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    Component vertical mounting
    11.
    发明授权
    Component vertical mounting 有权

    公开(公告)号：US11445603B2

    公开(公告)日：2022-09-13

    申请号：US16224023

    申请日：2018-12-18

    Applicant: Hamilton Sundstrand Corporation

    Inventor： David Perley ,  Kenneth J. Trotman

    IPC: H05K1/02 ,  H01L23/367 ,  H01L23/42 ,  H05K3/30 ,  H05K7/02 ,  H01L23/34 ,  H05K13/04

    Abstract: A circuit component arrangement includes a base and a plurality of circuit components mounted to the base. A bonding agent adheres the circuit components in intimate contact to the base. The bonding agent is disposed in a respective open channel defined in an outward facing surface of the base in contact with each of the circuit components. A method of assembling a circuit component arrangement includes temporarily fastening a plurality of circuit components to a base. A bonding agent is injected into a respective open channel defined in the base to adhere each of the plurality of circuit components to the base. The plurality of circuit components are unfastened from the base. Injecting a bonding agent can include ceasing injection of bonding agent upon appearance of bonding agent in a window opening in fluid communication with the open channel.

    Electronic component cooling hood and heat pipe
    12.
    发明授权
    Electronic component cooling hood and heat pipe 有权
    电子部件冷却罩和热管

    公开(公告)号：US09013879B2

    公开(公告)日：2015-04-21

    申请号：US13693494

    申请日：2012-12-04

    Applicant: Hamilton Sundstrand Corporation

    Inventor： Rachel Farner ,  Kenneth J. Trotman ,  Jay W. Kokas ,  Kerry R. Querns

    IPC: H05K7/20 ,  H01L23/473

    CPC classification number: H05K7/20336 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An electronic component and cooling system has a printed wiring board, which is planar. An electrical component is mounted on one side of the planar surface of the printed wiring board. A hood is positioned outwardly of the electronic component. Legs on the hood extend to the printed wiring board, and form an inner surface that is positioned away from the one side relative to the electrical component. A chassis has posts connected to the printed wiring board and on an opposed side of the planar surface of the printed wiring board from the electrical component. The chassis extends to a remote portion, beyond the printed wiring board. A heat pipe is generally elongate and positioned on an opposed side of the hood from the electrical component. The heat pipe extends to the remote portion of the chassis to transfer heat from the hood to the chassis.

    Abstract translation: 电子部件和冷却系统具有平面的印刷电路板。 电气部件安装在印刷电路板的平面的一侧。 罩子位于电子部件的外侧。 发动机罩上的脚部延伸到印刷电路板，并形成相对于电气部件远离一侧的内表面。 机架具有从电气部件连接到印刷线路板并且在印刷线路板的平坦表面的相对侧上的柱。 机箱延伸到远离印刷电路板的远端部分。 热管通常是细长的，并且位于罩的与电气部件相对的一侧。 热管延伸到机箱的远程部分，以将热量从罩传递到底盘。

    HEAT PIPE EMBEDDED HEAT SINK WITH INTEGRATED POSTS
    15.
    发明申请
    HEAT PIPE EMBEDDED HEAT SINK WITH INTEGRATED POSTS 审中-公开
    热管嵌入式散热器与集成位置

    公开(公告)号：US20170042017A1

    公开(公告)日：2017-02-09

    申请号：US13932671

    申请日：2013-07-01

    Applicant: Hamilton Sundstrand Corporation

    Inventor： Jay W. Kokas ,  Kenneth J. Trotman ,  Kerry R. Querns ,  Rachel Farner

    IPC: H05K1/02

    Abstract: An apparatus includes a heat sink and a post that supports the heat sink that is monolithically formed with the heat sink. The apparatus can further include a printed wiring board attached to a top side of the heat sink with electronic components attached to the printed wiring board, a plurality of posts integrated into a bottom side of the heat sink and extending outwards from the heat sink, wherein the heat sink and the plurality of posts are monolithically formed, and a heat pipe attached to the bottom side of the heat sink with a first end near an electronic component and a second end near one of the plurality of posts.

