-
公开(公告)号：US20130075126A1
公开(公告)日：2013-03-28
申请号：US13246041
申请日：2011-09-27
申请人： Michael S. Nashner , John Thomton , Malcolm Early , Emery A. Sanford , Matthew S. Scott , Bradley Sewell , Kaylie Liu , Ronald J. Moller , Jody Akana
发明人： Michael S. Nashner , John Thomton , Malcolm Early , Emery A. Sanford , Matthew S. Scott , Bradley Sewell , Kaylie Liu , Ronald J. Moller , Jody Akana
CPC分类号： B23K26/0622 , B23K26/082 , B23K26/355 , B23K26/364 , B23K2101/35 , B23K2101/42 , B23K2103/08 , B23K2103/10 , B23K2103/14
摘要： Techniques or processes for providing markings on products are disclosed. In one embodiment, the products have housings and the markings are to be provided on the housings. For example, a housing for a particular product can include an outer housing surface and the markings can be provided on the outer housing surface so as to be visible from the outside of the housing. The surface of the housing is able to be anodized and dyed, and the markings of the surface are able to be bleached markings of dyed anodization.
摘要翻译： 公开了在产品上提供标记的技术或工艺。 在一个实施例中，产品具有外壳，并且标记将设置在外壳上。 例如，用于特定产品的壳体可以包括外部壳体表面，并且标记可以设置在外部壳体表面上，以便从壳体的外部可见。 外壳的表面能够进行阳极氧化和染色，并且表面的标记能够被染色阳极氧化的漂白标记。
-
公开(公告)号：US20130083500A1
公开(公告)日：2013-04-04
申请号：US13250660
申请日：2011-09-30
申请人： Christopher D. Prest , Dermot J. Stratton , Joseph C. Poole , Matthew S. Scott , Michael S. Nashner
发明人： Christopher D. Prest , Dermot J. Stratton , Joseph C. Poole , Matthew S. Scott , Michael S. Nashner
CPC分类号： B41M5/262 , Y10T428/24802
摘要： Techniques or processes for providing markings on products are disclosed. In one embodiment, the products have housings and the markings are to be provided on the housings. For example, a housing for a particular product can include an outer housing surface and the markings can be provided on the outer housing surface so as to be visible from the outside of the housing. The markings are able to be interferometric colors and/or black.
摘要翻译： 公开了在产品上提供标记的技术或工艺。 在一个实施例中，产品具有外壳，并且标记将设置在外壳上。 例如，用于特定产品的壳体可以包括外部壳体表面，并且标记可以设置在外部壳体表面上，以便从壳体的外部可见。 标记能够是干涉色和/或黑色。
-
3.发明授权公开(公告)号：US08093532B2
公开(公告)日：2012-01-10
申请号：US12060023
申请日：2008-03-31
IPC分类号： B23K26/16
CPC分类号： B23K26/16 , B23K26/40 , B23K2103/52
摘要： Laser machining fired ceramic and other hard and/or thick materials includes scribing a workpiece with a laser beam along a sequence of parallel laser paths within a cutout region of the workpiece. The scribing creates a kerf in the cutout region that widens as the laser beam advances along the sequence. The sequence may begin with an inner portion of the cutout region and end with an outer edge thereof such that debris is directed away from the laser paths to increase throughput and create a high quality opening in the workpiece. High quality structures may also be cut out from the workpiece. The method includes directing a high velocity stream of gas to an interface of the laser beam and the workpiece to redirect the flow of debris and cool the interface. The method may also adjust a focus depth of the laser beam as it deepens the kerf.
摘要翻译： 激光加工烧制陶瓷和其他硬质和/或厚的材料包括在工件的切口区域内沿着一系列平行激光路径用激光束刻划工件。 划线在切割区域中产生切割，随着激光束沿着该序列的前进而变宽。 顺序可以从切口区域的内部开始并且以其外边缘结束，使得碎屑被引导离开激光路径以增加生产量并且在工件中产生高质量的开口。 也可以从工件切出高质量的结构。 该方法包括将高速气流引导到激光束和工件的界面，以重定向碎屑流并冷却界面。 该方法还可以在其加深切口时调节激光束的聚焦深度。
-
公开(公告)号：US20070278703A1
公开(公告)日：2007-12-06
申请号：US11742879
申请日：2007-05-01
IPC分类号： B32B38/04
CPC分类号： B29C66/472 , B23K2103/42 , B23K2103/50 , B29C39/006 , B29C65/1406 , B29C65/1435 , B29C65/1483 , B29C65/4845 , B29C66/1122 , B29C66/30325 , B29C66/43 , B29C66/45 , B29C66/742 , B29C2035/0827 , B60Q3/14 , Y10T428/24273
摘要： A method for thinning a substrate prior to drilling and/or for structurally reinforcing a thinned substrate having a via pattern after drilling and products resulting thereby. A substrate, or panel, has a first thickness. A pocket is formed in the substrate where the pocket has a second thickness less than the first thickness. At least one via is drilled in the pocket, and the via(s) are filled with an optically transmissive material.
