Integrated flex tail circuit packaging
    11.
    发明授权
    Integrated flex tail circuit packaging 有权
    集成柔性尾电路封装

    公开(公告)号:US08837163B2

    公开(公告)日:2014-09-16

    申请号:US13337822

    申请日:2011-12-27

    IPC分类号: H05K1/11 H05K1/14 H05K3/40

    摘要: An integrated structure for interconnection of electrical components is provided. In one embodiment, the integrated structure includes a through mold via (TMV) module having a substrate and at least one component coupled to the substrate. A flexible printed circuit board (flex-PCB) is integrated with the substrate of the TMV module. A TMV is provided through a body of the module to allow the flex-PCB to couple with a logic board.

    摘要翻译: 提供了用于电气部件互连的集成结构。 在一个实施例中,集成结构包括具有衬底和耦合到衬底的至少一个部件的贯穿模具通孔(TMV)模块。 柔性印刷电路板(flex-PCB)与TMV模块的基板集成。 通过模块的主体提供TMV,以允许flex-PCB与逻辑板耦合。

    Bayonet attachment mechanisms
    12.
    发明授权
    Bayonet attachment mechanisms 有权
    卡口附件机构

    公开(公告)号:US08687299B1

    公开(公告)日:2014-04-01

    申请号:US13607611

    申请日:2012-09-07

    IPC分类号: G02B7/02

    摘要: An attachment mechanism includes a compliance member positioned between a body and bayonets. The bayonets collectively define an aperture therebetween. Alignment members prevent rotation of the bayonets relative to the body while allowing the bayonets to move radially outwardly against the compliance member. When a second attachment mechanism is received in the aperture of the first attachment mechanism, relative rotation therebetween may interlock corresponding bayonets thereof. The attachment mechanisms may release from one another in a drop event or other incidence of force applied thereto by allowing a bayonet to radially move outwardly out of contact with a corresponding bayonet of the second attachment mechanism. Related methods are also provided.

    摘要翻译: 附接机构包括位于主体和卡口之间的顺应性构件。 刺刀在它们之间共同地限定开口。 对准构件防止卡口相对于主体的旋转,同时允许卡口径向向外抵靠柔性构件。 当第二附接机构被容纳在第一附接机构的孔中时,它们之间的相对旋转可以互锁其对应的卡口。 附接机构可以通过允许卡口径向向外移动离开与第二附接机构的相应卡口的接触而在落下事件或施加于其上的其它力的作用下彼此释放。 还提供了相关方法。

    Method and system for pairing of wireless devices using physical presence
    13.
    发明申请
    Method and system for pairing of wireless devices using physical presence 有权
    使用物理存在配对无线设备的方法和系统

    公开(公告)号:US20080227393A1

    公开(公告)日:2008-09-18

    申请号:US11686253

    申请日:2007-03-14

    IPC分类号: H04B7/00

    CPC分类号: H04W8/005 H04W76/10

    摘要: Techniques that facilitate pairing of wireless devices with other wireless devices are disclosed. Once paired, the wireless devices can exchange data in a wireless manner. According to one embodiment, a pairing process can be secured through use of physical proximity, or even physical connection, of wireless devices to be paired. According to another embodiment, user actions to provoke or perform pairing can be reduced or eliminated. According to still another embodiment, a wireless device being paired can be configured using configuration information provided from another wireless device being paired.

    摘要翻译: 公开了促进无线设备与其他无线设备配对的技术。 一旦配对,无线设备可以以无线方式交换数据。 根据一个实施例,可以通过使用要配对的无线设备的物理接近度,甚至物理连接来确保配对过程。 根据另一实施例,可以减少或消除用于激发或执行配对的用户动作。 根据另一个实施例,可以使用从配对的另一个无线设备提供的配置信息来配置正在配对的无线设备。

    Connector assemblies
    19.
    发明授权
    Connector assemblies 有权
    连接器组件

    公开(公告)号:US07798831B2

    公开(公告)日:2010-09-21

    申请号:US11999838

    申请日:2007-12-06

    IPC分类号: H01R13/62

    CPC分类号: H01R43/24

    摘要: A headset connector assembly that includes a connector plate, a casing, and electrical contact members is provided. The connector plate can have a first mating surface, a second mating surface, and at least two apertures existing between the first and the second mating surfaces. The casing can have a first side in contact with the first mating surface and a second side. The casing can include a protruding cavity member for each of the at least two apertures. Each protruding cavity member can extend from the first side and be constructed to fit within one of the at least two apertures. Each protruding cavity member can house an electrical contact member.

    摘要翻译: 提供了包括连接器板,壳体和电接触构件的耳机连接器组件。 连接器板可以具有第一配合表面,第二配合表面以及存在于第一和第二配合表面之间的至少两个孔。 壳体可以具有与第一配合表面接触的第一侧和第二侧。 壳体可以包括用于至少两个孔中的每一个的突出空腔构件。 每个突出空腔构件可以从第一侧延伸并且被构造成装配在至少两个孔中的一个中。 每个突出的腔体可以容纳电接触构件。

    Assembly for coupling the housings of an electronic device
    20.
    发明申请
    Assembly for coupling the housings of an electronic device 有权
    用于联接电子设备的壳体的组件

    公开(公告)号:US20080166007A1

    公开(公告)日:2008-07-10

    申请号:US11824180

    申请日:2007-06-28

    IPC分类号: H04R1/10

    摘要: A headset device that includes an earbud housing, a primary housing, a threaded neck, an earbud screw, and a primary housing screw is provided. The earbud housing can include an earbud through-hole and a first neck engaging surface. The primary housing can include a housing through-hole and a second neck engaging surface. The threaded neck can include first and second neck surfaces that can mate, respectively to the first and second neck engaging surface. The earbud screw can fit through the earbud through-hole and can interlock with the threaded neck to fix the earbud housing to the threaded neck. The primary housing screw can fit through the housing through-hole and can interlock with the threaded neck to fix the primary housing to the threaded neck. The threaded neck can include a through-hole for enabling circuitry disposed in the earbud housing to electrically couple to circuitry disposed in the primary housing.

    摘要翻译: 提供包括耳塞壳体,主壳体,螺纹颈部,耳塞螺钉和主壳体螺钉的耳机设备。 耳塞壳体可以包括耳塞通孔和第一颈部接合表面。 主壳体可以包括壳体通孔和第二颈部接合表面。 螺纹颈部可以包括分别与第一和第二颈部接合表面配合的第一和第二颈部表面。 耳塞螺钉可以穿过耳塞通孔,并可以与螺纹颈部锁定,将耳塞外壳固定到螺纹颈部。 主壳体螺钉可以穿过壳体通孔,并且可以与螺纹颈部互锁,以将主壳体固定到螺纹颈部。 螺纹颈部可以包括通孔,用于使得设置在耳塞壳体中的电路能够电耦合到设置在主壳体中的电路。