Abstract:
A floating gate tunneling metal oxide semiconductor (FATMOS) transistor is formed in a well region on a semiconductive substrate of a conductivity type opposite to that of the well region, so that charging and discharging of the FATMOS floating gate is accomplished by controlling the potential of the well region. As a result, in an electrically erasable programmable read-only memory, each memory cell requires only one FATMOS transistor, the need for an additional control transistor having been eliminated. Selection of individual memory cells is enhanced by providing a floating gate which only partially overlies the FATMOS transistor channel, so that the overlying FATMOS control electrode performs an "and" gate function independently of the floating gate.
Abstract:
An electronic memory is described which has only two transistors in each memory cell, but does not require that data processing be periodically interrupted to enable refreshing. It adds to a typical, single transistor cell dynamic memory one additional transistor per cell, and a duplication of the driving and sensing circuitry typically included in such a memory. The additional transistor in each cell provides access to the same for refreshing, which refreshing is accomplished by the additional driving and sensing circuitry at the very same time the memory is otherwise being accessed for data processing.
Abstract:
This invention is a damascene processing method for forming ultra short channel MOS transistors, where the channel length is not determined by photolithograpy. The method uses chemical mechanical polishing to self align an MOS transistor gate electrode to the MOS channel region in both the width and length directions. The method enables metal interconnect lines to make borderless connections to the MOS gate electrodes directly over channel regions, and allows borderless connections to be made to the MOS source and drain regions, thereby improving layout density of small transistors. The method uses metal for first level interconnect lines rather than polysilicon. The method enables the interconnect lines to be patterned on a planar surface, which facilitates the etching of very narrow and closely spaced lines. The method does not require any Shallow Trench Isolation (STI), and does not require Local Oxidation of Silicon (LOCOS), thereby resulting in little damage to the silicon substrate. The method also prevents plasma damage of very thin gate dielectrics during processing.
Abstract:
A CMOS device having many output channels at least one of which channel includes a first pair of pull-up/pull-down of transistors between a "noisy Vcc and noisy ground", a second pair of pull-up/pull-down of transistors between a "quiet Vcc and quiet ground", and logic to switch the transistor pairs such that initial switching of an output is powered by the noisy Vcc and ground, and maintenance of an output state is powered by the quiet Vcc and ground. Quiescent channels are decoupled from active channels and will hold their assigned output levels.
Abstract:
A CMOS integrated circuit (IC) deviceembodiment of the present invention comprises an internal logic circuit operating with traditional 3.3 volt or five volt internal logic levels, an output buffer to convert the internal logic levels to external logic levels of 0.3 volts and an input buffer to convert the 0.3 volt external logic levels to the internal logic levels. In a CMOS IC device having numerous external output loads including relatively high capacitive values that are driven at very high clock rates, the restricted voltage swings of the 0.3 volt external logic levels permit unusually large numbers of devices to be driven without exceeding a predetermined power dissipation limit of the CMOS IC device. The low external logic levels further permit electrostatic discharge (ESD) protection to be included on all signal inputs and outputs of the CMOS IC device. The ESD protection comprises a pair of opposite polarity silicon PN junction diodes in parallel and connected between each signal line and a ground reference.
Abstract:
A monolithic integrated circuit structure consisting of interconnected bipolar and CMOS transistor elements forming a buffer circuit. A pair of NPN bipolar transistor elements are interconnected with a pair of N-type MOS transistor elements to form a push-pull output stage providing complementary outputs at the emitters of the bipolar transistor elements. Each of the pair of NPN bipolar transistor elements is arranged in an emitter follower circuit configuration having the conducting channel of one of the pair of N-type MOS transistor elements serially connected to its emitter. The gate electrode of each of the pair of MOS transistor elements respectively is connected to the emitter of the bipolar transistor element to which the conducting channel of the other of the pair of MOS transistor elements is connected. P-type and N-type MOS transistor elements are serially interconnected in a complementary symmetry manner to form an inverter circuit configuration. The complementary interconnected MOS transistor elements have their drains connected together to the base of one of the pair of bipolar transistor elements and their gate electrodes connected together to the base of the other of the pair of bipolar transistor elements, the connected gate electrodes and base forming the buffer circuit input. The collectors of the bipolar transistor elements and the source of the P-type MOS transistor element are connected together to define a positive supply voltage terminal and the sources of the N-type MOS transistor elements are connected together to define a reference potential terminal.