摘要翻译： 在钻井之前和/或用于在结构上加强具有钻孔后的通孔图案的薄化基板和由此产生的产品的方法。 衬底或面板具有第一厚度。 在基板中形成有口袋，其中口袋具有小于第一厚度的第二厚度。 在口袋中钻出至少一个通孔，并且通孔用一种透光材料填充。
-
公开(公告)号：US08450640B2
公开(公告)日：2013-05-28
申请号：US13114607
申请日：2011-05-24
CPC分类号： B29C66/472 , B23K2103/42 , B23K2103/50 , B29C39/006 , B29C65/1406 , B29C65/1435 , B29C65/1483 , B29C65/4845 , B29C66/1122 , B29C66/30325 , B29C66/43 , B29C66/45 , B29C66/742 , B29C2035/0827 , B60Q3/14 , Y10T428/24273
摘要： An area of reduced thickness is formed in a panel, and a pattern of microscopic holes are formed in the area. The holes are filled with a light transmissive material such as a curable polymer. The thinned area may also be filled with a polymer to reinforce the thinned area and the polymer may be colored to add color to light transmitted through the pattern. The panel can form a portion of a housing surrounding a lighting source that makes the holes visible when lit.
摘要翻译： 在面板中形成厚度减小的区域，并且在该区域中形成微小孔的图案。 孔中填充有透光性材料如可固化聚合物。 稀薄区域还可以填充聚合物以加强变薄区域，并且聚合物可以着色以对通过图案传输的光增加颜色。 面板可以形成围绕照明源的壳体的一部分，其在点亮时使得孔可见。
-
公开(公告)号：US10071584B2
公开(公告)日：2018-09-11
申请号：US13619208
申请日：2012-09-14
申请人： Michael S. Nashner , John T. Payne , Jody R. Akana
发明人： Michael S. Nashner , John T. Payne , Jody R. Akana
CPC分类号： B41M5/267 , G06F1/1656 , H05K5/0252
摘要： Techniques or processes for providing markings on products are disclosed. In one embodiment, the products have housings and the markings are to be provided on sub-surfaces of the housings. For example, a housing for a particular product can include an outer housing surface and the markings can be provided on a sub-surface of the outer housing surface yet still be visible from the outside of the housing. Since the markings are beneath the surface of the housing, the markings are durable.
-
公开(公告)号：US09644283B2
公开(公告)日：2017-05-09
申请号：US13250588
申请日：2011-09-30
摘要： A method of treating a metallic surface of an article including the steps of providing an article having a metallic surface; texturizing the surface using a laser to create a controlled pattern across the surface; and anodizing the surface. The controlled pattern may include a series of pits etched in a predetermined repeating pattern across the surface, such as an array of dots or a grid. The controlled pattern may also include a series of pits etched in a predetermined pseudo-random pattern across the surface.
-
公开(公告)号：US20110222298A1
公开(公告)日：2011-09-15
申请号：US13114607
申请日：2011-05-24
CPC分类号： B29C66/472 , B23K2103/42 , B23K2103/50 , B29C39/006 , B29C65/1406 , B29C65/1435 , B29C65/1483 , B29C65/4845 , B29C66/1122 , B29C66/30325 , B29C66/43 , B29C66/45 , B29C66/742 , B29C2035/0827 , B60Q3/14 , Y10T428/24273
摘要： An area of reduced thickness is formed in a panel, and a pattern of microscopic holes are formed in the area. The holes are filled with a light transmissive material such as a curable polymer. The thinned area may also be filled with a polymer to reinforce the thinned area and the polymer may be colored to add color to light transmitted through the pattern. The panel can form a portion of a housing surrounding a lighting source that makes the holes visible when lit.
摘要翻译： 在面板中形成厚度减小的区域，并且在该区域中形成微小孔的图案。 孔中填充有透光性材料如可固化聚合物。 稀薄区域还可以填充聚合物以加强变薄区域，并且聚合物可以着色以对通过图案传输的光增加颜色。 面板可以形成围绕照明源的壳体的一部分，其在点亮时使得孔可见。
-
公开(公告)号：US20070291496A1
公开(公告)日：2007-12-20
申请号：US11742862
申请日：2007-05-01
CPC分类号： B29D11/00663
摘要： A method of forming a filled via with an optically transmissive material and a resulting product. The method comprises drilling a via in a panel and filling the via with an optically transmissive material. The method can also be used to create a light transmissive section of a housing. A light source directed to one side of the via is seen through the optically transmissive material so as to be visible to a viewer viewing a surface at the second side of the via.
摘要翻译： 一种用光学透射材料和所得产品形成填充的通孔的方法。 该方法包括在面板中钻孔，并用透光材料填充通孔。 该方法还可以用于创建壳体的透光部分。 通过透光材料可以看到指向通孔一侧的光源，以便在观察通孔第二面处的表面的观察者可见。
-
公开(公告)号：US06465358B1
公开(公告)日：2002-10-15
申请号：US09684550
申请日：2000-10-06
申请人： Michael S. Nashner , Bruce Beattie
发明人： Michael S. Nashner , Bruce Beattie
IPC分类号： H01L21311
CPC分类号： H01L21/76808 , H01L21/02063 , H01L21/31116 , H01L21/31133 , H01L21/31138 , Y10S438/906 , Y10S438/963
摘要： An improved method of forming a semiconductor device is described. The method comprises forming a dielectric layer on a substrate, forming a photoresist layer on the dielectric layer, then patterning the photoresist layer to define a region to be etched. After forming an etched region within the dielectric layer, the photoresist layer is removed and the etched region is cleaned. The etched region is cleaned by applying a buffered oxide etch dip, followed by an amine based dip.
摘要翻译： 描述了一种形成半导体器件的改进方法。 该方法包括在基底上形成电介质层，在电介质层上形成光致抗蚀剂层，然后对光致抗蚀剂层进行构图以限定待蚀刻的区域。 在电介质层内形成蚀刻区域之后，去除光致抗蚀剂层并清洁蚀刻区域。 通过施加缓冲氧化物蚀刻浸渍，然后进行胺基浸渍来清洁蚀刻区域。
-
-
-
-
-
-
-
-
-
搜索结果
21 条记录 (耗时 0.035 秒)
