公开(公告)号：US10912196B2

公开(公告)日：2021-02-02

申请号：US16325403

申请日：2017-08-15

Applicant: GE Aviation Systems Limited

Inventor： Alexander James Rainbow

IPC: H05K1/14 ,  H01R12/52 ,  H01R12/73 ,  H05K1/02 ,  H05K3/36 ,  H04M1/02 ,  H05K1/05

Abstract: A power distribution assembly includes a printed circuit board (PCB) having a power input and electrical components connected to PCB conductive trace. A power bus extends from the PCB and has a conductive core, a dielectric layer on an exterior surface of the conductive core, a conductive trace on the dielectric layer, and a power cut through the dielectric layer to the conductive core. The conductive core is connected to the power input by way of the power cut through and the at least one second conductive trace is connected to the PCB conductive trace.

公开(公告)号：US20180372430A1

公开(公告)日：2018-12-27

申请号：US15970399

申请日：2018-05-03

Applicant: GE Aviation Systems Limited

Inventor： Aaron Bland ,  Alexander James Rainbow ,  David Hall Sidgwick ,  Michael James Smith

IPC: F28F21/02 ,  H05K7/20 ,  H05K9/00 ,  C22C1/10

CPC classification number: F28F21/02 ,  B22F2998/10 ,  B64D47/00 ,  B64D2013/0614 ,  C22C1/0416 ,  C22C1/10 ,  C22C1/1026 ,  F28D7/1615 ,  F28D15/02 ,  F28D2021/0021 ,  F28F3/02 ,  F28F21/084 ,  H05K7/20409 ,  H05K7/20545 ,  H05K9/0062 ,  H05K9/0081 ,  B22F3/02 ,  B22F3/20

Abstract: Aspects of the disclosure generally relate to a graphene doped aluminum composite, as well as a method of forming such a composite. Devices for heat dissipation can include such a graphene doped aluminum composite, where the composite can be formed in a process that includes crystallizing aluminum around substantially uniformly dispersed graphene.

公开(公告)号：US11608174B2

公开(公告)日：2023-03-21

申请号：US16995195

申请日：2020-08-17

Applicant: GE Aviation Systems Limited

Inventor： Michael James Smith ,  Alexander James Rainbow

IPC: H05K7/00 ,  H05K7/14 ,  B64D1/00 ,  H05K5/02 ,  H05K7/08

Abstract: A power distribution panel with a backplane, an insulating panel covering the backplane, and at least one electronic component mounted to the insulating panel. A set of feet can be mounted to the insulating panel and configured to absorb stress applied to the insulating panel where the set of feet are located in the same plane as the backplane.

公开(公告)号：US10829677B2

公开(公告)日：2020-11-10

申请号：US15970399

申请日：2018-05-03

Applicant: GE Aviation Systems Limited

Inventor： Aaron Bland ,  Alexander James Rainbow ,  David Hall Sidgwick ,  Michael James Smith

IPC: C09K5/14 ,  C01B32/194 ,  C22C1/10 ,  F28F21/02 ,  F28F21/08 ,  C22C1/04 ,  H01B1/02 ,  B64D47/00 ,  F28D21/00 ,  H05K7/20 ,  F28D7/16 ,  B64D13/06

Abstract: Aspects of the disclosure generally relate to a graphene doped aluminum composite, as well as a method of forming such a composite. Devices for heat dissipation can include such a graphene doped aluminum composite, where the composite can be formed in a process that includes crystallizing aluminum around substantially uniformly dispersed graphene.

公开(公告)号：US20190215961A1

公开(公告)日：2019-07-11

申请号：US16325403

申请日：2017-08-15

Applicant: GE Aviation Systems Limited

Inventor： Alexander James Rainbow

IPC: H05K1/14 ,  H05K1/02 ,  H01R12/52 ,  H01R12/73

CPC classification number: H05K1/144 ,  H01R12/523 ,  H01R12/73 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/0284 ,  H05K1/05 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/048 ,  H05K2201/10053 ,  H05K2201/10166 ,  H05K2201/10272

Abstract: A power distribution assembly includes a printed circuit board (PCB) having a power input and electrical components connected to PCB conductive trace. A power bus extends from the PCB and has a conductive core, a dielectric layer on an exterior surface of the conductive core, a conductive trace on the dielectric layer, and a power cut through the dielectric layer to the conductive core. The conductive core is connected to the power input by way of the power cut through and the at least one second conductive trace is connected to the PCB conductive trace.

公开(公告)号：US20190097331A1

公开(公告)日：2019-03-28

申请号：US16112823

申请日：2018-08-27

Applicant: GE Aviation Systems Limited

Inventor： Michael James Smith ,  Peter James Handy ,  Alexander James Rainbow

IPC: H01R12/57 ,  H01R12/58 ,  H01R43/20 ,  H01R43/02 ,  H05K1/18 ,  H05K3/30

Abstract: A surface mount connector and method of forming a printed circuit board includes providing a printed circuit board having a first aperture extending there through, and receiving a surface mount connector at the printed circuit board, the surface mount connector having a connector body and a flange, the connector body received by and aligned with the first aperture.

公开(公告)号：US20190052081A1

公开(公告)日：2019-02-14

申请号：US16023373

申请日：2018-06-29

Applicant: GE Aviation Systems Limited

Inventor： Alexander James Rainbow ,  Christopher Andrew Leivers ,  Michael James Smith

IPC: H02J3/14 ,  H02J3/38 ,  H01R25/14 ,  B64D31/02

Abstract: A modular power distribution assembly includes a first power module having a power input, a first aperture extending therethrough, and a first bus bar connector at the first aperture and a set of second power modules having a respective power switch, a second aperture extending therethrough, and a second bus bar connector at the aperture, wherein the first power module and the set of second power modules have an attachment interface adapted to physically secure the first power module to the set of second power modules.