Fluidic dies
    6.
    发明授权

    公开(公告)号:US11325385B2

    公开(公告)日:2022-05-10

    申请号:US16640563

    申请日:2017-10-19

    Abstract: A fluidic die may include a fluid channel layer defining a number of fluid channels therein, a slot layer disposed on a side of the fluid channel layer, and a first fluid slot and a second fluid slot defined in the slot layer. At least one of the fluid channels fluidically couples the first fluid slot to the second fluid slot. The first fluid slot and the second fluid slot are defined in the slot layer along a length of the fluidic die.

    Microfluidic chips
    7.
    发明授权

    公开(公告)号:US11179720B2

    公开(公告)日:2021-11-23

    申请号:US16319702

    申请日:2016-10-07

    Abstract: The present disclosure is drawn to microfluidic chips. The microfluidic chips can include an inflexible material having an elastic modulus of 0.1 gigapascals (GPa) to 450 GPa. A microfluidic channel can be formed within the inflexible material and can connect an inlet and an outlet. A working electrode can be associated with the microfluidic channel and can have a surface area of 1 μm2 to 60,000 μm2 within the microfluidic channel. A bubble support structure can also be formed within the microfluidic channel such that the working electrode is positioned to electrolytically generate a bubble that becomes associated with the bubble support structure.

    FLUIDIC DIES
    10.
    发明申请
    FLUIDIC DIES 审中-公开

    公开(公告)号:US20200238708A1

    公开(公告)日:2020-07-30

    申请号:US16640563

    申请日:2017-10-19

    Abstract: A fluidic die may include a fluid channel layer defining a number of fluid channels therein, a slot layer disposed on a side of the fluid channel layer, and a first fluid slot and a second fluid slot defined in the slot layer. At least one of the fluid channels fluidically couples the first fluid slot to the second fluid slot. The first fluid slot and the second fluid slot are defined in the slot layer along a length of the fluidic die.

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