公开(公告)号：US08730674B2

公开(公告)日：2014-05-20

申请号：US13316954

申请日：2011-12-12

申请人： Ercan Mehmet Dede ,  Jaewook Lee ,  Tsuyoshi Nomura

发明人： Ercan Mehmet Dede ,  Jaewook Lee ,  Tsuyoshi Nomura

IPC分类号： H05K7/20

CPC分类号： F25B21/00 ,  F25B2321/0021 ,  H05K7/20927 ,  Y02B30/66

摘要： Magnetic fluid cooling devices and power electronic devices are disclosed. In one embodiment, a magnetic fluid cooling device includes a magnetic field generating device, a magnetic fluid chamber assembly, and a heat sink device. The magnetic field generating device includes a plurality of magnetic regions having alternating magnetic directions such that magnetic flux generated by the magnetic field generating device is enhanced on a first side of the magnetic field generating device and inhibited on a second side of the magnetic field generating device. The magnetic fluid chamber assembly defines a magnetic fluid chamber configured to receive magnetic fluid. The heat sink device includes a plurality of extending fins, and is thermally coupled to the magnetic fluid chamber assembly. Power electronic devices are also disclosed, wherein the magnetic fluid chamber may be configured as opened or closed.

摘要翻译： 公开了磁流体冷却装置和功率电子装置。 在一个实施例中，磁流体冷却装置包括磁场产生装置，磁性流体室组件和散热装置。 磁场产生装置包括具有交变磁方向的多个磁性区域，使得由磁场产生装置产生的磁通在磁场产生装置的第一侧被增强，并且在磁场产生装置的第二侧被禁止 。 磁性流体室组件限定了构造成接收磁性流体的磁性流体室。 散热装置包括多个延伸翅片，并且热耦合到磁性流体室组件。 还公开了电力电子设备，其中磁性流体室可以被配置为打开或关闭。

公开(公告)号：US20140028424A1

公开(公告)日：2014-01-30

申请号：US13559850

申请日：2012-07-27

申请人： Ercan Mehmet Dede ,  Jaewook Lee

发明人： Ercan Mehmet Dede ,  Jaewook Lee

IPC分类号： H01F7/06

CPC分类号： H01Q15/0086 ,  H01F5/003 ,  H01Q15/0026 ,  H02K1/02

摘要： A magnetic field manipulation apparatus comprises a metamaterial structure, the metamaterial structure including a multilayer stack of metamaterial layers, each metamaterial layer including a substrate supporting one or more conductive loops. The metamaterial structure may be configured to redirect the magnetic flux around the metamaterial structure, and in some examples concentrated into a gap between two adjacent metamaterial structures. An apparatus may further include a magnetic field source such as an electromagnet.

摘要翻译： 磁场操纵装置包括超材料结构，超材料结构包括多层叠层的超材料层，每个超材料层包括支撑一个或多个导电环的衬底。 超材料结构可以被配置为重定向在超材料结构周围的磁通量，并且在一些示例中集中在两个相邻的超材料结构之间的间隙中。 装置还可以包括诸如电磁体的磁场源。

公开(公告)号：US20130343913A1

公开(公告)日：2013-12-26

申请号：US13528358

申请日：2012-06-20

申请人： Shailesh N. JOSHI ,  Jaewook LEE ,  Ercan Mehmet Dede

发明人： Shailesh N. JOSHI ,  Jaewook LEE ,  Ercan Mehmet Dede

IPC分类号： H02K44/08

CPC分类号： F04D33/00 ,  F04B19/006 ,  F04B43/043

摘要： An apparatus that includes a chamber. The chamber includes an inlet via which process fluid enters the chamber and an outlet via which the process fluid exits the chamber. A diaphragm is fixed in position in the chamber at a periphery of the diaphragm. The diaphragm includes a magnetic fluid therein.

摘要翻译： 一种包括腔室的装置。 该室包括入口，工艺流体通过该入口进入腔室，出口通过该出口流出腔室。 隔膜在隔膜的周边处固定在腔室中的适当位置。 隔膜在其中包括磁性流体。

公开(公告)号：US09231309B2

公开(公告)日：2016-01-05

申请号：US13559850

申请日：2012-07-27

申请人： Ercan Mehmet Dede ,  Jaewook Lee

发明人： Ercan Mehmet Dede ,  Jaewook Lee

IPC分类号： H01Q15/00 ,  H01F5/00 ,  H02K1/02

CPC分类号： H01Q15/0086 ,  H01F5/003 ,  H01Q15/0026 ,  H02K1/02

摘要： A magnetic field manipulation apparatus comprises a metamaterial structure, the metamaterial structure including a multilayer stack of metamaterial layers, each metamaterial layer including a substrate supporting one or more conductive loops. The metamaterial structure may be configured to redirect the magnetic flux around the metamaterial structure, and in some examples concentrated into a gap between two adjacent metamaterial structures. An apparatus may further include a magnetic field source such as an electromagnet.

