  H01L21/02052

Abstract: A polishing apparatus is provided. The polishing apparatus includes:



a polishing unit configured to polish a substrate by bringing a polishing tool into contact with the substrate and moving the substrate relatively to the polishing tool; a cleaning unit; and a first transfer robot configured to transfer the substrate before polishing to the polishing unit and/or configured to transfer the substrate after polishing from the polishing unit to the cleaning unit. The cleaning unit includes: at least one cleaning module, a buff processing module configured to perform a buff process to the substrate, and a second transfer robot configured to transfer the substrate between the cleaning module and the buff processing module, the second transfer robot being different from the first robot.

公开(公告)号：US20200049546A1

公开(公告)日：2020-02-13

申请号：US16532493

申请日：2019-08-06

Applicant: EBARA CORPORATION

Inventor： Naoki TOYOMURA ,  Mitsuru MIYAZAKI

IPC: G01F23/292 ,  B24B37/34 ,  B24B37/005 ,  B08B3/04 ,  B08B3/02

Abstract: A sensor target cover capable of preventing an optical liquid level detection sensor from erroneously detecting a rise in a liquid level is provided. A sensor target cover is used in combination with an optical liquid level detection sensor. The sensor target cover includes a reflecting plate, an inner wall structure surrounding the reflecting plate, and an outer wall structure surrounding the inner wall structure. A gap is formed between the inner wall structure and the outer wall structure.

公开(公告)号：US20180345452A1

公开(公告)日：2018-12-06

申请号：US15776733

申请日：2016-10-11

Applicant: EBARA CORPORATION

Inventor： Hideo AIZAWA ,  Junji KUNISAWA ,  Mitsuru MIYAZAKI ,  Naoki TOYOMURA

IPC: B24B41/047

CPC classification number: B24B41/047 ,  H01L21/304

Abstract: In-plane uniformity of buff processing is improved. According to a first form, a buff processing device for executing buff processing of a substrate is provided. Such buff processing device has a rotatable shaft, a buff head body, a torque transmission mechanism for transmitting rotation of the shaft to the buff head body, and an elastic member for elastically supporting the buff head body in a longitudinal direction of the shaft.

公开(公告)号：US20170148660A1

公开(公告)日：2017-05-25

申请号：US15351242

申请日：2016-11-14

Applicant: EBARA CORPORATION

Inventor： Naoki TOYOMURA ,  Mitsuru MIYAZAKI

IPC: H01L21/687 ,  H01L21/67

CPC classification number: H01L21/68742 ,  H01L21/67051 ,  H01L21/68728 ,  H01L21/68792

Abstract: A substrate holding apparatus that can minimize a deflection amount of a substrate due to its own weight and can suppress vibration of the substrate at the time of rotation of the substrate even if a diameter of the substrate becomes large is disclosed. The substrate holding apparatus holds a periphery of a substrate and rotates the substrate. The substrate holding apparatus includes a plurality of support posts supported by a base and vertically movable relative to the base, a plurality of chucks respectively provided on the plurality of support posts and configured to hold the periphery of the substrate, and at least one support pin configured to support a lower surface of the substrate held by the plurality of chucks.

公开(公告)号：US20160141201A1

公开(公告)日：2016-05-19

申请号：US14935893

申请日：2015-11-09

Applicant: Ebara Corporation

Inventor： Naoki TOYOMURA ,  Mitsuru MIYAZAKI ,  Takuya INOUE

IPC: H01L21/687 ,  B25B5/00 ,  B25B5/14

CPC classification number: H01L21/68728

Abstract: There is disclosed an improved substrate holding apparatus which can minimize deformation of a spring, which is provided to bias a support post for supporting a substrate, even when a large centrifugal force acts on the spring. The substrate holding apparatus includes: a support post movable in an axial direction thereof; a chuck provided on the support post and configured to hold a periphery of a substrate; a spring biasing the support post in the axial direction; a first structure configured to restrict a movement of an upper portion of the spring in a direction perpendicular to the axial direction of the support post; and a second structure configured to restrict a movement of a lower portion of the spring in a direction perpendicular to the axial direction of the support post.

Abstract translation: 公开了一种改进的基板保持装置，即使当大的离心力作用在弹簧上时，可以使弹簧的变形最小化，该弹簧被设置成偏置用于支撑基板的支撑柱。 基板保持装置包括：可沿其轴向移动的支撑柱; 设置在所述支撑柱上并被构造成保持基板的周边的卡盘; 弹簧沿轴向偏置支撑柱; 第一结构，其构造成限制弹簧的上部在与支撑柱的轴向方向垂直的方向上的运动; 以及第二结构，其构造成限制弹簧的下部在垂直于支撑柱的轴向的方向上的运动。