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公开(公告)号：US20210039383A1
公开(公告)日：2021-02-11
申请号：US16965703
申请日：2018-03-12
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Eric Martin , Tsuyoshi Yamashita , James R. Przybyla
IPC: B41J2/045
Abstract: In one example in accordance with the present disclosure, a fluidic die is described. The fluidic die includes an array of fluid actuators grouped into primitives. Each actuator is disposed in a fluid chamber. The fluidic die also includes an array of fluid sensors. Each fluid sensor is disposed within a fluid chamber and determines a characteristic within the fluid chamber. A data parser of the fluidic die extracts from an incoming signal, firing instructions and measurement instructions for the fluidic die. The measurement instructions indicate at least one of a peak measurement during a nucleation event and a reference measurement during a non-nucleation event. A firing controller generates firing signals based on the firing instructions and a measurement controller activates, during a measurement interval of a printing cycle for the primitive, a measurement for a selected actuator based on the measurement instructions.
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公开(公告)号：US20210016565A1
公开(公告)日：2021-01-21
申请号：US16970470
申请日：2018-04-06
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Eric T. Martin , Daryl E. Anderson , James R. Przybyla
Abstract: In some examples, a system includes a device support to receive a fluid dispensing device, and a controller to identify, based on data controlling activation of fluidic actuators, a fluidic actuator that is to be activated in a first activation cycle of a group of activation cycles that correspond to activation intervals of respective fluidic actuators of a group of fluidic actuators of the fluid dispensing device, the identified fluidic actuator being part of the group of fluidic actuators. To perform a sense measurement for the identified fluidic actuator, the controller suppresses activation of the identified fluidic actuator in the first activation cycle, and causes activation of the identified fluidic actuator in a sense measurement cycle different from the first activation cycle, the sense measurement cycle being part of the group of activation cycles.
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公开(公告)号：US20190255842A1
公开(公告)日：2019-08-22
申请号：US16400071
申请日：2019-05-01
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Eric T. Martin , Chris Bakker , James R. Przybyla
Abstract: In some examples, a circuit for a fluid ejection device includes an energy delivery device and a circuit layer. The circuit layer includes first and second activation devices connected to the energy delivery device, the first and second activation devices to activate the energy delivery device, first drive logic coupled to the first activation device, and second drive logic coupled to the second activation device. An interconnect layer couples a same address selection signal to the first drive logic and the second drive logic.
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公开(公告)号：US20150340331A1
公开(公告)日：2015-11-26
申请号：US14818922
申请日：2015-08-05
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Lawrence H. White , Robert Vina , Terry Mcmahon , James R. Przybyla
IPC: H01L23/00
CPC classification number: H01L23/49822 , H01L21/76838 , H01L24/03 , H01L24/05 , H01L2224/0235 , H01L2224/02381 , H01L2224/0239 , H01L2224/024 , H01L2224/05013 , H01L2224/05024 , H01L2224/05092 , H01L2224/05553 , H01L2224/45124 , H01L2924/00014 , H01L2924/01013 , H01L2924/01014 , H01L2924/01073 , H01L2924/01079 , H01L2924/04642 , H01L2924/05042 , H01L2924/0534 , H01L2924/05432 , H01L2924/05442 , H01L2924/059 , H01L2924/05994 , H01L2924/1461 , H01L2924/01029 , H01L2924/00 , H01L2224/48
Abstract: A semiconductor device can include a substrate and a trace layer positioned in proximity to the substrate and including a trace for supplying an electrical connection to the semiconductor device. Conductive layers can be positioned in proximity to the trace layer and form a bond pad. A non-conductive thin film layer can be positioned between the trace layer and the conductive layers. The thin film layer can include a via to enable the electrical connection from the trace to the bond pad. A portion of the trace between the substrate and the plurality of conductive layers can have a beveled edge.
Abstract translation: 半导体器件可以包括基板和位于基板附近的迹线层，并且包括用于向半导体器件提供电连接的迹线。 导电层可以位于跟踪层附近并形成接合焊盘。 非导电薄膜层可以位于迹线层和导电层之间。 薄膜层可以包括通孔以使得能够从迹线到接合焊盘的电连接。 衬底和多个导电层之间的迹线的一部分可以具有斜边。
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公开(公告)号：US20230382109A1
公开(公告)日：2023-11-30
申请号：US18032797
申请日：2020-10-23
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Eric T. Martin , James R. Przybyla , Garrett E. Clark
CPC classification number: B41J2/1404 , B41J2/145 , B41J2202/12 , B41J2202/13
Abstract: In some examples, a fluidic die includes an arrangement of fluidic elements to dispense a fluid, where each fluidic element of the fluidic elements includes a fluidic actuator and a fluid chamber. The fluidic die includes an array of fluid feed holes in a plurality of dimensions to communicate the fluid with the fluidic elements, where each of multiple fluid feed holes along a first dimension of the plurality of dimensions is distinct from multiple fluid feed holes along a second dimension of the plurality of dimensions. The fluidic die includes circuit elements interspersed in regions between the fluidic elements along different axes of the fluidic die, where each circuit element of the circuit elements includes an active device. The fluidic elements and the circuit elements are formed on a common substrate.