摘要翻译： 磁场操纵装置包括超材料结构，超材料结构包括多层叠层的超材料层，每个超材料层包括支撑一个或多个导电环的衬底。 超材料结构可以被配置为重定向在超材料结构周围的磁通量，并且在一些示例中集中在两个相邻的超材料结构之间的间隙中。 装置还可以包括诸如电磁体的磁场源。

公开(公告)号：US08929074B2

公开(公告)日：2015-01-06

申请号：US13561229

申请日：2012-07-30

申请人： Shailesh N. Joshi ,  Ercan Mehmet Dede

发明人： Shailesh N. Joshi ,  Ercan Mehmet Dede

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  H01L2924/0002 ,  H02K7/006 ,  H02K9/005 ,  H02K9/19 ,  H02K9/20 ,  H02K2209/00 ,  H05K7/20345 ,  H05K7/20936 ,  H01L2924/00

摘要： Electronic device assemblies employing dual phase change materials and vehicles incorporating the same are disclosed. In one embodiment, an electronic device assembly includes a semiconductor device having a surface, wherein the semiconductor device operates in a transient heat flux state and a normal heat flux state, a coolant fluid thermally coupled to the surface of the semiconductor device, and a phase change material thermally coupled to the surface of the semiconductor device. The phase change material has a phase change temperature at which the phase change material changes from a first phase to a second phase. The phase change material absorbs heat flux at least when the semiconductor device operates in the transient heat flux state.

摘要翻译： 公开了使用双相变材料的电子装置组件和结合其的车辆。 在一个实施例中，电子设备组件包括具有表面的半导体器件，其中半导体器件在瞬态热通量状态和正常热通量状态下工作，热耦合到半导体器件的表面的冷却剂流体， 改变材料热耦合到半导体器件的表面。 相变材料具有相变材料从第一相变为第二相的相变温度。 至少当半导体器件在瞬态热通量状态下工作时，相变材料吸收热通量。

公开(公告)号：US08842435B2

公开(公告)日：2014-09-23

申请号：US13471699

申请日：2012-05-15

申请人： Shailesh N. Joshi ,  Ercan Mehmet Dede

发明人： Shailesh N. Joshi ,  Ercan Mehmet Dede

IPC分类号： H05K7/20 ,  F28D15/00 ,  H01B9/06

CPC分类号： H05K7/209 ,  H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

摘要： A two-phase heat transfer assembly includes a cold plate having an impingement surface, an array of heat generating device coupled to the cold plate, and an array of spray nozzles. The impingement surface has an array of central hydrophilic regions. Each individual central hydrophilic region is surrounded by a hydrophobic perimeter. A wettability of the impingement surface gradually progresses from hydrophilic at each individual central hydrophilic region to hydrophobic at each hydrophobic perimeter. The array of heat generating devices is coupled to a heated surface of the cold plate such that the array of central hydrophilic regions is aligned with the array of heat generating devices. The array of spray nozzles is configured to direct coolant droplets toward the impingement surface. The wettability profile of the impingement surface of the cold plate causes the coolant droplets to move inwardly toward the individual central hydrophilic regions from each hydrophobic perimeter.

摘要翻译： 两相传热组件包括具有冲击表面的冷板，联接到冷板的发热装置阵列和一组喷嘴。 冲击表面具有中心亲水区域的阵列。 每个单独的中心亲水区被疏水周边包围。 冲击表面的润湿性在每个疏水性周边处逐渐从亲水性逐渐发展到疏水性。 发热装置的阵列耦合到冷板的加热表面，使得中心亲水区域的阵列与发热装置阵列对准。 喷嘴阵列被配置成将冷却剂液滴引向冲击表面。 冷板的冲击表面的润湿性能导致冷却剂液滴从每个疏水性周边向内朝各个中心亲水区域移动。

公开(公告)号：US08305755B2

公开(公告)日：2012-11-06

申请号：US12717595

申请日：2010-03-04

申请人： Ercan Mehmet Dede

发明人： Ercan Mehmet Dede

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： F28F7/00 ,  H05K7/20

摘要： A jet impingement cooling device may include a jet structure and a target layer. The jet structure may include at least one fluid jet operable to produce an impingement jet of cooling fluid. The target layer may further include a heat receiving surface configured to be coupled to a heat generating device and a jet impingement target surface. The jet impingement target surface may further include at least one target structure having a wavy-fin topology with a fin peak, wherein the fluid jet and the target structure are arranged such that the fin peak of the target structure is aligned with a centerline of the impingement jet of cooling fluid during operation of the jet impingement cooling device.

