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公开(公告)号:US20170292800A1
公开(公告)日:2017-10-12
申请号:US15591076
申请日:2017-05-09
Applicant: GLOBAL HEAT TRANSFER ULC
Inventor: Randy Vanberg , Hamid Reza Zareie Rajani , Seyed Reza Larimi , Morteza Abbasi
CPC classification number: G01F1/05 , F01M5/002 , F01P1/06 , F01P5/06 , F01P11/10 , F01P2025/00 , F24F11/30 , F24F11/52 , F28F19/00 , F28F27/00
Abstract: Embodiments of the disclosure pertain to a monitored heat exchanger system that includes a heat exchanger unit in operable engagement with a heat generating device. The heat exchanger unit has a frame; and at least one cooler coupled with the frame, the at least one cooler having an airflow side and a service fluid side. The system includes a monitoring module coupled to the heat exchanger unit. The monitoring module an at least one sensor coupled with a panel; and at least one controller housing coupled with the panel. A microcontroller is disposed within the controller housing and in operable communication with the at least one sensor. The at least one sensor has a rotating member configured to generate a system signal proportional to an amount of rotation of the rotating member.
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公开(公告)号:US10533814B2
公开(公告)日:2020-01-14
申请号:US15924326
申请日:2018-03-19
Applicant: GLOBAL HEAT TRANSFER ULC
Inventor: Randy Vanberg , Hamid Reza Zareie Rajani , Seyed Reza Larimi , Morteza Abbasi
IPC: F28G15/00 , F28F27/00 , B60K11/08 , F04D19/00 , G06F1/20 , H01L23/467 , F28D21/00 , F28D1/04 , F28D1/02
Abstract: A method for monitoring that includes the steps of: associating a monitoring module with a heat exchanger unit; operating the monitoring module whereby a microcontroller performs various tasks, and ultimately providing an indication; and taking an action based on the indication. The monitoring module includes an at least one sensor proximate to the cooling side. The module also includes a logic circuit having a microcontroller in operable communication with the at least one sensor.
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公开(公告)号:US10520220B2
公开(公告)日:2019-12-31
申请号:US15477100
申请日:2017-04-02
Applicant: GLOBAL HEAT TRANSFER ULC
Inventor: Derek Hjorth , John Gaska , Randy Vanberg , Kevin Visscher , Iqbal Lotey , Bob Peng
IPC: F24H3/06 , E21B43/26 , E21B43/267 , F24F1/0007
Abstract: Embodiments of the disclosure pertain to a heat exchanger unit that includes a frame and at least one cooler. The cooler is associated with a respective side region of the heat exchanger unit, and the cooler has an outer surface and an inner surface. The unit can include a mount assembly for coupling the cooler to the frame. The mount assembly includes an elongated fastening member; a rigid outer ring; a rigid inner ring; and a deformable ring disposed between the rigid outer ring and the inner outer ring. The cooler may have a core end mass greater than a tank end mass.
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公开(公告)号:US10480820B2
公开(公告)日:2019-11-19
申请号:US15477097
申请日:2017-04-02
Applicant: GLOBAL HEAT TRANSFER ULC
Inventor: Derek Hjorth , John Gaska , Randy Vanberg , Kevin Visscher , Iqbal Lotey , Bob Peng
IPC: F24H3/06 , E21B43/26 , E21B43/267 , F24F1/0007
Abstract: Embodiments of the disclosure pertain to a heat exchanger unit that includes a frame and a plurality of coolers coupled therewith. The heat exchanger unit has a reference axis, namely a vertical axis. The frame has a top region, a bottom region, and a plurality of side regions. Each of the plurality of coolers may be coupled with the frame proximate to a respective side region of the plurality of side regions. The heat exchanger unit includes an airflow region therein. The heat exchanger unit includes a first set of baffles, each baffle of the first set of baffles is configured at an angle to the vertical axis.
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公开(公告)号:US10416008B2
公开(公告)日:2019-09-17
申请号:US15616224
申请日:2017-06-07
Applicant: GLOBAL HEAT TRANSFER ULC
Inventor: Randy Vanberg , Hamid Reza Zareie Rajani , Seyed Reza Larimi , Morteza Abbasi
IPC: F01M5/00 , G01F1/05 , F28F27/00 , F28F19/00 , F01P1/06 , F24F11/30 , F24F11/52 , F01P5/06 , F01P11/10
Abstract: Embodiments of the disclosure pertain to a monitored heat exchanger system that includes a heat exchanger unit in operable engagement with a heat generating device. The heat exchanger unit has a frame; and at least one cooler coupled with the frame, the at least one cooler having an airflow side and a service fluid side. The system includes a monitoring module coupled to the heat exchanger unit. The monitoring module an at least one sensor; and at least one controller housing. A microcontroller is disposed within the controller housing and in operable communication with the at least one sensor. The at least one sensor has a rotating member configured to generate a system signal proportional to an amount of rotation of the rotating member.