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Patent Agency Ranking
公开(公告)号：US11712896B2
公开(公告)日：2023-08-01
申请号：US17713200
申请日：2022-04-04
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Galen Cook , Garrett E. Clark , Michael W. Cumbie , James R. Przybyla , Richard Seaver , Frank D. Derryberry , Si-Iam J. Choy
CPC classification number: B41J2/145 , B41J2/14427 , B41J2/14145 , B41J2002/14459 , B41J2202/12 , B41J2202/20
Abstract: Examples include a fluid ejection device. The fluid ejection device includes a fluid ejection die with a die length and a die width, the fluid ejection die being coupled with a support structure having a fluid supply channel therethrough. The fluid ejection die includes a plurality of nozzles arranged in columns at die length positions along the die length and die width positions along the die width such that only one nozzle is positioned at each die length position. A fluid ejection chamber is coupled with each respective nozzle of the plurality of nozzles, and fluid feed hole fluidically coupled with the fluid supply channel and each respective ejection chamber.
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公开(公告)号：US20230234355A1
公开(公告)日：2023-07-27
申请号：US18127619
申请日：2023-03-28
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Galen Cook , Garrett E. Clark , Michael W. Cumbie , James R. Przybyla , Richard Seaver , Frank D. Derryberry , Si-lam J. Choy
CPC classification number: B41J2/145 , B41J2/14 , B41J2002/14459 , B41J2202/12 , B41J2202/20
Abstract: In some examples, a fluid ejection die includes a plurality of nozzles arranged in a plurality of nozzle columns, the plurality of nozzle columns distributed across a width of the fluid ejection die in a staggered manner, wherein nozzles of each respective nozzle column of the plurality of nozzle columns are spaced apart along a length of the fluid ejection die, wherein the plurality of nozzle columns includes a first pair of neighboring nozzle columns that are spaced by a first distance across the width. The plurality of nozzle columns includes a second pair of neighboring nozzle columns that are spaced by a second distance across the width, the second distance being larger than the first distance.
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公开(公告)号：US20220227131A1
公开(公告)日：2022-07-21
申请号：US17713200
申请日：2022-04-04
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Galen Cook , Garrett E. Clark , Michael W. Cumbie , James R. Przybyla , Richard Seaver , Frank D. Derryberry , Si-Iam J. Choy
Abstract: Examples include a fluid ejection device. The fluid ejection device includes a fluid ejection die with a die length and a die width, the fluid ejection die being coupled with a support structure having a fluid supply channel therethrough. The fluid ejection die includes a plurality of nozzles arranged in columns at die length positions along the die length and die width positions along the die width such that only one nozzle is positioned at each die length position. A fluid ejection chamber is coupled with each respective nozzle of the plurality of nozzles, and fluid feed hole fluidically coupled with the fluid supply channel and each respective ejection chamber.
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公开(公告)号：US10449762B2
公开(公告)日：2019-10-22
申请号：US15748301
申请日：2015-10-30
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： James R. Przybyla , Zhizhang Chen
Abstract: According to an example, a fluid ejection device may include a substrate, a resistor positioned on the substrate, an overcoat layer positioned over the resistor, a fluidics layer having surfaces that form a firing chamber about the resistor, in which the overcoat layer is positioned between the resistor and the firing chamber, and a thin film membrane covering the surfaces of the fluidics layer that form the firing chamber and a portion of the overcoat layer that is in the firing chamber.
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公开(公告)号：US20180290459A1
公开(公告)日：2018-10-11
申请号：US15570691
申请日：2015-07-14
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Kianoush Naeli , James R. Przybyla
Abstract: A check valve for preventing reverse flow of jettable material within a jettable material firing chamber during a firing event includes a free-floating plug. The check valve further includes at least one holding post, wherein the free-floating plug is arranged between at least one wail of the firing chamber and the holding posts, the at least one wall and the holding posts restricting the movement of the free-floating plug within the chamber.
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