摘要翻译： 喷射冲击冷却装置可以包括喷射结构和目标层。 射流结构可以包括至少一个可操作以产生冷却流体的冲击射流的流体射流。 目标层还可以包括被配置为耦合到发热装置和喷射冲击目标表面的受热表面。 喷射冲击目标表面可以进一步包括至少一个目标结构，其具有带翅片峰值的波浪翅片拓扑结构，其中流体射流和目标结构被布置成使得目标结构的鳍峰与中心线对准 在喷射冲击冷却装置运行期间的冷却流体的冲击射流。

公开(公告)号：US20120267077A1

公开(公告)日：2012-10-25

申请号：US13091393

申请日：2011-04-21

申请人： Ercan Mehmet Dede

发明人： Ercan Mehmet Dede

IPC分类号： F28D15/00

CPC分类号： F28D15/0233 ,  F28D15/0266 ,  F28F13/187 ,  H01L23/427 ,  H01L23/4735 ,  H01L2924/0002 ,  H05K7/20936 ,  H01L2924/00

摘要： Cooling apparatuses and power electronics modules with cooling apparatuses are disclosed. In one embodiment, a cooling apparatus includes a heat transfer plate having a heat output surface and a periodic fractal pattern formed in the heat output surface. The periodic fractal pattern increases the surface area of the heat output surface and provides vapor bubble nucleation sites. An enclosure encloses the heat transfer plate and forms a fluid chamber between the enclosure and the heat transfer plate. A fluid source is fluidly coupled to the fluid chamber and provides cooling fluid to the fluid chamber. When the heat transfer plate is thermally coupled to the heat source, the heat source heats the transfer plate which vaporizes the cooling fluid in the fluid chamber thereby dissipating the heat of the heat source.

摘要翻译： 公开了具有冷却装置的冷却装置和电力电子模块。 在一个实施例中，冷却装置包括具有形成在热输出表面中的热输出表面和周期性分形图案的传热板。 周期性分形模式增加了热输出表面的表面积，并提供了蒸气泡成核位点。 外壳包围传热板，并在外壳和传热板之间形成流体室。 流体源流体耦合到流体室，并向流体室提供冷却流体。 当传热板热耦合到热源时，热源加热转移板，其使流体室中的冷却流体蒸发，从而消散热源的热量。

公开(公告)号：US20120170222A1

公开(公告)日：2012-07-05

申请号：US12984905

申请日：2011-01-05

申请人： Ercan Mehmet Dede ,  Yan Liu

发明人： Ercan Mehmet Dede ,  Yan Liu

IPC分类号： H05K7/20 ,  F28F9/02

CPC分类号： F28F3/083 ,  F28F9/0221 ,  H01L2924/0002 ,  H05K7/20254 ,  H01L2924/00

摘要： A cold plate assembly includes an inlet manifold layer, a target heat transfer layer, a second-pass heat transfer layer, and an outlet manifold layer. The inlet manifold layer includes a coolant fluid outlet and an inlet channel. The inlet channel includes a plurality of fluid inlet holes fluidly coupled to a plurality of impingement jet nozzles. The target heat transfer layer includes a plurality of target heat transfer cells having a plurality of target heat transfer layer microchannels extending in a radial direction from a central impingement region. The second-pass heat transfer layer includes a plurality of second-pass heat transfer cells having a plurality of second-pass heat transfer layer microchannels extending in a radial direction toward a central fluid outlet region, and one or more transition channels. The impingement jet nozzles are positioned through the central fluid outlet region. The outlet manifold layer includes an outlet channel having a plurality of fluid outlet holes.

摘要翻译： 冷板组件包括入口歧管层，靶传热层，二次传热层和出口歧管层。 入口歧管层包括冷却剂流体出口和入口通道。 入口通道包括流体地联接到多个冲击喷嘴的多个流体入口孔。 目标传热层包括多个目标传热单元，其具有从中心冲击区域沿径向延伸的多个目标传热层微通道。 第二通道传热层包括多个第二通道传热单元，其具有沿径向向中心流体出口区域延伸的多个第二通过传热层微通道，以及一个或多个过渡通道。 冲击喷嘴位于中心流体出口区域。 出口歧管层包括具有多个流体出口孔的出口通道。

公开(公告)号：US08203839B2

公开(公告)日：2012-06-19

申请号：US12721174

申请日：2010-03-10

申请人： Ercan Mehmet Dede

发明人： Ercan Mehmet Dede

IPC分类号： H05K7/20

CPC分类号： F28F7/02 ,  F28D2021/0029 ,  F28F9/02 ,  F28F21/06 ,  F28F2255/14 ,  H05K7/2089

摘要： A cooling device may include a fluid inlet manifold, a case body, and a fluid outlet manifold that are formed of a molded polymer composite material. The fluid inlet manifold may include a fluid inlet channel and a fluid inlet reservoir. The case body may include a plurality of cooling channels extending from a first surface of the case body to a second surface of the case body. The cooling channels may fluidly couple the first surface of the case body to the fluid inlet reservoir. The fluid outlet manifold may further include a fluid outlet channel and a fluid outlet reservoir. The cooling channels may fluidly couple the second surface of the case body to the fluid outlet reservoir. The fluid inlet channel, cooling channels, and fluid outlet channels may include a cross-section topology.

摘要翻译： 冷却装置可以包括由模制的聚合物复合材料形成的流体入口歧管，壳体和流体出口歧管。 流体入口歧管可以包括流体入口通道和流体入口容器。 壳体可以包括从壳体的第一表面延伸到壳体的第二表面的多个冷却通道。 冷却通道可以将壳体的第一表面流体地联接到流体入口容器。 流体出口歧管还可包括流体出口通道和流体出口储存器。 冷却通道可以将壳体的第二表面流体地联接到流体出口储存器。 流体入口通道，冷却通道和流体出口通道可以包括横截面拓扑。