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公开(公告)号:US20180292109A1
公开(公告)日:2018-10-11
申请号:US16004268
申请日:2018-06-08
Applicant: GLOBAL HEAT TRANSFER ULC
Inventor: Derek Hjorth , John Gaska , Randy Vanberg , Kevin Visscher , Iqbal Lotey , Bob Peng
IPC: F24H3/06 , E21B43/26 , F24F1/00 , E21B43/267
CPC classification number: F24H3/06 , E21B43/26 , E21B43/267 , F24F1/0007
Abstract: A heat exchanger unit that includes a frame and at least one cooler. The unit includes a mount assembly for coupling, at least partially, the cooler to the frame. The mount assembly includes an elongated fastening member; a rigid outer ring; a rigid inner ring; and a deformable ring. The deformable ring is disposed between the rigid outer ring and the rigid inner ring.
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公开(公告)号:US20170292736A1
公开(公告)日:2017-10-12
申请号:US15477100
申请日:2017-04-02
Applicant: GLOBAL HEAT TRANSFER ULC
Inventor: Derek Hjorth , John Gaska , Randy Vanberg , Kevin Visscher , Iqbal Lotey , Bob Peng
Abstract: Embodiments of the disclosure pertain to a heat exchanger unit that includes a frame and at least one cooler. The cooler is associated with a respective side region of the heat exchanger unit, and the cooler has an outer surface and an inner surface. The unit can include a mount assembly for coupling the cooler to the frame. The mount assembly includes an elongated fastening member; a rigid outer ring; a rigid inner ring; and a deformable ring disposed between the rigid outer ring and the inner outer ring. The cooler may have a core end mass greater than a tank end mass.
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公开(公告)号:US10545002B2
公开(公告)日:2020-01-28
申请号:US15591086
申请日:2017-05-09
Applicant: GLOBAL HEAT TRANSFER ULC
Inventor: Randy Vanberg , Hamid Reza Zareie Rajani , Seyed Reza Larimi , Morteza Abbasi
IPC: F28G15/00 , F28F27/00 , B60K11/08 , F04D19/00 , G06F1/20 , H01L23/467 , F28D21/00 , F28D1/04 , F28D1/02
Abstract: Embodiments of the disclosure pertain to a method for monitoring a heat exchanger unit that may include the steps of: coupling the heat exchanger unit with a heat generating device; associating a monitoring module with an airflow side of the heat exchanger unit; operating the monitoring module whereby a microcontroller performs tasks related to providing an indication; and taking an action based on the indication. The monitoring module includes an at least one sensor proximate to the airflow side; a logic circuit in operable communication with the at least one sensor, and further comprising the microcontroller.
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公开(公告)号:US10281169B2
公开(公告)日:2019-05-07
申请号:US16004268
申请日:2018-06-08
Applicant: GLOBAL HEAT TRANSFER ULC
Inventor: Derek Hjorth , John Gaska , Randy Vanberg , Kevin Visscher , Iqbal Lotey , Bob Peng
IPC: F28F9/00 , F28F27/00 , F28F3/08 , F28D1/00 , F24H3/06 , E21B43/26 , E21B43/267 , F24F1/0007
Abstract: A heat exchanger unit that includes a frame and at least one cooler. The unit includes a mount assembly for coupling, at least partially, the cooler to the frame. The mount assembly includes an elongated fastening member; an outer ring; an inner ring; and a deformable ring. The deformable ring is disposed between the outer ring and the inner ring.
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公开(公告)号:US09970720B2
公开(公告)日:2018-05-15
申请号:US15616153
申请日:2017-06-07
Applicant: GLOBAL HEAT TRANSFER ULC
Inventor: Randy Vanberg , Hamid Reza Zareie Rajani , Seyed Reza Larimi , Morteza Abbasi
IPC: F22B37/00 , F28G15/00 , F28F27/00 , H01L23/467 , B60K11/08 , F04D19/00 , G06F1/20 , F28D21/00 , F28D1/04 , F28D1/02
CPC classification number: F28G15/003 , B60K11/08 , F04D19/002 , F04D25/068 , F04D25/166 , F28D1/024 , F28D1/04 , F28D2021/0031 , F28D2021/008 , F28D2021/0091 , F28F27/00 , G06F1/20 , G06F1/206 , H01L23/467
Abstract: Embodiments of the disclosure pertain to a method for monitoring a heat exchanger unit that may include the steps of: associating a monitoring module with an airflow side of the heat exchanger unit; operating the monitoring module whereby a microcontroller performs tasks related to data acquisition, data comparison, and providing an indication; and taking an action based on the indication. The monitoring module includes an at least one sensor proximate to the airflow side; a logic circuit in operable communication with the at least one sensor, and further comprising the microcontroller.
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