公开(公告)号：US11283234B2

公开(公告)日：2022-03-22

申请号：US16986391

申请日：2020-08-06

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Kazuki Yamaoka ,  Maiko Ariga ,  Yusuke Inaba

IPC: H01S5/022 ,  H01S5/02208 ,  G02B6/42 ,  H01S5/00 ,  H01S5/40 ,  H01S5/02234

Abstract: An optical module includes: an optical component; a light receiving element receiving a laser beam through the optical component; a package housing the optical component and the light receiving unit; and a shielding portion that prevents stray light, which is generated by at least one of the laser beam and the laser beam emitted through the optical component is reflected or scattered in the package or at the optical component, from being incident on the light receiving element.

公开(公告)号：US20190312414A1

公开(公告)日：2019-10-10

申请号：US16444778

申请日：2019-06-18

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Maiko Ariga ,  Yusuke Inaba ,  Kazuki Yamaoka ,  Toshio Sugaya

IPC: H01S5/50 ,  H01S5/022 ,  H01S5/10

Abstract: A disclosed semiconductor laser module includes a semiconductor laser device; a waveguide optical function device that has an incidence end on which laser light emitted from the semiconductor laser device is incident and that guides the incident light; and a protrusion that is provided on an extension line of a light path of the laser light emitted from the semiconductor laser device, the extension line extending beyond the incidence end.

公开(公告)号：US12066657B2

公开(公告)日：2024-08-20

申请号：US17393957

申请日：2021-08-04

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Yusuke Inaba ,  Junichi Hasegawa ,  Maiko Ariga ,  Kazuki Yamaoka

IPC: G02B6/12 ,  G02B6/293 ,  G02B6/42 ,  H01S5/0239

CPC classification number: G02B6/12007 ,  G02B6/1203 ,  G02B6/29398 ,  G02B6/4228 ,  G02B6/4244 ,  G02B6/426 ,  H01S5/0239 ,  G02B6/29338 ,  G02B6/29352 ,  G02B6/4286

Abstract: An optical module includes: a substrate and a waveguide element having a mount face opposed to the substrate, the waveguide element having an interference waveguide portion having an optical interference function. Further, the mount face includes a projection region to which the interference waveguide portion is projected on the mount face and a non-projection region, and the waveguide element is joined to the substrate with a joint material in the non-projection region.

公开(公告)号：US11031746B2

公开(公告)日：2021-06-08

申请号：US16539384

申请日：2019-08-13

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Yuta Ishige ,  Maiko Ariga ,  Masaki Iwama

IPC: H01S5/02251 ,  H01S5/042 ,  H01S5/10 ,  G02B6/42

Abstract: A semiconductor laser module includes a semiconductor laser device that outputs laser light; an optical fiber that includes a core portion and a cladding portion formed at an outer periphery of the core portion and that receives the laser light from one end and guides the laser light to the outside of the semiconductor laser module; an optical part disposed at an outer periphery of the optical fiber, having optical transmittance at a wavelength of the laser light, and that fixes the optical fiber; a first fixative that fixes the optical part and the optical fiber; and a housing that accommodates the semiconductor laser device and the one end of the optical fiber that receives the laser light, wherein an optical reflection reducing region treated to absorb the laser light and having a rough surface is formed around the optical part.

公开(公告)号：US10886693B2

公开(公告)日：2021-01-05

申请号：US16538151

申请日：2019-08-12

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Maiko Ariga ,  Yuta Ishige ,  Masaki Iwama

IPC: H01S5/00 ,  H01S5/022 ,  H01S5/024 ,  H01S5/0687 ,  H01S5/50 ,  H01S5/068

Abstract: An optical module includes a housing and an optical element that is disposed in the housing and emits light in the housing, in which a partial area of a surface inside the housing serves as a reduced optical reflection area processed so as to absorb the light and have a rough surface.

公开(公告)号：US10811840B2

公开(公告)日：2020-10-20

申请号：US16053850

申请日：2018-08-03

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Maiko Ariga ,  Yusuke Inaba ,  Kazuaki Kiyota ,  Toshihito Suzuki

IPC: H01S5/026 ,  H01S5/022 ,  H01S5/10 ,  H01S5/02 ,  H01S5/024 ,  H01S5/125 ,  H01S5/14 ,  H01S5/028 ,  H01S5/00 ,  H01S5/50 ,  H01S5/0687

Abstract: A laser module that can suppress influence due to a reflected light between chips is provided. A laser module 100 according to one embodiment of the present invention includes: a laser element 110 provided on a first substrate and having a laser oscillation unit that generates a laser light and a first optical waveguide that guides the laser light; and an optical amplifier 120 provided on a second substrate and having a second waveguide that guides the laser light. The first optical waveguide is nonparallel relative to an end face of the first substrate and connected thereto, the second optical waveguide is nonparallel relative to an end face of the second substrate and connected thereto, and the first substrate and the second substrate are arranged such that the laser light output from the first optical waveguide is optically coupled to the second optical waveguide.

公开(公告)号：US20150098480A1

公开(公告)日：2015-04-09

申请号：US14564270

申请日：2014-12-09

Applicant: FURUKAWA ELECTRIC CO., LTD

Inventor： Tetsuya MATSUYAMA ,  Maiko Ariga ,  Toshio Sugaya ,  Toshio Kimura

IPC: H01S5/024 ,  H01S5/12 ,  H01S5/022

CPC classification number: H01S5/02415 ,  H01S5/0064 ,  H01S5/02208 ,  H01S5/0222 ,  H01S5/02248 ,  H01S5/02268 ,  H01S5/02284 ,  H01S5/02438 ,  H01S5/02446 ,  H01S5/026 ,  H01S5/0265 ,  H01S5/0683 ,  H01S5/0687 ,  H01S5/12

Abstract: An optical element module includes a casing having a bottom plate, a temperature-adjusting unit being mounted on the bottom plate in the casing and having at least a lower layer portion and an upper layer portion positioned above the lower layer portion, a support member mounted on the temperature-adjusting unit in the casing, and a semiconductor laser element being mounted on the support member and outputting a laser light to a forward side. The upper layer portion of the temperature-adjusting unit projects at a backward side of the semiconductor laser element relative to the lower layer portion.

Abstract translation: 光学元件模块包括具有底板的壳体，温度调节单元安装在壳体中的底板上，并且至少具有下层部分和位于下层部分上方的上层部分， 在壳体中的温度调节单元上，并且半导体激光元件安装在支撑构件上并向前侧输出激光。 温度调节单元的上层部分相对于下层部​​分在半导体激光元件的后侧突出。