Electrode catalyst fine particles, dispersion of the same, and process for producing the dispersion
    11.
    发明授权
    Electrode catalyst fine particles, dispersion of the same, and process for producing the dispersion 失效
    电极催化剂微粒,其分散体,以及分散体的制造方法

    公开(公告)号:US07479469B2

    公开(公告)日:2009-01-20

    申请号:US10966895

    申请日:2004-10-15

    摘要: Provided is a process for producing electrode catalyst fine particles capable of affording formed catalysts such as membranes excellent in uniformity and strength and also employable as catalyst to exhibit high catalytic activity over long periods because fine metal particles are highly distributed on carriers to make particle growth or the like less likely to occur. Electrode catalyst fine particles comprise fine particles which have an average particle diameter of 10 nm to 10 μm and in which fine metal particles are supported on carrier particles, wherein a potential difference (absolute value of (II) minus (I)) between a flow potential (I) of a water dispersion of the fine metal particles at 1 wt % concentration and a pH of 3 to 8 and a flow potential (II) of a water dispersion of the carrier particles at 1 wt % concentration and a pH of 4 to 10, is in the range of 10 to 3000 mV.

    摘要翻译: 提供一种能够提供均匀性和强度优异的成膜催化剂的电极催化剂微粒的制备方法,并且也可用作催化剂,以在长时间内表现出高催化活性,因为金属颗粒高度分布在载体上以使颗粒生长或 似乎不太可能发生。 电极催化剂微粒包含平均粒径为10nm〜10μm的微粒,载体颗粒上负载有金属微粒,其中电流差((II)减(I)的绝对值) 浓度为1重量%,pH为3〜8的细金属颗粒的水分散体的电位(I)和载体颗粒的水分散体的流动电位(II)为1重量%,pH为4 至10,在10至3000mV的范围内。

    Electrode catalyst fine particles, dispersion of the same, and process for producing the dispersion
    12.
    发明申请
    Electrode catalyst fine particles, dispersion of the same, and process for producing the dispersion 失效
    电极催化剂微粒,其分散体,以及分散体的制造方法

    公开(公告)号:US20050085379A1

    公开(公告)日:2005-04-21

    申请号:US10966895

    申请日:2004-10-15

    摘要: Provided is a process for producing electrode catalyst fine particles capable of affording formed catalysts such as membranes excellent in uniformity and strength and also employable as catalyst to exhibit high catalytic activity over long periods because fine metal particles are highly distributed on carriers to make particle growth or the like less likely to occur. Electrode catalyst fine particles comprise fine particles which have an average particle diameter of 10 nm to 10 μm and in which fine metal particles are supported on carrier particles, wherein a potential difference (absolute value of (II) minus (I)) between a flow potential (I) of a water dispersion of the fine metal particles at 1 wt % concentration and a pH of 3 to 8 and a flow potential (II) of a water dispersion of the carrier particles at 1 wt % concentration and a pH of 4 to 10, is in the range of 10 to 3000 mV.

    摘要翻译: 提供一种能够提供均匀性和强度优异的成膜催化剂的电极催化剂微粒的制备方法,并且也可用作催化剂,以在长时间内表现出高催化活性,因为金属颗粒高度分布在载体上以使颗粒生长或 似乎不太可能发生。 电极催化剂微粒包含平均粒径为10nm〜10μm的微粒,载体颗粒上负载有金属微粒,其中电流差((II)减(I)的绝对值) 浓度为1重量%,pH为3〜8的细金属颗粒的水分散体的电位(I)和载体颗粒的水分散体的流动电位(II)为1重量%,pH为4 至10,在10至3000mV的范围内。

    Process for producing integrated circuit, and substrate with integrated circuit
    16.
    发明授权
    Process for producing integrated circuit, and substrate with integrated circuit 有权
    集成电路生产工艺,集成电路基板

    公开(公告)号:US07163892B2

    公开(公告)日:2007-01-16

    申请号:US10275087

    申请日:2001-04-23

    CPC分类号: H01L21/76877 H01L21/288

    摘要: There is provided a process for producing an integrated circuit, wherein not only can conductive fine particles be deposited efficiently and densely in minute wiring channels and connecting holes but also a circuit of low wiring resistance and high density can be formed and wherein a high-degree integration can be achieved to thereby bring about an economic advantage. In particular, there is provided a process for producing an integrated circuit, comprising coating a substrate provided with wiring channels with a coating liquid for integrated circuit formation containing conductive fine particles to thereby form an integrated circuit on the substrate, wherein the coating liquid for integrated circuit formation while being exposed to ultrasonic waves is applied to the wiring channels.

    摘要翻译: 提供了一种用于制造集成电路的方法,其中不仅可以在微小的布线通道和连接孔中有效且致密地沉积导电细颗粒,而且可以形成低布线电阻和高密度的电路,其中高度 可以实现一体化,从而带来经济优势。 具体地说,提供了一种集成电路的制造方法,其特征在于,在具有布线通道的基板上涂布含有导电性微粒的集成电路形成用涂布液,从而在基板上形成集成电路,其特征在于, 暴露于超声波的电路形成被施加到布线通道。

    Coating liquid for forming transparent conductive coating
    20.
    发明授权
    Coating liquid for forming transparent conductive coating 失效
    用于形成透明导电涂层的涂布液

    公开(公告)号:US06136228A

    公开(公告)日:2000-10-24

    申请号:US937937

    申请日:1997-09-25

    摘要: A coating liquid for forming a transparent conductive coating, comprising fine particles of a composite metal having an average particle size of 1 to 200 nm and a polar solvent. The above composite metal particles are preferably composed of an alloy of a plurality of metals or comprise fine metal particles or the fine alloy particles covered by a metal having a standard hydrogen electrode potential higher than that of the metal or alloy metal.A substrate with transparent conductive coating comprising a transparent conductive fine particle layer including the composite metal particles and a transparent coating disposed on the transparent conductive fine particle layer.A display device comprising a front panel composed of the above substrate with transparent conductive coating, the transparent conductive coating being formed at an outer surface of the front panel.The above coating liquid enables providing the transparent conductive coating which favorably has low surface resistivity and is excellent in antistatic, anti-reflection and electromagnetic shielding properties and also in reliability, and also enables providing the substrate clad with the transparent conductive coating and the display device having the above substrate.

    摘要翻译: 一种用于形成透明导电涂层的涂布液,其包含平均粒度为1〜200nm的复合金属微粒和极性溶剂。 上述复合金属颗粒优选由多种金属的合金构成,或者由金属微粒或金属覆盖的微细合金颗粒构成,该金属具有高于金属或合金金属的标准氢电极电位。 一种具有透明导电性涂层的基板,其具有由透明导电性微粒层构成的透明导电性微粒层,该透明​​导电性微粒层包含复合金属粒子和设置在透明导电性微粒子层上的透明涂层。 一种显示装置,包括由具有透明导电涂层的上述基板构成的前面板,所述透明导电涂层形成在所述前面板的外表面处。 上述涂布液能够提供有利地具有低表面电阻率并且抗静电,抗反射和电磁屏蔽性能以及可靠性优异的透明导电涂层,并且还能够使包覆透明导电涂层和显示装置的基板 具有上述基材。