    Abstract translation: 一种装置包括散热器和支撑散热片的支柱，该散热片与散热片整体形成。 该装置还可以包括附接到散热器的顶侧的印刷线路板，电子部件附接到印刷线路板，多个柱集成到散热器的底侧并从散热器向外延伸，其中 散热器和多个柱体是单片形成的，并且一个热管附接到散热器的底侧，第一端靠近电子部件，第二端靠近多个柱之一。

    Chassis with thermal transfer fluid path
    18.
    发明授权
    Chassis with thermal transfer fluid path 有权

    公开(公告)号：US11672106B2

    公开(公告)日：2023-06-06

    申请号：US17360839

    申请日：2021-06-28

    Applicant: Hamilton Sundstrand Corporation

    Inventor： Jason C. Duffy ,  Kenneth J. Trotman

    IPC: H05K7/20 ,  B64D37/34 ,  H05K5/02

    CPC classification number: H05K7/20872 ,  B64D37/34 ,  H05K7/20272 ,  H05K5/0291 ,  H05K7/20636

    Abstract: A chassis includes top rails extending along a top side of the chassis, bottom rails extending along a bottom side of the chassis, a fluid inlet connected to the chassis that is configured to receive a thermal transfer fluid, and a fluid outlet connected to the chassis that is configured to discharge the thermal transfer fluid. The chassis further includes a thermal transfer fluid path extending between and fluidly coupled to the fluid inlet and the fluid outlet, wherein the thermal transfer fluid is configured to flow through the thermal transfer fluid path, and wherein the thermal transfer fluid path extends in a serpentine pattern through at least one of the top rails and through at least one of the bottom rails.

    Methods of protecting vent/drain features in electronic assemblies
    19.
    发明授权
    Methods of protecting vent/drain features in electronic assemblies 有权

    公开(公告)号：US11606871B2

    公开(公告)日：2023-03-14

    申请号：US17213095

    申请日：2021-03-25

    Applicant: Hamilton Sundstrand Corporation

    Inventor： Kenneth J. Trotman ,  Rachel Welsh

    IPC: H05K5/02 ,  F16K24/04

    Abstract: A vent/drain cover for an electronics enclosure includes a cover body defining an axis and a surface with a first wall protruding from the surface in a direction and a second wall protruding from the surface in the same direction but displaced radially from the first wall. The first wall has a first channel formed therein that is defined by a portion of the first wall that does not extend as far from the surface as the balance of the first wall. The second wall has a second channel defined by a portion of the second wall that does not extend as far from the surface as the balance of the second wall, the first channel being circumferentially offset from the second channel. Electronics enclosures and methods of venting electronics assemblies are also described.

    Vent/drain covers, vented/drained enclosures, and methods of protecting vent/drain features in electronic assemblies
    20.
    发明授权
    Vent/drain covers, vented/drained enclosures, and methods of protecting vent/drain features in electronic assemblies 有权

    公开(公告)号：US10986742B2

    公开(公告)日：2021-04-20

    申请号：US15823262

    申请日：2017-11-27

    Applicant: Hamilton Sundstrand Corporation

    Inventor： Kenneth J. Trotman ,  Rachel Welsh

    IPC: H05H5/03 ,  H05K5/02 ,  F16K24/04

    Abstract: A vent/drain cover for an electronics enclosure includes a cover body defining an axis and a surface with a first wall protruding from the surface in a direction and a second wall protruding from the surface in the same direction but displaced radially from the first wall. The first wall has a first channel formed therein that is defined by a portion of the first wall that does not extend as far from the surface as the balance of the first wall. The second wall has a second channel defined by a portion of the second wall that does not extend as far from the surface as the balance of the second wall, the first channel being circumferentially offset from the second channel. Electronics enclosures and methods of venting electronics assemblies are also described.

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