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    Integrated circuit
    12.
    外观设计
    Integrated circuit 有权

    公开(公告)号：USD1022931S1

    公开(公告)日：2024-04-16

    申请号：US29801988

    申请日：2021-08-02

    Applicant: Hewlett-Packard Development Company, L.P.

    Designer： Vignesh Kannan ,  Joshua M. Yu ,  Matthew David Smith ,  Jeffrey A. Nielsen ,  Kenneth Duda

    Abstract: FIG. 1 is perspective view, taken from a front, lower-right elevation of a sensing and dispensing integrated circuit;
    FIG. 2 is a front plan view of the sensing and dispensing integrated circuit shown in FIG. 1;
    FIG. 3 is a back plan view of the sensing and dispensing integrated circuit shown in FIG. 1;
    FIG. 4 is a right side plan view of the sensing and dispensing integrated circuit shown in FIG. 1;
    FIG. 5 is a left side plan view of the sensing and dispensing integrated circuit shown in FIG. 1;
    FIG. 6 is a top plan view of the sensing and dispensing integrated circuit shown in FIG. 1; and,
    FIG. 7 is a bottom plan view of the sensing and dispensing integrated circuit shown in FIG. 1.
    Broken lines shown in the drawings represent portions of the integrated flex circuit that form no part of the claimed design.

    FLUIDIC EJECTION CONTROLLERS WITH SELECTIVELY REMOVABLE EJECTION BOARDS
    16.
    发明申请
    FLUIDIC EJECTION CONTROLLERS WITH SELECTIVELY REMOVABLE EJECTION BOARDS 审中-公开

    公开(公告)号：US20200282725A1

    公开(公告)日：2020-09-10

    申请号：US16765795

    申请日：2017-12-15

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Matthew David Smith ,  Dennis R. Esterberg ,  Jeffrey A. Nielsen

    IPC: B41J2/14

    Abstract: In one example in accordance with the present disclosure, a fluidic ejection controller is described. The fluidic ejection controller includes a firing board to pass electrical control signals for ejecting fluid from a fluidic ejection device. An ejection board of the fluidic ejection controller is electrically coupled to, and selectively removable from, the firing board to pass the electrical control signals to the fluidic ejection device. Electrical pins are disposed on the ejection board in a pattern that matches a pattern of electrical pads on the fluidic ejection device. The electrical pins interface with corresponding electrical pads to pass the electrical control signals from the ejection board to the fluidic ejection device.

    Voltage upconverter
    19.
    发明授权
    Voltage upconverter 有权

    公开(公告)号：US11369956B2

    公开(公告)日：2022-06-28

    申请号：US15546483

    申请日：2015-01-30

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： Manish Giri ,  Melinda M. Valencia ,  Matthew David Smith ,  Sirena Lu ,  Joshua M Yu ,  Sadig Bengali

    IPC: B01L3/00 ,  H02M3/155 ,  H02J1/00 ,  H02M3/156 ,  H02J1/08

    Abstract: A system may comprise a voltage upconverter, a universal serial bus (USB) connector to receive an input voltage from a USB port on a computing device, and a microfluidic diagnostic chip communication link to electrically couple the voltage upconverter to a microfluidic diagnostic chip wherein the voltage upconverter is to convert the input voltage to be received by the USB connector to an output voltage sufficient to drive a pump on the microfluidic diagnostic chip. A diagnostic system may comprise a microfluidic diagnostic chip comprising a pump and a voltage upconverter to receive an input voltage from a universal serial bus (USB) port of a computing device and to convert the input voltage into an output voltage that powers activation of the pump.

    FLUID EJECTION WITH EJECTION ADJUSTMENTS
    20.
    发明申请
    FLUID EJECTION WITH EJECTION ADJUSTMENTS 有权

    公开(公告)号：US20220194078A1

    公开(公告)日：2022-06-23

    申请号：US17603475

    申请日：2019-09-30

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Jeffrey A. Nielsen ,  Matthew David Smith ,  Roberto A. Pugliese

    IPC: B41J2/045

    Abstract: In one example in accordance with the present disclosure, a fluid ejection system is described. The fluid ejection system includes a frame to retain a number of fluid ejection devices. Each fluid ejection device includes a reservoir disposed on a first side of the frame and a fluid ejection die disposed on an opposite side of the frame. Each fluid ejection die includes 1) a fluid feed slot formed in a substrate to receive fluid from the reservoir, 2) an array of nozzles formed in the substrate to eject fluid, and 3) an ejection adjustment system to selectively adjust an amount of fluid ejected from the fluid ejection devices.

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