公开(公告)号：US20140057394A1

公开(公告)日：2014-02-27

申请号：US13594498

申请日：2012-08-24

Applicant: Anandan Ramasamy ,  Yonggang Jin ,  Yun Liu ,  Eric Saugier ,  Romain Coffy ,  How Yuan Hwang

Inventor： Anandan Ramasamy ,  Yonggang Jin ,  Yun Liu ,  Eric Saugier ,  Romain Coffy ,  How Yuan Hwang

IPC: H01L21/60 ,  H01L21/56

CPC classification number: H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/14 ,  H01L24/19 ,  H01L24/81 ,  H01L24/96 ,  H01L24/97 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/06181 ,  H01L2224/11334 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/14181 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2225/06524 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2224/05 ,  H01L2224/81 ,  H01L2224/11 ,  H01L2924/014 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A manufacturing process includes forming a reconstituted wafer, including embedding semiconductor dice in a molding compound layer and forming through-wafer vias in the layer. A fan-out redistribution layer is formed on a front side of the wafer, with electrical traces interconnecting the dice, through-wafer vias, and contact pads positioned on the redistribution layer. Solder balls are positioned on the contact pads and a molding compound layer is formed on the redistribution layer, reinforcing the solder balls. A second fan-out redistribution layer is formed on a back side of the wafer, with electrical traces interconnecting back ends of the through-wafer vias and contact pads positioned on a back face of the second redistribution layer. Flip-chips and/or surface-mounted devices are coupled to the contact pads of the second redistribution layer and encapsulated in an underfill layer formed on the back face of the second redistribution layer.

Abstract translation: 一种制造方法包括形成重构的晶片，包括将半导体晶片嵌入到模塑复合层中并在该层中形成贯通晶片通孔。 在晶片的前侧形成扇出重分布层，其中电迹线将骰子，贯穿晶片通孔和位于再分布层上的接触焊盘相互连接。 焊球定位在接触垫上，并且在再分布层上形成模塑料层，从而加强焊球。 第二扇出再分配层形成在晶片的背面上，其中电迹线互连贯通晶片通孔的后端和位于第二再分布层的背面上的接触焊盘。 翻转芯片和/或表面安装器件耦合到第二再分布层的接触焊盘，并且封装在形成在第二再分配层的背面上的底部填充层中。

公开(公告)号：US20120133956A1

公开(公告)日：2012-05-31

申请号：US13242708

申请日：2011-09-23

Applicant: Ewan Findlay ,  Colin Campbell ,  Gemma Ramsey ,  Eric Saugier

Inventor： Ewan Findlay ,  Colin Campbell ,  Gemma Ramsey ,  Eric Saugier

IPC: G01B11/14 ,  H01L31/18 ,  H01L31/0232

CPC classification number: H03K17/941 ,  H01L25/167 ,  H01L31/125 ,  H01L31/173 ,  H01L2924/0002 ,  H03K2017/9455 ,  H03K2217/94108 ,  H01L2924/00

Abstract: The internal propagation of radiation between a radiation source and radiation detector mounted within a sensor package is prevented by the use of an optical isolator. The optical isolator is formed by the combination of a baffle mounted between the source and detector and a groove formed in an upper surface of the sensor package between the source and detector. A bottom of the groove is positioned adjacent to an upper edge of the baffle.

Abstract translation: 通过使用光隔离器来防止辐射源和安装在传感器封装内的辐射探测器之间的辐射的内部传播。 光隔离器由安装在源和检测器之间的挡板和在源和检测器之间形成在传感器封装的上表面中的凹槽的组合形成。 凹槽的底部邻近挡板的上边缘定位。

公开(公告)号：US08098445B2

公开(公告)日：2012-01-17

申请号：US12013078

申请日：2008-01-11

Applicant: Colin Campbell ,  Eric Saugier

Inventor： Colin Campbell ,  Eric Saugier

IPC: G02B7/02

CPC classification number: G02B7/08

Abstract: A focusing device for a lens, including a frame, a lens carrier movable relative to the frame from a first position along an optical axis, a motor for driving the lens carrier along the optical axis, and at least one biasing member adapted to bias the lens carrier towards the first position. The biasing member may include one or more bending members.

Abstract translation: 一种用于透镜的聚焦装置，包括框架，可沿着光轴从第一位置相对于框架移动的透镜支架，用于沿着光轴驱动透镜支架的电动机以及至少一个偏置构件 透镜载体朝向第一位置。 偏置构件可以包括一个或多个弯曲构件。